{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,5,18]],"date-time":"2026-05-18T17:22:49Z","timestamp":1779124969040,"version":"3.51.4"},"reference-count":15,"publisher":"MDPI AG","issue":"10","license":[{"start":{"date-parts":[[2016,9,26]],"date-time":"2016-09-26T00:00:00Z","timestamp":1474848000000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/creativecommons.org\/licenses\/by\/4.0\/"}],"funder":[{"name":"Natural Science Basic Research Plan in Shaanxi Province of China","award":["2016JQ5088"],"award-info":[{"award-number":["2016JQ5088"]}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["Sensors"],"abstract":"<jats:p>In order to meet the requirements of cable fault detection, a new structure of piezoelectric accelerometer was designed and analyzed in detail. The structure was composed of a seismic mass, two sensitive beams, and two added beams. Then, simulations including the maximum stress, natural frequency, and output voltage were carried out. Moreover, comparisons with traditional structures of piezoelectric accelerometer were made. To verify which vibration mode is the dominant one on the acceleration and the space between the mass and glass, mode analysis and deflection analysis were carried out. Fabricated on an n-type single crystal silicon wafer, the sensor chips were wire-bonged to printed circuit boards (PCBs) and simply packaged for experiments. Finally, a vibration test was conducted. The results show that the proposed piezoelectric accelerometer has high sensitivity, low resonance frequency, and low transverse effect.<\/jats:p>","DOI":"10.3390\/s16101587","type":"journal-article","created":{"date-parts":[[2016,9,26]],"date-time":"2016-09-26T10:02:44Z","timestamp":1474884164000},"page":"1587","update-policy":"https:\/\/doi.org\/10.3390\/mdpi_crossmark_policy","source":"Crossref","is-referenced-by-count":57,"title":["Design of a Piezoelectric Accelerometer with High Sensitivity and Low Transverse Effect"],"prefix":"10.3390","volume":"16","author":[{"given":"Bian","family":"Tian","sequence":"first","affiliation":[{"name":"State Key Laboratory for Mechanical Manufacturing Systems Egineering, Xi\u2019an Jiaotong University, Xi\u2019an 710049, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Hanyue","family":"Liu","sequence":"additional","affiliation":[{"name":"State Key Laboratory for Mechanical Manufacturing Systems Egineering, Xi\u2019an Jiaotong University, Xi\u2019an 710049, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Ning","family":"Yang","sequence":"additional","affiliation":[{"name":"State Key Laboratory for Mechanical Manufacturing Systems Egineering, Xi\u2019an Jiaotong University, Xi\u2019an 710049, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Yulong","family":"Zhao","sequence":"additional","affiliation":[{"name":"State Key Laboratory for Mechanical Manufacturing Systems Egineering, Xi\u2019an Jiaotong University, Xi\u2019an 710049, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Zhuangde","family":"Jiang","sequence":"additional","affiliation":[{"name":"State Key Laboratory for Mechanical Manufacturing Systems Egineering, Xi\u2019an Jiaotong University, Xi\u2019an 710049, China"}],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"1968","published-online":{"date-parts":[[2016,9,26]]},"reference":[{"key":"ref_1","unstructured":"Sarracino, M. 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Insul."}],"container-title":["Sensors"],"original-title":[],"language":"en","link":[{"URL":"https:\/\/www.mdpi.com\/1424-8220\/16\/10\/1587\/pdf","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2025,10,11]],"date-time":"2025-10-11T19:31:46Z","timestamp":1760211106000},"score":1,"resource":{"primary":{"URL":"https:\/\/www.mdpi.com\/1424-8220\/16\/10\/1587"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2016,9,26]]},"references-count":15,"journal-issue":{"issue":"10","published-online":{"date-parts":[[2016,10]]}},"alternative-id":["s16101587"],"URL":"https:\/\/doi.org\/10.3390\/s16101587","relation":{},"ISSN":["1424-8220"],"issn-type":[{"value":"1424-8220","type":"electronic"}],"subject":[],"published":{"date-parts":[[2016,9,26]]}}}