{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,10,12]],"date-time":"2025-10-12T04:11:32Z","timestamp":1760242292109,"version":"build-2065373602"},"reference-count":23,"publisher":"MDPI AG","issue":"3","license":[{"start":{"date-parts":[[2017,3,7]],"date-time":"2017-03-07T00:00:00Z","timestamp":1488844800000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/creativecommons.org\/licenses\/by\/4.0\/"}],"funder":[{"name":"the Hi-Tech Research and Development Program of China","award":["2015AA042701"],"award-info":[{"award-number":["2015AA042701"]}]},{"name":"the National Key Laboratory of Micro\/Nano Fabrication Technology Foundation","award":["9140C790403150C79332"],"award-info":[{"award-number":["9140C790403150C79332"]}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["Sensors"],"abstract":"<jats:p>A novel micro-electro-mechanical systems (MEMS) inertial microswitch with a flexible contact-enhanced structure to extend the contact duration has been proposed in the present work. In order to investigate the stiffness k of the stationary electrodes, the stationary electrodes with different shapes, thickness h, width b, and length l were designed, analyzed, and simulated using ANSYS software. Both the analytical and the simulated results indicate that the stiffness k increases with thickness h and width b, while decreasing with an increase of length l, and it is related to the shape. The inertial micro-switches with different kinds of stationary electrodes were simulated using ANSYS software and fabricated using surface micromachining technology. The dynamic simulation indicates that the contact time will decrease with the increase of thickness h and width b, but increase with the length l, and it is related to the shape. As a result, the contact time decreases with the stiffness k of the stationary electrode. Furthermore, the simulated results reveal that the stiffness k changes more rapidly with h and l compared to b. However, overlarge dimension of the whole microswitch is contradicted with small footprint area expectation in the structure design. Therefore, it is unreasonable to extend the contact duration by increasing the length l excessively. Thus, the best and most convenient way to prolong the contact time is to reduce the thickness h of the stationary electrode while keeping the plane geometric structure of the inertial micro-switch unchanged. Finally, the fabricated micro-switches with different shapes of stationary electrodes have been evaluated by a standard dropping hammer system. The test maximum contact time under 288 g acceleration can reach 125 \u00b5s. It is shown that the test results are in accordance with the simulated results. The conclusions obtained in this work can provide guidance for the future design and fabrication of inertial microswitches.<\/jats:p>","DOI":"10.3390\/s17030527","type":"journal-article","created":{"date-parts":[[2017,3,7]],"date-time":"2017-03-07T11:12:32Z","timestamp":1488885152000},"page":"527","update-policy":"https:\/\/doi.org\/10.3390\/mdpi_crossmark_policy","source":"Crossref","is-referenced-by-count":12,"title":["Design and Optimization of a Stationary Electrode in a Vertically-Driven MEMS Inertial Switch for Extending Contact Duration"],"prefix":"10.3390","volume":"17","author":[{"given":"Qiu","family":"Xu","sequence":"first","affiliation":[{"name":"National Key Laboratory of Science and Technology on Micro\/Nano Fabrication, School of Electronic Information and Electrical Engineering, Shanghai Jiao Tong University, Shanghai 200240, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Zhuo-Qing","family":"Yang","sequence":"additional","affiliation":[{"name":"National Key Laboratory of Science and Technology on Micro\/Nano Fabrication, School of Electronic Information and Electrical Engineering, Shanghai Jiao Tong University, Shanghai 200240, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Bo","family":"Fu","sequence":"additional","affiliation":[{"name":"Huaihai Industrial Group Co., Ltd., Changzhi 046012, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Yan-Ping","family":"Bao","sequence":"additional","affiliation":[{"name":"Huaihai Industrial Group Co., Ltd., Changzhi 046012, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Hao","family":"Wu","sequence":"additional","affiliation":[{"name":"Huaihai Industrial Group Co., Ltd., Changzhi 046012, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Yun-Na","family":"Sun","sequence":"additional","affiliation":[{"name":"National