{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,4,1]],"date-time":"2026-04-01T22:50:31Z","timestamp":1775083831769,"version":"3.50.1"},"reference-count":33,"publisher":"MDPI AG","issue":"1","license":[{"start":{"date-parts":[[2017,1,18]],"date-time":"2017-01-18T00:00:00Z","timestamp":1484697600000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/creativecommons.org\/licenses\/by\/4.0\/"}],"funder":[{"name":"Funds for Creative Research Groups of China","award":["Grant No. 51421004"],"award-info":[{"award-number":["Grant No. 51421004"]}]},{"name":"The National Science Funds for Distinguished Young Scholars","award":["Grant No. 51325503"],"award-info":[{"award-number":["Grant No. 51325503"]}]},{"name":"HK Science Foundation","award":["Grant No. 20150870003"],"award-info":[{"award-number":["Grant No. 20150870003"]}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["Sensors"],"abstract":"<jats:p>Presented in this paper is a high-performance resonant accelerometer with low cross-interference, low temperature drift and digital output. The sensor consists of two quartz double-ended tuning forks (DETFs) and a silicon substrate. A new differential silicon substrate is proposed to reduce the temperature drift and cross-interference from the undesirable direction significantly. The natural frequency of the quartz DETF is theoretically calculated, and then the axial stress on the vibration beams is verified through finite element method (FEM) under a 100 g acceleration which is loaded on x-axis, y-axis and z-axis, respectively. Moreover, sensor chip is wire-bonded to a printed circuit board (PCB) which contains two identical oscillating circuits. In addition, a steel shell is selected to package the sensor for experiments. Benefiting from the distinctive configuration of the differential structure, the accelerometer characteristics such as temperature drift and cross-interface are improved. The experimental results demonstrate that the cross-interference is lower than 0.03% and the temperature drift is about 18.16 ppm\/\u00b0C.<\/jats:p>","DOI":"10.3390\/s17010178","type":"journal-article","created":{"date-parts":[[2017,1,18]],"date-time":"2017-01-18T10:00:47Z","timestamp":1484733647000},"page":"178","update-policy":"https:\/\/doi.org\/10.3390\/mdpi_crossmark_policy","source":"Crossref","is-referenced-by-count":24,"title":["A Differential Resonant Accelerometer with Low Cross-Interference and Temperature Drift"],"prefix":"10.3390","volume":"17","author":[{"given":"Bo","family":"Li","sequence":"first","affiliation":[{"name":"State Key Laboratory for Manufacturing System Engineering, Xi\u2019an Jiaotong University, Xi\u2019an 710049, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Yulong","family":"Zhao","sequence":"additional","affiliation":[{"name":"State Key Laboratory for Manufacturing System Engineering, Xi\u2019an Jiaotong University, Xi\u2019an 710049, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Cun","family":"Li","sequence":"additional","affiliation":[{"name":"State Key Laboratory for Manufacturing System Engineering, Xi\u2019an Jiaotong University, Xi\u2019an 710049, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Rongjun","family":"Cheng","sequence":"additional","affiliation":[{"name":"State Key Laboratory for Manufacturing System Engineering, Xi\u2019an Jiaotong University, Xi\u2019an 710049, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Dengqiang","family":"Sun","sequence":"additional","affiliation":[{"name":"State Key Laboratory for Manufacturing System Engineering, Xi\u2019an Jiaotong University, Xi\u2019an 710049, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Songli","family":"Wang","sequence":"additional","affiliation":[{"name":"Aviation Key Laboratory of Science and Technology on Inertia, Flight Automatic Control Research Institute, Xi\u2019an 710065, China"}],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"1968","published-online":{"date-parts":[[2017,1,18]]},"reference":[{"key":"ref_1","doi-asserted-by":"crossref","first-page":"303","DOI":"10.1016\/0924-4247(90)85060-H","article-title":"A review of low-cost accelerometers for vehicle dynamics","volume":"21","author":"Macdonald","year":"1990","journal-title":"Sens. Actuators A"},{"key":"ref_2","doi-asserted-by":"crossref","first-page":"325","DOI":"10.1016\/j.sna.2005.12.034","article-title":"Piezoresistive sensing with twin-beam structures in standard mems foundry processes","volume":"127","author":"Bahreyni","year":"2006","journal-title":"Sens. Actuators A"},{"key":"ref_3","doi-asserted-by":"crossref","first-page":"1640","DOI":"10.1109\/5.704269","article-title":"Micromachined inertial sensors","volume":"86","author":"Yazdi","year":"1998","journal-title":"Proc. IEEE"},{"key":"ref_4","doi-asserted-by":"crossref","first-page":"263","DOI":"10.1016\/S0167-9317(99)00447-5","article-title":"A micromachined piezoresistive accelerometer with high sensitivity: Design and modelling","volume":"49","author":"Lim","year":"1999","journal-title":"J. Microelectron. Eng."