{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,1,24]],"date-time":"2026-01-24T08:06:39Z","timestamp":1769241999451,"version":"3.49.0"},"reference-count":32,"publisher":"MDPI AG","issue":"1","license":[{"start":{"date-parts":[[2018,1,1]],"date-time":"2018-01-01T00:00:00Z","timestamp":1514764800000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/creativecommons.org\/licenses\/by\/4.0\/"}],"funder":[{"DOI":"10.13039\/501100001809","name":"the National Natural Science Foundation of China","doi-asserted-by":"publisher","award":["61573121"],"award-info":[{"award-number":["61573121"]}],"id":[{"id":"10.13039\/501100001809","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100001809","name":"the National Natural Science Foundation of China","doi-asserted-by":"publisher","award":["51521003"],"award-info":[{"award-number":["51521003"]}],"id":[{"id":"10.13039\/501100001809","id-type":"DOI","asserted-by":"publisher"}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["Sensors"],"abstract":"<jats:p>Sidewall roughness measurement is becoming increasingly important in the micro-electromechanical systems and nanoelectronics devices. Atomic force microscopy (AFM) is an emerging technique for sidewall scanning and roughness measurement due to its high resolution, three-dimensional imaging capability and high accuracy. We report an AFM sidewall imaging method with a quartz tuning fork (QTF) force sensor. A self sensing and actuating force sensor is fabricated by microassembling a commercial AFM cantilever (tip apex radius \u226410 nm) to a QTF. The attached lightweight cantilever allows high-sensitivity force detection (7.4% Q factor reduction) and sidewall imaging with high lateral resolution. Owing to its unique configuration, the tip of the sensor can detect sidewall surface orthogonally during imaging, which reduces lateral friction. In experiments, sidewalls of a micro-electro-mechanical system (MEMS) structure fabricated by deep reactive ion etching process and a standard step grating are scanned and the sidewall roughness, line edge roughness and sidewall angles are measured.<\/jats:p>","DOI":"10.3390\/s18010100","type":"journal-article","created":{"date-parts":[[2018,1,3]],"date-time":"2018-01-03T12:00:06Z","timestamp":1514980806000},"page":"100","update-policy":"https:\/\/doi.org\/10.3390\/mdpi_crossmark_policy","source":"Crossref","is-referenced-by-count":14,"title":["Atomic Force Microscopy Sidewall Imaging with a Quartz Tuning Fork Force Sensor"],"prefix":"10.3390","volume":"18","author":[{"ORCID":"https:\/\/orcid.org\/0000-0002-5541-605X","authenticated-orcid":false,"given":"Danish","family":"Hussain","sequence":"first","affiliation":[{"name":"State Key Laboratory of Robotics and Systems, Harbin Institute of Technology, 2 Yikuang, Nangang District, Harbin 150080, China"},{"name":"Department of Mechatronics Engineering, National University of Science and Technology, H-12 Islamabad, Pakistan"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Yongbing","family":"Wen","sequence":"additional","affiliation":[{"name":"State Key Laboratory of Robotics and Systems, Harbin Institute of Technology, 2 Yikuang, Nangang District, Harbin 150080, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Hao","family":"Zhang","sequence":"additional","affiliation":[{"name":"State Key Laboratory of Robotics and Systems, Harbin Institute of Technology, 2 Yikuang, Nangang District, Harbin 150080, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Jianmin","family":"Song","sequence":"additional","affiliation":[{"name":"State Key Laboratory of Robotics and Systems, Harbin Institute of Technology, 2 Yikuang, Nangang District, Harbin 150080, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Hui","family":"Xie","sequence":"additional","affiliation":[{"name":"State Key Laboratory of Robotics and Systems, Harbin Institute of Technology, 2 Yikuang, Nangang District, Harbin 150080, China"}],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"1968","published-online":{"date-parts":[[2018,1,1]]},"reference":[{"key":"ref_1","doi-asserted-by":"crossref","first-page":"340","DOI":"10.1016\/S0167-9317(04)00122-4","article-title":"Analysis of sidewall quality in through-wafer deep reactive-ion etching","volume":"73","author":"Pike","year":"2004","journal-title":"Microelectron. 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