Key Laboratory of Science and Technology on Micro\/Nano Fabrication, School of Electronic Information and Electrical Engineering, Shanghai Jiao Tong University, Shanghai 200240, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Meng-Yuan","family":"Zhao","sequence":"additional","affiliation":[{"name":"National Key Laboratory of Science and Technology on Micro\/Nano Fabrication, School of Electronic Information and Electrical Engineering, Shanghai Jiao Tong University, Shanghai 200240, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Jian","family":"Li","sequence":"additional","affiliation":[{"name":"National Key Laboratory of Science and Technology on Micro\/Nano Fabrication, School of Electronic Information and Electrical Engineering, Shanghai Jiao Tong University, Shanghai 200240, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Gui-Fu","family":"Ding","sequence":"additional","affiliation":[{"name":"National Key Laboratory of Science and Technology on Micro\/Nano Fabrication, School of Electronic Information and Electrical Engineering, Shanghai Jiao Tong University, Shanghai 200240, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Xiao-Lin","family":"Zhao","sequence":"additional","affiliation":[{"name":"National Key Laboratory of Science and Technology on Micro\/Nano Fabrication, School of Electronic Information and Electrical Engineering, Shanghai Jiao Tong University, Shanghai 200240, China"}],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"1968","published-online":{"date-parts":[[2017,3,7]]},"reference":[{"key":"ref_1","first-page":"892","article-title":"Design and characterization of inertial-activated electrical micro-switches fabricated and packaged using low-temperature photoresist molded metal-electroplating technology","volume":"6","author":"Wei","year":"2003","journal-title":"J. Micromech. Microeng."},{"key":"ref_2","doi-asserted-by":"crossref","first-page":"93","DOI":"10.1016\/S0924-4247(00)00295-8","article-title":"Low-cost post-CMOS integration of electroplated microstructures for inertial","volume":"83","author":"Wycisk","year":"2000","journal-title":"Sens. Actuators A Phys."},{"key":"ref_3","doi-asserted-by":"crossref","first-page":"120","DOI":"10.1088\/0960-1317\/10\/2\/304","article-title":"Additive electro-plating technology as a post-CMOS process for the production of MEMS acceleration-threshold switches for transportation applications","volume":"2","author":"Michaelis","year":"2000","journal-title":"J. Micromech. Microeng."},{"key":"ref_4","doi-asserted-by":"crossref","first-page":"190","DOI":"10.1016\/0924-4247(94)00888-O","article-title":"Airbag application: A microsystem including a silicon capacitive accelerometer, CMOS switched capacitor electronic and true self-test capability","volume":"3","author":"Zimmermann","year":"1995","journal-title":"Sens. Actuators A Phys."},{"key":"ref_5","doi-asserted-by":"crossref","first-page":"1797","DOI":"10.1088\/0960-1317\/18\/11\/115033","article-title":"Design, simulation and fabrication of a novel contact-enhanced MEMS inertial switch with a movable contact point","volume":"18","author":"Cai","year":"2008","journal-title":"J. Micromech. Microeng."},{"key":"ref_6","doi-asserted-by":"crossref","first-page":"801","DOI":"10.1109\/JSEN.2009.2022554","article-title":"Development of a novel MEMS inertial switch with a compliant stationary electrode","volume":"9","author":"Cai","year":"2009","journal-title":"IEEE Sens. J."},{"key":"ref_7","first-page":"646","article-title":"A passive inertial switch using MWCNT-hydrogel composite with wireless interrogation capability","volume":"22","author":"Kuo","year":"2013","journal-title":"J. Micro-Electromech."},{"key":"ref_8","doi-asserted-by":"crossref","first-page":"374","DOI":"10.1016\/j.mee.2013.02.069","article-title":"A novel inertial switch with an adjustable acceleration threshold using an MEMS digital-to-analog converter","volume":"110","author":"Ma","year":"2013","journal-title":"Microelectron. Eng."},{"key":"ref_9","doi-asserted-by":"crossref","first-page":"418","DOI":"10.1016\/S0924-4247(00)00377-0","article-title":"Acceleration threshold switches from an additive electroplating MEMS process","volume":"85","author":"Michaelis","year":"2000","journal-title":"Sens. Actuators A Phys."