{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,4,2]],"date-time":"2026-04-02T20:11:15Z","timestamp":1775160675968,"version":"3.50.1"},"reference-count":11,"publisher":"MDPI AG","issue":"8","license":[{"start":{"date-parts":[[2018,8,8]],"date-time":"2018-08-08T00:00:00Z","timestamp":1533686400000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/creativecommons.org\/licenses\/by\/4.0\/"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["Sensors"],"abstract":"<jats:p>In this study, we study a heat transfer model, with the surface of the microbolometer device receiving radiation from blackbody constructed using a COMSOL Multiphysics simulator. We have proposed three kinds of L-type 2-leg and 4-leg with the pixel pitch of 35 \u03bcm based on vanadium oxide absorbent membrane sandwiched with top passivated and bottom Si3N4 supporting films, respectively. Under the blackbody radiation, the surface temperature changes and distributions of these samples are simulated and analyzed in detail. The trend of change of the temperature dependent resistance of the four kinds of bolometer devices using the proposed heat transfer model is consistent with the actual results of the change of resistance of 4 samples irradiated with 325 K blackbody located in the front distance of 5 cm. In this paper, \u0394T indicates the averaged differences of the top temperature on the suspended membrane and the lowest temperature on the post of legs of the microbolometers. It is shown that \u0394T \u2248 17 mK is larger in nominal 2-leg microbolometer device than that of 4-leg one and of 2-leg with 2 \u03bcm \u00d7 2 \u03bcm central square hole and two 7.5 \u03bcm \u00d7 2 \u03bcm slits in suspended films. Additionally, only \u0394T \u2248 5 mK with 4-leg microbolometer device under the same radiated energy of 325 K blackbody results from the larger total thermal conductance.<\/jats:p>","DOI":"10.3390\/s18082593","type":"journal-article","created":{"date-parts":[[2018,8,9]],"date-time":"2018-08-09T03:33:48Z","timestamp":1533785628000},"page":"2593","update-policy":"https:\/\/doi.org\/10.3390\/mdpi_crossmark_policy","source":"Crossref","is-referenced-by-count":17,"title":["Experiments on Temperature Changes of Microbolometer under Blackbody Radiation and Predictions Using Thermal Modeling by COMSOL Multiphysics Simulator"],"prefix":"10.3390","volume":"18","author":[{"given":"Yu-Zhen","family":"Deng","sequence":"first","affiliation":[{"name":"Department of Electrical and Electronic Engineering, Chung Cheng Institute of Technology, National Defense University, Taoyuan 33000, Taiwan"}]},{"given":"Shiang-Feng","family":"Tang","sequence":"additional","affiliation":[{"name":"Materials &amp; Electro-Optics Research Division, National Chung Shan Institute of Science and Technology, Taoyuan 32599, Taiwan"}]},{"given":"Hong-Yuan","family":"Zeng","sequence":"additional","affiliation":[{"name":"Department of Electrical and Electronic Engineering, Chung Cheng Institute of Technology, National Defense University, Taoyuan 33000, Taiwan"}]},{"given":"Zheng-Yuan","family":"Wu","sequence":"additional","affiliation":[{"name":"Department of Electrical and Electronic Engineering, Chung Cheng Institute of Technology, National Defense University, Taoyuan 33000, Taiwan"}]},{"given":"Der-Kuo","family":"Tung","sequence":"additional","affiliation":[{"name":"Department of Electrical and Electronic Engineering, Chung Cheng Institute of Technology, National Defense University, Taoyuan 33000, Taiwan"}]}],"member":"1968","published-online":{"date-parts":[[2018,8,8]]},"reference":[{"key":"ref_1","unstructured":"Shuyu, L. (2015, January 20\u201324). Uncooled infrared focal plane array imaging in China. Proceedings of the Conference on Infrared Technology and Applications XLI, Baltimore, MD, USA."},{"key":"ref_2","unstructured":"B\u00e9land, A., Spisser, H., Dufour, D., Lo\u00efc, L.N., Francis, P., and Patrice, T. (February, January 27). Portable LWIR hyperspectral imager based on MEMS Fabry-Perot interferometer and broadband microbolometric detector array. Proceedings of the Conference on MOEMS and Miniaturized Systems XVII, San Francisco, CA, USA."},{"key":"ref_3","doi-asserted-by":"crossref","first-page":"4","DOI":"10.1002\/tee.22563","article-title":"Uncooled infrared focal plane arrays","volume":"13","author":"Masafumi","year":"2018","journal-title":"IEEE Trans. Electr. Electron. Eng."},{"key":"ref_4","unstructured":"Kruse, P.W., and Skatrud, D.D. (1997). 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Technol."},{"key":"ref_8","doi-asserted-by":"crossref","unstructured":"Zhou, P., Chen, R., Wang, N., San, H., and Chen, X. (2016). Reliability design and electro-thermal-optical simulation of bridge-Style infrared thermal emitters. Micromachines, 7.","DOI":"10.3390\/mi7090166"},{"key":"ref_9","first-page":"99","article-title":"Analytical thermo-electric model of uncooled microbolometer","volume":"37","author":"Piotr","year":"2013","journal-title":"Mach. Dyn. Res."},{"key":"ref_10","unstructured":"Thomas, J., Crompton, J.S., and Koppenhoefer, K.C. (2015, January 7\u20139). Multiphysics analysis of Infrared Bolometer. Proceedings of the 2015 COMSOL Conference in Boston, Boston, MA, USA."},{"key":"ref_11","first-page":"6","article-title":"Thermal design of CMOS uncooled infrared Sensors","volume":"4","author":"Chen","year":"2010","journal-title":"Bull. Adv. Technol. Res."}],"container-title":["Sensors"],"original-title":[],"language":"en","link":[{"URL":"https:\/\/www.mdpi.com\/1424-8220\/18\/8\/2593\/pdf","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2025,10,11]],"date-time":"2025-10-11T15:17:16Z","timestamp":1760195836000},"score":1,"resource":{"primary":{"URL":"https:\/\/www.mdpi.com\/1424-8220\/18\/8\/2593"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2018,8,8]]},"references-count":11,"journal-issue":{"issue":"8","published-online":{"date-parts":[[2018,8]]}},"alternative-id":["s18082593"],"URL":"https:\/\/doi.org\/10.3390\/s18082593","relation":{},"ISSN":["1424-8220"],"issn-type":[{"value":"1424-8220","type":"electronic"}],"subject":[],"published":{"date-parts":[[2018,8,8]]}}}