},{"key":"ref_5","doi-asserted-by":"crossref","first-page":"70","DOI":"10.1016\/j.sna.2008.03.016","article-title":"Design and fabrication of a new miniaturized capacitive accelerometer","volume":"147","author":"Liu","year":"2008","journal-title":"Sens. Actuators A"},{"key":"ref_6","doi-asserted-by":"crossref","first-page":"784","DOI":"10.1109\/JMEMS.2002.805207","article-title":"A vacuum packaged surface micromachined resonant accelerometer","volume":"11","author":"Seshia","year":"2002","journal-title":"J. Microelectromech. Syst."},{"key":"ref_7","doi-asserted-by":"crossref","first-page":"332","DOI":"10.1109\/7361.983473","article-title":"Inertial sensor technology trends","volume":"1","author":"Barbour","year":"2001","journal-title":"IEEE Sens. J."},{"key":"ref_8","doi-asserted-by":"crossref","first-page":"258","DOI":"10.1016\/j.sna.2005.03.067","article-title":"Silicon resonant accelerometer with electronic compensation of input-output cross-talk","volume":"123\u2013124","author":"Ferrari","year":"2005","journal-title":"Sens. Actuators A"},{"key":"ref_9","doi-asserted-by":"crossref","first-page":"1140","DOI":"10.1109\/JMEMS.2010.2067437","article-title":"A resonant microaccelerometer with high sensitivity operating in an oscillating circuit","volume":"19","author":"Comi","year":"2010","journal-title":"J. Microelectromech. Syst."},{"key":"ref_10","doi-asserted-by":"crossref","unstructured":"Tocchio, A., Caspani, A., Langfelder, G., Longoni, A., and Lasalandra, E. (2011, January 28\u201331). Resolution and start-up dynamics of mems resonant accelerometers. Proceedings of the 2011 IEEE Sensors, Limerick, Ireland.","DOI":"10.1109\/ICSENS.2011.6127302"},{"key":"ref_11","doi-asserted-by":"crossref","first-page":"104","DOI":"10.1109\/84.825784","article-title":"Micromachined silicon resonant strain gauges fabricated using soi wafer technology","volume":"9","author":"Beeby","year":"2000","journal-title":"J. Microelectromech. Syst."},{"key":"ref_12","doi-asserted-by":"crossref","first-page":"461","DOI":"10.1007\/s00542-009-0942-y","article-title":"Performance optimization and mechanical modeling of uniaxial piezoresistive microaccelerometers","volume":"16","year":"2010","journal-title":"Microsyst. Technol."},{"key":"ref_13","doi-asserted-by":"crossref","first-page":"015011","DOI":"10.1088\/0960-1317\/26\/1\/015011","article-title":"A high-sensitivity biaxial resonant accelerometer with two-stage microleverage mechanisms","volume":"26","author":"Ding","year":"2016","journal-title":"J. Micromech. Microeng."},{"key":"ref_14","doi-asserted-by":"crossref","first-page":"1230","DOI":"10.1049\/mnl.2012.0536","article-title":"Micro-machined resonant out-of-plane accelerometer with a differential structure fabricated by silicon-on-insulator\u2013mems technology","volume":"7","author":"Wang","year":"2010","journal-title":"Micro Nano Lett."},{"key":"ref_15","first-page":"478","article-title":"A new z-axis resonant micro-accelerometer based on electrostatic stiffness","volume":"15","author":"Yang","year":"2015","journal-title":"Sensors"},{"key":"ref_16","doi-asserted-by":"crossref","first-page":"035004","DOI":"10.1063\/1.4868508","article-title":"A resonant sensor composed of quartz double ended tuning fork and silicon substrate for digital acceleration measurement","volume":"85","author":"Li","year":"2014","journal-title":"Rev. Sci. Instrum."},{"key":"ref_17","doi-asserted-by":"crossref","first-page":"1","DOI":"10.1088\/0960-1317\/26\/3\/035006","article-title":"Sensitivity and temperature behavior of a novel z-axis differential resonant micro accelerometer","volume":"26","author":"Comi","year":"2016","journal-title":"J. Micromech. Microeng."},{"key":"ref_18","doi-asserted-by":"crossref","first-page":"650","DOI":"10.1088\/0022-3735\/17\/8\/007","article-title":"Etched silicon vibrating sensor","volume":"17","author":"Greenwood","year":"1984","journal-title":"J. Phys. E-Sci. Instrum."