{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,6,3]],"date-time":"2026-06-03T18:44:09Z","timestamp":1780512249705,"version":"3.54.1"},"reference-count":20,"publisher":"MDPI AG","issue":"8","license":[{"start":{"date-parts":[[2018,8,14]],"date-time":"2018-08-14T00:00:00Z","timestamp":1534204800000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/creativecommons.org\/licenses\/by\/4.0\/"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["Sensors"],"abstract":"<jats:p>Alumina ceramic is a highly promising material for fabricating high-temperature pressure sensors. In this paper, a direct bonding method for fabricating a sensitive cavity with alumina ceramic is presented. Alumina ceramic substrates were bonded together to form a sensitive cavity for high-temperature pressure environments. The device can sense pressure parameters at high temperatures. To verify the sensitivity performance of the fabrication method in high-temperature environments, an inductor and capacitor were integrated on the ceramic substrate with the fabricated sensitive cavity to form a wireless passive LC pressure sensor with thick-film integrated technology. Finally, the fabricated sensor was tested using a system test platform. The experimental results show that the sensor can realize pressure measurements above 900 \u00b0C, confirming that the fabricated sensitive cavity has excellent sealing properties. Therefore, the direct bonding method can potentially be used for developing all-ceramic high-temperature pressure sensors for application in harsh environments.<\/jats:p>","DOI":"10.3390\/s18082676","type":"journal-article","created":{"date-parts":[[2018,8,14]],"date-time":"2018-08-14T10:31:16Z","timestamp":1534242676000},"page":"2676","update-policy":"https:\/\/doi.org\/10.3390\/mdpi_crossmark_policy","source":"Crossref","is-referenced-by-count":3,"title":["A Ceramic Diffusion Bonding Method for Passive LC High-Temperature Pressure Sensor"],"prefix":"10.3390","volume":"18","author":[{"given":"Chen","family":"Li","sequence":"first","affiliation":[{"name":"Key Laboratory of Instrumentation Science and Dynamic Measurement, Ministry of Education, North University of China, Taiyuan 030051, China"},{"name":"Science and Technology on Electronic Test &amp; Measurement Laboratory, North University of China, Taiyuan 030051, China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Boshan","family":"Sun","sequence":"additional","affiliation":[{"name":"Key Laboratory of Instrumentation Science and Dynamic Measurement, Ministry of Education, North University of China, Taiyuan 030051, China"},{"name":"Science and Technology on Electronic Test &amp; Measurement Laboratory, North University of China, Taiyuan 030051, China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Yanan","family":"Xue","sequence":"additional","affiliation":[{"name":"Key Laboratory of Instrumentation Science and Dynamic Measurement, Ministry of Education, North University of China, Taiyuan 030051, China"},{"name":"Science and Technology on Electronic Test &amp; Measurement Laboratory, North University of China, Taiyuan 030051, China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Jijun","family":"Xiong","sequence":"additional","affiliation":[{"name":"Key Laboratory of Instrumentation Science and Dynamic Measurement, Ministry of Education, North University of China, Taiyuan 030051, China"},{"name":"Science and Technology on Electronic Test &amp; Measurement Laboratory, North University of China, Taiyuan 030051, China"}],"role":[{"vocabulary":"crossref","role":"author"}]}],"member":"1968","published-online":{"date-parts":[[2018,8,14]]},"reference":[{"key":"ref_1","doi-asserted-by":"crossref","first-page":"164","DOI":"10.1109\/TEPM.2004.843109","article-title":"The changing automotive environment: High-temperature electronics","volume":"27","author":"Johnson","year":"2004","journal-title":"IEEE Trans. Electron. Pack. Manuf."},{"key":"ref_2","unstructured":"Boyce, M.P. (2006). Gas Tubine Engineering Handbook, Gulf Professional Publishing. [3rd ed.]."},{"key":"ref_3","doi-asserted-by":"crossref","first-page":"22","DOI":"10.1016\/j.sna.2014.09.010","article-title":"Evanescent-mode-resonat or-based and antenna-integrated wireless passive pressure sensors for harsh-environment applications","volume":"220","author":"Cheng","year":"2014","journal-title":"Sens. Actuators A Phys."},{"key":"ref_4","doi-asserted-by":"crossref","first-page":"3745","DOI":"10.1109\/JSEN.2014.2322959","article-title":"Passive Wireless sensor application for NASA\u2019s extreme aeronautical environments","volume":"14","author":"William","year":"2014","journal-title":"IEEE Sens."},{"key":"ref_5","doi-asserted-by":"crossref","first-page":"1","DOI":"10.1007\/s00445-007-0120-y","article-title":"Lava effusion rate definition and measurement: A review","volume":"70","author":"Harris","year":"2007","journal-title":"Bull. Volcanol."