{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,5,6]],"date-time":"2026-05-06T16:46:20Z","timestamp":1778085980486,"version":"3.51.4"},"reference-count":28,"publisher":"MDPI AG","issue":"10","license":[{"start":{"date-parts":[[2018,10,19]],"date-time":"2018-10-19T00:00:00Z","timestamp":1539907200000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/creativecommons.org\/licenses\/by\/4.0\/"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["Sensors"],"abstract":"<jats:p>New mobile devices need microphones with a small size, low noise level, reduced cost and high stability respect to variations of temperature and humidity. These characteristics can be obtained using Microelectromechanical Systems (MEMS) microphones, which are substituting for conventional electret condenser microphones (ECM). We present the design and modeling of a capacitive dual-backplate MEMS microphone with a novel circular diaphragm (600 \u00b5m diameter and 2.25 \u00b5m thickness) supported by fifteen polysilicon springs (2.25 \u00b5m thickness). These springs increase the effective area (86.85% of the total area), the linearity and sensitivity of the diaphragm. This design is based on the SUMMiT V fabrication process from Sandia National Laboratories. A lumped element model is obtained to predict the electrical and mechanical behavior of the microphone as a function of the diaphragm dimensions. In addition, models of the finite element method (FEM) are implemented to estimate the resonance frequencies, deflections, and stresses of the diaphragm. The results of the analytical models agree well with those of the FEM models. Applying a bias voltage of 3 V, the designed microphone has a bandwidth from 31 Hz to 27 kHz with 3 dB sensitivity variation, a sensitivity of 34.4 mV\/Pa, a pull-in voltage of 6.17 V and a signal to noise ratio of 62 dBA. The results of the proposed microphone performance are suitable for mobile device applications.<\/jats:p>","DOI":"10.3390\/s18103545","type":"journal-article","created":{"date-parts":[[2018,10,19]],"date-time":"2018-10-19T10:08:02Z","timestamp":1539943682000},"page":"3545","update-policy":"https:\/\/doi.org\/10.3390\/mdpi_crossmark_policy","source":"Crossref","is-referenced-by-count":27,"title":["Design and Modeling of a MEMS Dual-Backplate Capacitive Microphone with Spring-Supported Diaphragm for Mobile Device Applications"],"prefix":"10.3390","volume":"18","author":[{"given":"N\u00e9stor N.","family":"Pe\u00f1a-Garc\u00eda","sequence":"first","affiliation":[{"name":"Departamento de Ingenier\u00eda Mec\u00e1nica, DICIS, Universidad de Guanajuato, Carr. Salamanca-Valle de Santiago km 3.5 + 1.8 km, Palo Blanco, Salamanca, Guanajuato 36885, Mexico"}]},{"given":"Luz A.","family":"Aguilera-Cort\u00e9s","sequence":"additional","affiliation":[{"name":"Departamento de Ingenier\u00eda Mec\u00e1nica, DICIS, Universidad de Guanajuato, Carr. Salamanca-Valle de Santiago km 3.5 + 1.8 km, Palo Blanco, Salamanca, Guanajuato 36885, Mexico"}]},{"given":"Max A.","family":"Gonz\u00e1lez-Palacios","sequence":"additional","affiliation":[{"name":"Departamento de Ingenier\u00eda Mec\u00e1nica, DICIS, Universidad de Guanajuato, Carr. Salamanca-Valle de Santiago km 3.5 + 1.8 km, Palo Blanco, Salamanca, Guanajuato 36885, Mexico"}]},{"given":"Jean-Pierre","family":"Raskin","sequence":"additional","affiliation":[{"name":"Institute of Information and Communication Technologies, Electronics and Applied Mathematics (ICTEAM), Universit\u00e9 catholique de Louvain (UCL), 1348 Louvain-la-Neuve, Belgium"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-7373-9258","authenticated-orcid":false,"given":"Agust\u00edn L.","family":"Herrera-May","sequence":"additional","affiliation":[{"name":"Micro and Nanotechnology Research Center, Universidad Veracruzana, Calzada Ruiz Cortines 455, Boca del R\u00edo, Veracruz 94294, Mexico"},{"name":"Maestr\u00eda en Ingenier\u00eda Aplicada, Facultad de Ingenier\u00eda de la Construcci\u00f3n y el H\u00e1bitat, Universidad Veracruzana, Calzada Ru\u00edz Cortines 455, Boca del R\u00edo, Veracruz 94294, Mexico"}]}],"member":"1968","published-online":{"date-parts":[[2018,10,19]]},"reference":[{"key":"ref_1","doi-asserted-by":"crossref","first-page":"6853","DOI":"10.1109\/JSEN.2015.2464372","article-title":"Acoustical-thermal noise in a capacitive MEMS microphone","volume":"15","author":"Kim","year":"2015","journal-title":"IEEE Sens. 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