},{"key":"ref_19","unstructured":"Roessig, T.A., Howe, R.T., and Pisano, A.P. (1997, January 5\u20138). Nonlinear mixing in surface-micromachined tuning fork oscillators. Proceedings of the 1997 IEEE International Frequency Control Symposium, Toronto, ON, Canada."},{"key":"ref_20","doi-asserted-by":"crossref","first-page":"671","DOI":"10.1109\/JMEMS.2009.2020374","article-title":"Post-cmos-compatible aluminum nitride resonant mems accelerometers","volume":"18","author":"Olsson","year":"2009","journal-title":"J. Microelectromech. Syst."},{"key":"ref_21","doi-asserted-by":"crossref","first-page":"241","DOI":"10.1016\/0250-6874(89)80086-1","article-title":"A thermally-excited silicon accelerometer","volume":"17","author":"Satchell","year":"1989","journal-title":"Sens. Actuators"},{"key":"ref_22","doi-asserted-by":"crossref","first-page":"1330","DOI":"10.3390\/s90301330","article-title":"An electromagnetically excited silicon nitride beam resonant accelerometer","volume":"9","author":"Chen","year":"2009","journal-title":"Sensors"},{"key":"ref_23","unstructured":"Albert, W.C. (1982, January 3\u20136). Vibrating quartz crystal beam accelerometer. Proceedings of the 28th International Instrumentation Symposium, Las Vegas, NV, USA."},{"key":"ref_24","first-page":"792","article-title":"Double-ended tuning fork quartz accelerometer characteristics","volume":"33","author":"Kass","year":"1986","journal-title":"IEEE Trans. Ultrason. Ferroelectr. Freq. Control"},{"key":"ref_25","unstructured":"Norling, B.L., and Cornelius, C.J. (1988). Accelerometer with Isolator for Common Mode Inputs. (4,766,768 A), U.S. Patent."},{"key":"ref_26","unstructured":"Traon, O.L., Janiaud, D., Lecorre, B., Pernice, M., Muller, S., and Tridera, J.Y. (November, January 30). Monolithic differential vibrating beam accelerometer within an isolating system between the two resonators. Proceedings of the 2005 IEEE Sensors, Irvine, CA, USA."},{"key":"ref_27","unstructured":"Traon, O.L., Janiaud, D., Pernice, M., Masson, S., Muller, S., and Tridera, J.Y. (2006, January 25\u201327). A new quartz monolithic differential vibrating beam accelerometer. Proceedings of the 2006 IEEE\/Ion Position, Location and Navigation Symposium, Coronado, CA, USA."},{"key":"ref_28","doi-asserted-by":"crossref","unstructured":"Shang, Y., Wang, J., Tu, S., and Chen, D. (2011, January 28\u201331). A novel micromachined differential resonant accelerometer with flexural mechanisms fabricated by soi-mems technology. Proceedings of the 2011 IEEE Sensors, Limerick, Ireland.","DOI":"10.1109\/ICSENS.2011.6127041"},{"key":"ref_29","doi-asserted-by":"crossref","first-page":"58","DOI":"10.1108\/02602281111099099","article-title":"A resonant accelerometer based on electrostatic stiffness and its closed-loop control method","volume":"31","author":"Su","year":"2011","journal-title":"Sens. Rev."},{"key":"ref_30","doi-asserted-by":"crossref","first-page":"99","DOI":"10.1016\/0924-4247(96)80132-4","article-title":"Design and performance characteristics of an integrated high-capacity detf-based force sensor","volume":"52","author":"Cheshmehdoost","year":"1996","journal-title":"Sens. Actuators A"},{"key":"ref_31","first-page":"388","article-title":"Force sensor using double-ended tuning fork quartz crystals","volume":"30","author":"Chuang","year":"1983","journal-title":"IEEE Trans. Sonics Ultrason."},{"key":"ref_32","unstructured":"Gan, Z., Lin, D., Wang, X., Zhang, H., and Liu, S. (2006, January 8\u201312). Vacuum measurement on vacuum packaged mems devices. Proceedings of the International Symposium on Instrumentation Science and Technology, Harbin, China."},{"key":"ref_33","unstructured":"Marinis, T.F., and Soucy, J.W. (2003, January 18\u201320). Vacuum packaging of mems inertial sensors. Proceedings of the IMAPS International Symposium on Microelectronics, Boston, MA, USA."}],"container-title":["Sensors"],"original-title":[],"language":"en","link":[{"URL":"https:\/\/www.mdpi.com\/1424-8220\/17\/1\/178\/pdf","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2025,10,11]],"date-time":"2025-10-11T18:26:30Z","timestamp":1760207190000},"score":1,"resource":{"primary":{"URL":"https:\/\/www.mdpi.com\/1424-8220\/17\/1\/178"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2017,1,18]]},"references-count":33,"journal-issue":{"issue":"1","published-online":{"date-parts":[[2017,1]]}},"alternative-id":["s17010178"],"URL":"https:\/\/doi.org\/10.3390\/s17010178","relation":{},"ISSN":["1424-8220"],"issn-type":[{"value":"1424-8220","type":"electronic"}],"subject":[],"published":{"date-parts":[[2017,1,18]]}}}