{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,2,12]],"date-time":"2026-02-12T07:47:21Z","timestamp":1770882441158,"version":"3.50.1"},"reference-count":11,"publisher":"MDPI AG","issue":"4","license":[{"start":{"date-parts":[[2017,4,14]],"date-time":"2017-04-14T00:00:00Z","timestamp":1492128000000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/creativecommons.org\/licenses\/by\/4.0\/"}],"funder":[{"name":"National Program on Key Basic Research Project Program(973)","award":["2015CB057402"],"award-info":[{"award-number":["2015CB057402"]}]},{"DOI":"10.13039\/501100012462","name":"Collaborative Innovation Center of Suzhou Nano Science and Technology","doi-asserted-by":"publisher","id":[{"id":"10.13039\/501100012462","id-type":"DOI","asserted-by":"publisher"}]},{"name":"111 Program","award":["No.B12016"],"award-info":[{"award-number":["No.B12016"]}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["Sensors"],"abstract":"<jats:p>A thermal stress range analysis of tungsten-rhenium thin film thermocouples based on ceramic substrates is presented to analyze the falling off and breakage problems caused by the mismatch of the thermal stresses in thin film thermocouples (TFTCs) and substrate, and nano-indentation experiments are done to measure and calculate the film stress to compare with the simulation results. Optimal design and fabrication of tungsten-rhenium TFTCs based on ceramic substrates is reported. Static high temperature tests are carried out, which show the optimization design can effectively reduce the damage caused by the thermal stress mismatch.<\/jats:p>","DOI":"10.3390\/s17040857","type":"journal-article","created":{"date-parts":[[2017,4,18]],"date-time":"2017-04-18T11:22:04Z","timestamp":1492514524000},"page":"857","update-policy":"https:\/\/doi.org\/10.3390\/mdpi_crossmark_policy","source":"Crossref","is-referenced-by-count":28,"title":["Range Analysis of Thermal Stress and Optimal Design for Tungsten-Rhenium Thin Film Thermocouples Based on Ceramic Substrates"],"prefix":"10.3390","volume":"17","author":[{"given":"Zhongkai","family":"Zhang","sequence":"first","affiliation":[{"name":"State Key Laboratory for Mechanical Manufacturing Systems Engineering, Xi\u2019an Jiaotong University, Xi\u2019an 710049, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Bian","family":"Tian","sequence":"additional","affiliation":[{"name":"State Key Laboratory for Mechanical Manufacturing Systems Engineering, Xi\u2019an Jiaotong University, Xi\u2019an 710049, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Qiuyue","family":"Yu","sequence":"additional","affiliation":[{"name":"State Key Laboratory for Mechanical Manufacturing Systems Engineering, Xi\u2019an Jiaotong University, Xi\u2019an 710049, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Peng","family":"Shi","sequence":"additional","affiliation":[{"name":"State Key Laboratory for Mechanical Manufacturing Systems Engineering, Xi\u2019an Jiaotong University, Xi\u2019an 710049, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Qijing","family":"Lin","sequence":"additional","affiliation":[{"name":"State Key Laboratory for Mechanical Manufacturing Systems Engineering, Xi\u2019an Jiaotong University, Xi\u2019an 710049, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Na","family":"Zhao","sequence":"additional","affiliation":[{"name":"State Key Laboratory for Mechanical Manufacturing Systems Engineering, Xi\u2019an Jiaotong University, Xi\u2019an 710049, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Weixuan","family":"Jing","sequence":"additional","affiliation":[{"name":"State Key Laboratory for Mechanical Manufacturing Systems Engineering, Xi\u2019an Jiaotong University, Xi\u2019an 710049, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Zhuangde","family":"Jiang","sequence":"additional","affiliation":[{"name":"State Key Laboratory for Mechanical Manufacturing Systems Engineering, Xi\u2019an Jiaotong University, Xi\u2019an 710049, China"}],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"1968","published-online":{"date-parts":[[2017,4,14]]},"reference":[{"key":"ref_1","first-page":"334","article-title":"Latest progress in development of thin film temperature sensors","volume":"23","author":"Zhang","year":"2003","journal-title":"Vac. Sci. Technol."