{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,5,15]],"date-time":"2026-05-15T23:28:48Z","timestamp":1778887728410,"version":"3.51.4"},"reference-count":39,"publisher":"MDPI AG","issue":"9","license":[{"start":{"date-parts":[[2017,8,26]],"date-time":"2017-08-26T00:00:00Z","timestamp":1503705600000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/creativecommons.org\/licenses\/by\/4.0\/"}],"funder":[{"DOI":"10.13039\/501100001809","name":"National Natural Science Foundation of China","doi-asserted-by":"publisher","award":["51375378"],"award-info":[{"award-number":["51375378"]}],"id":[{"id":"10.13039\/501100001809","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100001809","name":"National Natural Science Foundation of China","doi-asserted-by":"publisher","award":["91323303"],"award-info":[{"award-number":["91323303"]}],"id":[{"id":"10.13039\/501100001809","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100001809","name":"National Natural Science Foundation of China","doi-asserted-by":"publisher","award":["51421004"],"award-info":[{"award-number":["51421004"]}],"id":[{"id":"10.13039\/501100001809","id-type":"DOI","asserted-by":"publisher"}]},{"name":"National Key R&amp;D Program of China","award":["2016YFB0501604-02"],"award-info":[{"award-number":["2016YFB0501604-02"]}]},{"name":"National Key R&amp;D Program of China","award":["2016YFB1200103-04"],"award-info":[{"award-number":["2016YFB1200103-04"]}]},{"DOI":"10.13039\/501100012166","name":"973 Program","doi-asserted-by":"publisher","award":["2015CB057402"],"award-info":[{"award-number":["2015CB057402"]}],"id":[{"id":"10.13039\/501100012166","id-type":"DOI","asserted-by":"publisher"}]},{"name":"111 Program","award":["B12016"],"award-info":[{"award-number":["B12016"]}]},{"name":"2016 Years of Scientific and Technological Activities of Overseas Scholars Preferred Funding"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["Sensors"],"abstract":"<jats:p>The influence of diaphragm bending stiffness distribution on the stress concentration characteristics of a pressure sensing chip had been analyzed and discussed systematically. According to the analysis, a novel peninsula-island-based diaphragm structure was presented and applied to two differenet diaphragm shapes as sensing chips for pressure sensors. By well-designed bending stiffness distribution of the diaphragm, the elastic potential energy induced by diaphragm deformation was concentrated above the gap position, which remarkably increased the sensitivity of the sensing chip. An optimization method and the distribution pattern of the peninsula-island based diaphragm structure were also discussed. Two kinds of sensing chips combined with the peninsula-island structures distributing along the side edge and diagonal directions of rectangular diaphragm were fabricated and analyzed. By bonding the sensing chips with anti-overload glass bases, these two sensing chips were demonstrated by testing to achieve not only high sensitivity, but also good anti-overload ability. The experimental results showed that the proposed structures had the potential to measure ultra-low absolute pressures with high sensitivity and good anti-overload ability in an atmospheric environment.<\/jats:p>","DOI":"10.3390\/s17091965","type":"journal-article","created":{"date-parts":[[2017,8,28]],"date-time":"2017-08-28T12:08:37Z","timestamp":1503922117000},"page":"1965","update-policy":"https:\/\/doi.org\/10.3390\/mdpi_crossmark_policy","source":"Crossref","is-referenced-by-count":39,"title":["Application and Optimization of Stiffness Abruption Structures for Pressure Sensors with High Sensitivity and Anti-Overload Ability"],"prefix":"10.3390","volume":"17","author":[{"given":"Tingzhong","family":"Xu","sequence":"first","affiliation":[{"name":"State Key Laboratory for Manufacturing Systems Engineering, International Joint Laboratory for Micro\/Nano Manufacturing and Measurement Technologies, Collaborative Innovation Center of SuzhouNano Science and Technology, School of Mechanical Engineering, Xi\u2019an Jiaotong University, Xi\u2019an 710049, China"},{"name":"School of Mechanical and Manufacturing Engineering, University of New South Wales, Sydney, NSW 2052, Australia"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Dejiang","family":"Lu","sequence":"additional","affiliation":[{"name":"State Key Laboratory for Manufacturing Systems Engineering, International Joint Laboratory for Micro\/Nano Manufacturing and Measurement Technologies, Collaborative Innovation Center of SuzhouNano Science and Technology, School of Mechanical Engineering, Xi\u2019an Jiaotong University, Xi\u2019an 710049, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Libo","family":"Zhao","sequence":"additional","affiliation":[{"name":"State Key Laboratory for Manufacturing Systems Engineering, International Joint Laboratory for Micro\/Nano Manufacturing and Measurement Technologies, Collaborative Innovation Center of SuzhouNano Science and Technology, School of Mechanical Engineering, Xi\u2019an Jiaotong University, Xi\u2019an 710049, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Zhuangde","family":"Jiang","sequence":"additional","affiliation":[{"name":"State Key Laboratory for Manufacturing Systems Engineering, International Joint Laboratory for Micro\/Nano Manufacturing and Measurement Technologies, Collaborative Innovation Center of SuzhouNano Science and Technology, School of Mechanical Engineering, Xi\u2019an Jiaotong University, Xi\u2019an 710049, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Hongyan","family":"Wang","sequence":"additional","affiliation":[{"name":"Shaanxi Institute of Metrology Science, Xi\u2019an 710065, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Xin","family":"Guo","sequence":"additional","affiliation":[{"name":"State Key Laboratory for Manufacturing Systems Engineering, International Joint Laboratory for Micro\/Nano Manufacturing and Measurement Technologies, Collaborative Innovation Center of SuzhouNano Science and Technology, School of Mechanical Engineering, Xi\u2019an Jiaotong University, Xi\u2019an 710049, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Zhikang","family":"Li","sequence":"additional","affiliation":[{"name":"State Key Laboratory for Manufacturing Systems Engineering, International Joint Laboratory for Micro\/Nano Manufacturing and Measurement Technologies, Collaborative Innovation Center of SuzhouNano Science and Technology, School of Mechanical Engineering, Xi\u2019an Jiaotong University, Xi\u2019an 710049, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Xiangyang","family":"Zhou","sequence":"additional","affiliation":[{"name":"School of Instrumentation Science &amp; Optoelectronics Engineering, Beihang University, Beijing 100191, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Yulong","family":"Zhao","sequence":"additional","affiliation":[{"name":"State Key Laboratory for Manufacturing Systems Engineering, International Joint Laboratory for Micro\/Nano Manufacturing and Measurement Technologies, Collaborative Innovation Center of SuzhouNano Science and Technology, School of Mechanical Engineering, Xi\u2019an Jiaotong University, Xi\u2019an 710049, China"}],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"1968","published-online":{"date-parts":[[2017,8,26]]},"reference":[{"key":"ref_1","doi-asserted-by":"crossref","first-page":"513","DOI":"10.1109\/JPROC.2009.2013612","article-title":"Review: Semiconductor Piezoresistance for Microsystems","volume":"97","author":"Barlian","year":"2009","journal-title":"Proc. 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