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MWT has received growing interest due to its potential to overcome some of the limitations of microwave nondestructive testing (NDT) and thermal NDT. Moreover, during the last few decades MWT has attracted growing interest in materials assessment. In this paper, a comprehensive review of MWT techniques for materials evaluation is conducted based on a detailed literature survey. First, the basic principles of MWT are described. Different types of MWT, including microwave pulsed thermography, microwave step thermography, microwave pulsed phase thermography, and microwave lock-in thermography are defined and introduced. Then, MWT case studies are discussed. Next, comparisons with other thermography and NDT methods are conducted. Finally, the trends in MWT research are outlined, including new theoretical studies, simulations and modelling, signal processing algorithms, internal properties characterization, automatic separation and inspection systems. This work provides a summary of MWT, which can be utilized for material failures prevention and quality control.<\/jats:p>","DOI":"10.3390\/s17051123","type":"journal-article","created":{"date-parts":[[2017,5,15]],"date-time":"2017-05-15T12:16:12Z","timestamp":1494850572000},"page":"1123","update-policy":"https:\/\/doi.org\/10.3390\/mdpi_crossmark_policy","source":"Crossref","is-referenced-by-count":87,"title":["A Review of Microwave Thermography Nondestructive Testing and Evaluation"],"prefix":"10.3390","volume":"17","author":[{"ORCID":"https:\/\/orcid.org\/0000-0002-4766-4221","authenticated-orcid":false,"given":"Hong","family":"Zhang","sequence":"first","affiliation":[{"name":"School of Electronic and Information Engineering, Fuqing Branch of Fujian Normal University, Fuzhou 350300, China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Ruizhen","family":"Yang","sequence":"additional","affiliation":[{"name":"Department of Civil and Architecture Engineering, Changsha University, Changsha 410022, China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Yunze","family":"He","sequence":"additional","affiliation":[{"name":"College of Electrical and Information Engineering, Hunan University, Changsha 410082, China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Ali","family":"Foudazi","sequence":"additional","affiliation":[{"name":"Electrical and Computer Engineering Department, Missouri University of Science and Technology, Rolla, MO 65409, USA"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Liang","family":"Cheng","sequence":"additional","affiliation":[{"name":"School of Electrical and Electronic Engineering, Newcastle University, Newcastle upon Tyne NE1 7RU, UK"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Guiyun","family":"Tian","sequence":"additional","affiliation":[{"name":"School of Electrical and Electronic Engineering, Newcastle University, Newcastle upon Tyne NE1 7RU, UK"}],"role":[{"vocabulary":"crossref","role":"author"}]}],"member":"1968","published-online":{"date-parts":[[2017,5,15]]},"reference":[{"key":"ref_1","doi-asserted-by":"crossref","unstructured":"Bakht, B., and Mufti, A. 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