},{"key":"ref_2","unstructured":"Lepieovsky, J., Smith, F.A., Zhang, L.J., and Jaiswal, R. (1999, January 5\u201310). Thin-film Thermocouples for Turbine Hot-Cascade Testing. Proceedings of the 14th International Symposium on Air Breathing Engines (ISABE), Florence, Italy."},{"key":"ref_3","doi-asserted-by":"crossref","first-page":"015007","DOI":"10.1063\/1.4973967","article-title":"Tungsten-Rhenium Thin Film Thermocouples for SiC-based Ceramic Matrix Composites","volume":"88","author":"Tian","year":"2017","journal-title":"Rev. Sci. Instrum."},{"key":"ref_4","doi-asserted-by":"crossref","first-page":"8","DOI":"10.1016\/j.surfcoat.2014.04.044","article-title":"The adhesion and corrosion resistance of Ti\u2013O films on CoCrMo alloy fabricated by high power pulsed magnetron sputtering","volume":"252","author":"Chen","year":"2014","journal-title":"Surf. Coat. Technol."},{"key":"ref_5","doi-asserted-by":"crossref","first-page":"1093","DOI":"10.1007\/s11661-998-1018-9","article-title":"The influence of crystallographic orientation and strain rate on the high-temperature low-cyclic fatigue property of a nickel-base single-crystal superalloy","volume":"29","author":"Yue","year":"1998","journal-title":"Metall. Mater. Trans. A"},{"key":"ref_6","unstructured":"Liu, C. (2008). Foundations of MEMS, China Machine Press."},{"key":"ref_7","doi-asserted-by":"crossref","first-page":"205","DOI":"10.1016\/j.jmatprotec.2007.09.036","article-title":"Finite element analysis of thermal stress in magnetron sputtered Ti coating","volume":"200","author":"Chawla","year":"2008","journal-title":"J. Mater. Process. Technol."},{"key":"ref_8","doi-asserted-by":"crossref","first-page":"290","DOI":"10.1016\/j.matchemphys.2008.09.023","article-title":"Analysis of thermal stress in magnetron sputtered TiN coating by finite element method","volume":"114","author":"Chawla","year":"2009","journal-title":"Mater. Chem. Phys."},{"key":"ref_9","doi-asserted-by":"crossref","first-page":"1629","DOI":"10.4028\/www.scientific.net\/AMR.941-944.1629","article-title":"FE Modeling of Stress Distribution in MAO Coating on TC4 Substrate under Thermal Shock Cyclic Loading","volume":"941","author":"Zhong","year":"2014","journal-title":"Adv. Mater. Res."},{"key":"ref_10","doi-asserted-by":"crossref","unstructured":"Tian, B., Yu, Q., Zhang, Z., and Jiang, Z. (2017, January 9\u201312). Measurement Study of Residual Stress on Tungsten-Rhenium Thin Film Thermocouples by Nanoindentation Technology. Proceedings of the IEEE Nano\/Mirco Engineered and Molecular Systems 2017 Conference, Los Angeles, CA, USA.","DOI":"10.1109\/NEMS.2017.8017139"},{"key":"ref_11","doi-asserted-by":"crossref","first-page":"5755","DOI":"10.1016\/S1359-6454(98)00226-2","article-title":"A new method for estimating residual stresses by instrumented sharp indentation","volume":"46","author":"Suresh","year":"1998","journal-title":"Acta Mater."}],"container-title":["Sensors"],"original-title":[],"language":"en","link":[{"URL":"https:\/\/www.mdpi.com\/1424-8220\/17\/4\/857\/pdf","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2025,10,11]],"date-time":"2025-10-11T18:32:39Z","timestamp":1760207559000},"score":1,"resource":{"primary":{"URL":"https:\/\/www.mdpi.com\/1424-8220\/17\/4\/857"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2017,4,14]]},"references-count":11,"journal-issue":{"issue":"4","published-online":{"date-parts":[[2017,4]]}},"alternative-id":["s17040857"],"URL":"https:\/\/doi.org\/10.3390\/s17040857","relation":{},"ISSN":["1424-8220"],"issn-type":[{"value":"1424-8220","type":"electronic"}],"subject":[],"published":{"date-parts":[[2017,4,14]]}}}