{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,10,28]],"date-time":"2025-10-28T18:36:52Z","timestamp":1761676612833,"version":"build-2065373602"},"reference-count":23,"publisher":"MDPI AG","issue":"4","license":[{"start":{"date-parts":[[2018,4,17]],"date-time":"2018-04-17T00:00:00Z","timestamp":1523923200000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/creativecommons.org\/licenses\/by\/4.0\/"}],"funder":[{"DOI":"10.13039\/501100001809","name":"the National Natural Science Foundation of China","doi-asserted-by":"publisher","award":["51475384"],"award-info":[{"award-number":["51475384"]}],"id":[{"id":"10.13039\/501100001809","id-type":"DOI","asserted-by":"publisher"}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["Sensors"],"abstract":"<jats:p>MEMS fabrication that is based on the silicon-on-glass (SOG) process requires many steps, including patterning, anodic bonding, deep reactive ion etching (DRIE), and chemical mechanical polishing (CMP). The effects of the process parameters of CMP and DRIE are investigated in this study. The process parameters of CMP, such as abrasive size, load pressure, and pH value of SF1 solution are examined to optimize the total thickness variation in the structure and the surface quality. The ratio of etching and passivation cycle time and the process pressure are also adjusted to achieve satisfactory performance during DRIE. The process is optimized to avoid neither the notching nor lag effects on the fabricated silicon structures. For demonstrating the capability of the modified CMP and DRIE processes, a z-axis micro gyroscope is fabricated that is based on the SOG process. Initial test results show that the average surface roughness of silicon is below 1.13 nm and the thickness of the silicon is measured to be 50 \u03bcm. All of the structures are well defined without the footing effect by the use of the modified DRIE process. The initial performance test results of the resonant frequency for the drive and sense modes are 4.048 and 4.076 kHz, respectively. The demands for this kind of SOG MEMS device can be fulfilled using the optimized process.<\/jats:p>","DOI":"10.3390\/s18041240","type":"journal-article","created":{"date-parts":[[2018,4,18]],"date-time":"2018-04-18T03:51:13Z","timestamp":1524023473000},"page":"1240","update-policy":"https:\/\/doi.org\/10.3390\/mdpi_crossmark_policy","source":"Crossref","is-referenced-by-count":16,"title":["Key Processes of Silicon-On-Glass MEMS Fabrication Technology for Gyroscope Application"],"prefix":"10.3390","volume":"18","author":[{"given":"Zhibo","family":"Ma","sequence":"first","affiliation":[{"name":"He Ministry of Education Key Lab of Micro\/Nano Systems for Aerospace (Northwestern Polytechnical University), Ministry of Education, Xi\u2019an 710072, China"},{"name":"Shaan\u2019xi Key Lab of MEMS\/NEMS, Northwestern Polytechnical University, Xi\u2019an 710072, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Yinan","family":"Wang","sequence":"additional","affiliation":[{"name":"He Ministry of Education Key Lab of Micro\/Nano Systems for Aerospace (Northwestern Polytechnical University), Ministry of Education, Xi\u2019an 710072, China"},{"name":"Shaan\u2019xi Key Lab of MEMS\/NEMS, Northwestern Polytechnical University, Xi\u2019an 710072, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Qiang","family":"Shen","sequence":"additional","affiliation":[{"name":"He Ministry of Education Key Lab of Micro\/Nano Systems for Aerospace (Northwestern Polytechnical University), Ministry of Education, Xi\u2019an 710072, China"},{"name":"Shaan\u2019xi Key Lab of MEMS\/NEMS, Northwestern Polytechnical University, Xi\u2019an 710072, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Han","family":"Zhang","sequence":"additional","affiliation":[{"name":"He Ministry of Education Key Lab of Micro\/Nano Systems for Aerospace (Northwestern Polytechnical University), Ministry of Education, Xi\u2019an 710072, China"},{"name":"Shaan\u2019xi Key Lab of MEMS\/NEMS, Northwestern Polytechnical University, Xi\u2019an 710072, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Xuetao","family":"Guo","sequence":"additional","affiliation":[{"name":"He Ministry of Education Key Lab of Micro\/Nano Systems for Aerospace (Northwestern Polytechnical University), Ministry of Education, Xi\u2019an 710072, China"},{"name":"Shaan\u2019xi Key Lab of MEMS\/NEMS, Northwestern Polytechnical University, Xi\u2019an 710072, China"}],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"1968","published-online":{"date-parts":[[2018,4,17]]},"reference":[{"key":"ref_1","doi-asserted-by":"crossref","first-page":"11206","DOI":"10.3390\/s111211206","article-title":"Design, fabrication and levitation experiments of a micromachined electrostatically suspended six-axis accelerometer","volume":"12","author":"Cui","year":"2011","journal-title":"Sensors"},{"key":"ref_2","doi-asserted-by":"crossref","unstructured":"Mansoor, M., Haneef, I., Akhtar, S., Rafiq, M.A., De Luca, A., Ali, S.Z., and Udrea, F. 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