{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,5,21]],"date-time":"2026-05-21T09:53:13Z","timestamp":1779357193000,"version":"3.51.4"},"reference-count":149,"publisher":"MDPI AG","issue":"5","license":[{"start":{"date-parts":[[2017,5,19]],"date-time":"2017-05-19T00:00:00Z","timestamp":1495152000000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/creativecommons.org\/licenses\/by\/4.0\/"}],"funder":[{"name":"Cross Scientific Research Innovation Fund of Graduate School at Shenzhen of Tsinghua University","award":["JC20140005"],"award-info":[{"award-number":["JC20140005"]}]},{"name":"Projects of Basic Research of Shenzhen","award":[". JCYJ20150731154850925"],"award-info":[{"award-number":[". JCYJ20150731154850925"]}]},{"name":"Projects of Basic Research of Shenzhen","award":["JCYJ20160509154951210"],"award-info":[{"award-number":["JCYJ20160509154951210"]}]},{"name":"Projects of Basic Research of Shenzhen","award":["JCYJ20160608165954934"],"award-info":[{"award-number":["JCYJ20160608165954934"]}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["Sensors"],"abstract":"<jats:p>Future sensing applications will include high-performance features, such as toxin detection, real-time monitoring of physiological events, advanced diagnostics, and connected feedback. However, such multi-functional sensors require advancements in sensitivity, specificity, and throughput with the simultaneous delivery of multiple detection in a short time. Recent advances in 3D printing and electronics have brought us closer to sensors with multiplex advantages, and additive manufacturing approaches offer a new scope for sensor fabrication. To this end, we review the recent advances in 3D-printed cutting-edge sensors. These achievements demonstrate the successful application of 3D-printing technology in sensor fabrication, and the selected studies deeply explore the potential for creating sensors with higher performance. Further development of multi-process 3D printing is expected to expand future sensor utility and availability.<\/jats:p>","DOI":"10.3390\/s17051166","type":"journal-article","created":{"date-parts":[[2017,5,23]],"date-time":"2017-05-23T01:47:33Z","timestamp":1495504053000},"page":"1166","update-policy":"https:\/\/doi.org\/10.3390\/mdpi_crossmark_policy","source":"Crossref","is-referenced-by-count":304,"title":["The Boom in 3D-Printed Sensor Technology"],"prefix":"10.3390","volume":"17","author":[{"given":"Yuanyuan","family":"Xu","sequence":"first","affiliation":[{"name":"Tsinghua-Berkeley Shenzhen Institute, Shenzhen 518055, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Xiaoyue","family":"Wu","sequence":"additional","affiliation":[{"name":"Graduate School at Shenzhen, Tsinghua University, Shenzhen 518055, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Xiao","family":"Guo","sequence":"additional","affiliation":[{"name":"Graduate School at Shenzhen, Tsinghua University, Shenzhen 518055, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Bin","family":"Kong","sequence":"additional","affiliation":[{"name":"Tsinghua-Berkeley Shenzhen Institute, Shenzhen 518055, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Min","family":"Zhang","sequence":"additional","affiliation":[{"name":"Graduate School at Shenzhen, Tsinghua University, Shenzhen 518055, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0000-0003-2487-8785","authenticated-orcid":false,"given":"Xiang","family":"Qian","sequence":"additional","affiliation":[{"name":"Graduate School at Shenzhen, Tsinghua University, Shenzhen 518055, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Shengli","family":"Mi","sequence":"additional","affiliation":[{"name":"Graduate School at Shenzhen, Tsinghua University, Shenzhen 518055, China"},{"name":"Open Fiesta, Tsinghua University, Shenzhen 518055, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Wei","family":"Sun","sequence":"additional","affiliation":[{"name":"Tsinghua-Berkeley Shenzhen Institute, Shenzhen 518055, China"},{"name":"Graduate School at Shenzhen, Tsinghua University, Shenzhen 518055, China"},{"name":"Department of Mechanical Engineering, Drexel University, Philadelphia 19104, PA, USA"},{"name":"Department of Mechanical Engineering and Mechanics, Tsinghua University, Beijing 100084, China"}],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"1968","published-online":{"date-parts":[[2017,5,19]]},"reference":[{"key":"ref_1","doi-asserted-by":"crossref","unstructured":"MacDonald, E., and Wicker, R. 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