},{"key":"ref_6","doi-asserted-by":"crossref","first-page":"197","DOI":"10.1016\/j.rse.2011.12.021","article-title":"An emergent strategy for volcano hazard assessment: From thermal satellite monitoring to lava flow modeling","volume":"119","author":"Ganci","year":"2012","journal-title":"Remote Sens. Environ."},{"key":"ref_7","doi-asserted-by":"crossref","first-page":"789","DOI":"10.1109\/LED.2013.2258320","article-title":"Self-Packaging Fabrication of Silicon\u2013Glass-Based Piezoresistive Pressure Sensor","volume":"34","author":"San","year":"2013","journal-title":"IEEE Electron Device Lett."},{"key":"ref_8","doi-asserted-by":"crossref","first-page":"075020","DOI":"10.1088\/0960-1317\/23\/7\/075020","article-title":"Silicon\u2013Glass-based single piezoresistive pressure sensors for harsh environment applications","volume":"23","author":"San","year":"2013","journal-title":"J. Micromech. Microeng."},{"key":"ref_9","doi-asserted-by":"crossref","first-page":"241","DOI":"10.1016\/j.sna.2013.07.013","article-title":"Localized Si\u2013Au eutectic bonding around sunken pad for fabrication of a capacitive absolute pressure sensor","volume":"201","author":"Liu","year":"2013","journal-title":"Sens. Actuators A Phys."},{"key":"ref_10","doi-asserted-by":"crossref","first-page":"1884","DOI":"10.3390\/s130201884","article-title":"A Silicon carbide wireless temperature sensing system for high temperature applications","volume":"13","author":"Yang","year":"2013","journal-title":"Sensors"},{"key":"ref_11","doi-asserted-by":"crossref","first-page":"1663","DOI":"10.1109\/JMEMS.2015.2470132","article-title":"The Piezoresistive Effect of SiC for MEMS Sensors at High Temperatures: A Review","volume":"24","author":"Phan","year":"2015","journal-title":"J. Microelectromech. Syst."},{"key":"ref_12","doi-asserted-by":"crossref","first-page":"319","DOI":"10.1007\/s00542-014-2353-y","article-title":"Development of high temperature resistant of 500 \u00b0C employing silicon carbide (3C\u2013SiC) based MEMS pressure sensor","volume":"21","author":"Noraini","year":"2015","journal-title":"Microsyst. Technol."},{"key":"ref_13","doi-asserted-by":"crossref","first-page":"414","DOI":"10.1109\/TED.2015.2496913","article-title":"4H\u2013SiC p-i-n diode as Highly Linear Temperature Sensor","volume":"63","author":"Rao","year":"2016","journal-title":"IEEE Trans. Electron Devices"},{"key":"ref_14","doi-asserted-by":"crossref","first-page":"174","DOI":"10.1109\/LED.2014.2379262","article-title":"4H\u2013SiC Piezoresistive Pressure Sensors at 800 \u00b0C With Observed Sensitivity Recovery","volume":"36","author":"Okojie","year":"2015","journal-title":"IEEE Trans. Electron Device Lett."},{"key":"ref_15","unstructured":"Fonseca, M.A. (2007). Polymer\/Ceramic Wireless MEMS Pressure Sensors for Harsh Environments: High Temperature and Biomedical Applications. [Ph.D. Thesis, Georgia Institute of Technology]."},{"key":"ref_16","doi-asserted-by":"crossref","first-page":"30","DOI":"10.1016\/j.sna.2013.04.007","article-title":"Wireless LTCC-based Capactive Pressure Sensor for Harsh Environment","volume":"197","author":"Xiong","year":"2013","journal-title":"Sens. Actuators A Phys."},{"key":"ref_17","doi-asserted-by":"crossref","first-page":"9896","DOI":"10.3390\/s130809896","article-title":"A Wireless Passive Pressure Micro-sensor Fabricated in HTCC MEMS Technology for Harsh Environments","volume":"13","author":"Tan","year":"2013","journal-title":"Sensors"},{"key":"ref_18","doi-asserted-by":"crossref","first-page":"4154","DOI":"10.3390\/s140304154","article-title":"A Harsh Environment-Oriented Wireless Passive Temperature Sensor Realized by LTCC Technology","volume":"14","author":"Tan","year":"2014","journal-title":"Sensors"},{"key":"ref_19","doi-asserted-by":"crossref","first-page":"258","DOI":"10.1631\/jzus.C12MNT04","article-title":"Measurement of wireless pressure sensors fabricated in high temperature co-fired ceramic MEMS technology","volume":"14","author":"Xiong","year":"2013","journal-title":"J. Zhejiang Univ. Sci. C"},{"key":"ref_20","doi-asserted-by":"crossref","first-page":"2450","DOI":"10.1109\/TIM.2009.2032966","article-title":"Wireless readout of passive LC sensors","volume":"59","author":"Nopper","year":"2010","journal-title":"IEEE Trans. Instrum. Meas."}],"container-title":["Sensors"],"original-title":[],"language":"en","link":[{"URL":"https:\/\/www.mdpi.com\/1424-8220\/18\/8\/2676\/pdf","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2025,10,11]],"date-time":"2025-10-11T15:18:47Z","timestamp":1760195927000},"score":1,"resource":{"primary":{"URL":"https:\/\/www.mdpi.com\/1424-8220\/18\/8\/2676"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2018,8,14]]},"references-count":20,"journal-issue":{"issue":"8","published-online":{"date-parts":[[2018,8]]}},"alternative-id":["s18082676"],"URL":"https:\/\/doi.org\/10.3390\/s18082676","relation":{},"ISSN":["1424-8220"],"issn-type":[{"value":"1424-8220","type":"electronic"}],"subject":[],"published":{"date-parts":[[2018,8,14]]}}}