},{"key":"ref_10","doi-asserted-by":"crossref","first-page":"13492","DOI":"10.1364\/OE.21.013492","article-title":"Surface-plasmon-enhanced GaN-LED based on a multilayered M-shaped nano-grating","volume":"21","author":"Zhang","year":"2013","journal-title":"Opt. Express"},{"key":"ref_11","doi-asserted-by":"crossref","first-page":"66","DOI":"10.1016\/j.optcom.2014.02.011","article-title":"Surface-plasmon-enhanced GaN-LED based on the multilayered rectangular nano-grating","volume":"322","author":"Zhu","year":"2014","journal-title":"Opt. Commun."},{"key":"ref_12","doi-asserted-by":"crossref","first-page":"41","DOI":"10.1016\/j.sna.2010.02.008","article-title":"Latching in a MEMS shock sensor: Molding and experiments","volume":"159","author":"Currano","year":"2010","journal-title":"Sens. Actuators A Phys."},{"key":"ref_13","doi-asserted-by":"crossref","first-page":"569","DOI":"10.1016\/j.apsusc.2016.06.164","article-title":"A surface-micromachining-based inertial micro-switch with compliant cantilever beam as movable electrode for enduring high shock and prolonging contact time","volume":"387","author":"Xu","year":"2016","journal-title":"Appl. Surf. Sci."},{"key":"ref_14","doi-asserted-by":"crossref","first-page":"055008","DOI":"10.1088\/0960-1317\/26\/5\/055008","article-title":"Design and fabrication of a laterally-driven inertial microswitch with multi-direction constraint structures for lowering off-axis sensitivity","volume":"26","author":"Zhang","year":"2016","journal-title":"J. Micromech. Microeng."},{"doi-asserted-by":"crossref","unstructured":"Deng, K.F., Su, W.G., Li, S., Zhang, Y.T., Chen, G.Z., Zhang, W., Wan, S., Li, L., Jiang, S.B., and Zheng, H. (2013, January 16\u201320). A novel inertial switch based on nonlinear-spring shock stop. Proceedings of the IEEE Transducer 2013 Conference, Barcelona, Spain.","key":"ref_15","DOI":"10.1109\/Transducers.2013.6627285"},{"key":"ref_16","doi-asserted-by":"crossref","first-page":"105013","DOI":"10.1088\/0960-1317\/23\/10\/105013","article-title":"The design, simulation and fabrication of a novel horizontal sensitive inertial microswitch with low g value based on MEMS micromachining technology","volume":"23","author":"Wang","year":"2013","journal-title":"J. Micromech. Microeng."},{"key":"ref_17","doi-asserted-by":"crossref","first-page":"1589","DOI":"10.1088\/0960-1317\/17\/8\/024","article-title":"Design, simulation and characterization of an inertia microswitch fabricated by non-silicon surface micromachining","volume":"17","author":"Yang","year":"2007","journal-title":"J. Micromech. Microeng."},{"key":"ref_18","doi-asserted-by":"crossref","first-page":"2492","DOI":"10.1109\/TED.2008.927385","article-title":"A MEMS inertial switch with bridge-type elastic fixed electrode for long duration contact","volume":"55","author":"Yang","year":"2008","journal-title":"IEEE Trans. Electron."},{"key":"ref_19","doi-asserted-by":"crossref","first-page":"1112","DOI":"10.1016\/j.mejo.2008.01.068","article-title":"Fabrication of a MEMS inertial switch on quartz substrate and evaluation of its threshold acceleration","volume":"39","author":"Cai","year":"2008","journal-title":"Microelectron. J."},{"unstructured":"Beam Formulas with Shear and Moment Diagrams. Available online: http:\/\/www.awc.org\/pdf\/codes-standards\/publications\/design-aids\/AWC-DA6-BeamFormulas-0710.pdf.","key":"ref_20"},{"unstructured":"Meirovitch, L. (1986). Elements of Vibration Analysis, McGraw-Hill. [2nd ed.].","key":"ref_21"},{"key":"ref_22","doi-asserted-by":"crossref","first-page":"1839","DOI":"10.1007\/s00542-010-1094-9","article-title":"A directly strain measuring method for electroplated nickel micro-tensile test","volume":"16","author":"Tang","year":"2010","journal-title":"J. Microsyst. Technol."},{"unstructured":"ANSYS Inc.. Available online: http:\/\/www.ansys.com\/.","key":"ref_23"}],"container-title":["Sensors"],"original-title":[],"language":"en","link":[{"URL":"https:\/\/www.mdpi.com\/1424-8220\/17\/3\/527\/pdf","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2025,10,11]],"date-time":"2025-10-11T18:29:52Z","timestamp":1760207392000},"score":1,"resource":{"primary":{"URL":"https:\/\/www.mdpi.com\/1424-8220\/17\/3\/527"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2017,3,7]]},"references-count":23,"journal-issue":{"issue":"3","published-online":{"date-parts":[[2017,3]]}},"alternative-id":["s17030527"],"URL":"https:\/\/doi.org\/10.3390\/s17030527","relation":{},"ISSN":["1424-8220"],"issn-type":[{"type":"electronic","value":"1424-8220"}],"subject":[],"published":{"date-parts":[[2017,3,7]]}}}