{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,5,5]],"date-time":"2026-05-05T21:04:06Z","timestamp":1778015046338,"version":"3.51.4"},"reference-count":16,"publisher":"MDPI AG","issue":"5","license":[{"start":{"date-parts":[[2019,3,7]],"date-time":"2019-03-07T00:00:00Z","timestamp":1551916800000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/creativecommons.org\/licenses\/by\/4.0\/"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["Sensors"],"abstract":"<jats:p>To solve the current problems with thin-film thermocouple signals on turbine blades in ultra-high temperature environments, this study explores the use of a through-hole lead connection technology for high-temperature resistant nickel alloys. The technique includes through-hole processing, insulation layer preparation, and filling and fixing of a high-temperature resistant conductive paste. The through-hole lead connection preparation process was optimized by investigating the influence of the inner diameter of the through-hole, solder volume, and temperature treatment on the contact strength and surface roughness of the thin-film for contact resistance. Finally, the technology was combined with a thin-film thermocouple to perform multiple thermal cycling experiments on the surface of the turbine blade at a temperature of 1000 \u00b0C. The results show that the through-hole lead connection technology can achieve a stable output of the thin-film thermocouple signal on the turbine blade.<\/jats:p>","DOI":"10.3390\/s19051155","type":"journal-article","created":{"date-parts":[[2019,3,8]],"date-time":"2019-03-08T04:58:35Z","timestamp":1552021115000},"page":"1155","update-policy":"https:\/\/doi.org\/10.3390\/mdpi_crossmark_policy","source":"Crossref","is-referenced-by-count":20,"title":["A Through-Hole Lead Connection Method for Thin-Film Thermocouples on Turbine Blades"],"prefix":"10.3390","volume":"19","author":[{"given":"Jinjun","family":"Deng","sequence":"first","affiliation":[{"name":"Key Laboratory of Micro\/Nano Systems for Aerospace, Ministry of Education, Northwestern Polytechnical, University, Xi\u2019an 710072, China"}]},{"given":"Weihua","family":"Wang","sequence":"additional","affiliation":[{"name":"Key Laboratory of Micro\/Nano Systems for Aerospace, Ministry of Education, Northwestern Polytechnical, University, Xi\u2019an 710072, China"}]},{"given":"Liuan","family":"Hui","sequence":"additional","affiliation":[{"name":"Key Laboratory of Micro\/Nano Systems for Aerospace, Ministry of Education, Northwestern Polytechnical, University, Xi\u2019an 710072, China"}]},{"given":"Jietong","family":"Zhang","sequence":"additional","affiliation":[{"name":"Key Laboratory of Micro\/Nano Systems for Aerospace, Ministry of Education, Northwestern Polytechnical, University, Xi\u2019an 710072, China"}]},{"given":"Xinhang","family":"Jin","sequence":"additional","affiliation":[{"name":"Key Laboratory of Micro\/Nano Systems for Aerospace, Ministry of Education, Northwestern Polytechnical, University, Xi\u2019an 710072, China"}]}],"member":"1968","published-online":{"date-parts":[[2019,3,7]]},"reference":[{"key":"ref_1","unstructured":"Li, Y., Li, Z., Xiong, B., and Xiong, Q. (2013, January 25). Current Status and Development of Aeroengine Turbine Blade Temperature Measurement Technology. Proceedings of the Symposium on Aero Engine Design, Manufacturing and Application Technology of China Association of Science and Technology, Guiyang, China."},{"key":"ref_2","first-page":"46","article-title":"The measure method of surface temperature in aero-engine","volume":"28","author":"Cai","year":"2008","journal-title":"Meas. Technol."},{"key":"ref_3","doi-asserted-by":"crossref","first-page":"183","DOI":"10.1016\/j.expthermflusci.2009.10.008","article-title":"A fast response thermocouple for internal combustion engine surface temperature measurements","volume":"34","author":"Marr","year":"2010","journal-title":"Exp. Thermal Fluid Sci."},{"key":"ref_4","unstructured":"Martin, L.C. (1994). 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Durability Evaluation of a Thin Film Sensor System with Enhanced Lead Wire Attachments on SiC\/SiC Ceramic Matrix Composites."}],"container-title":["Sensors"],"original-title":[],"language":"en","link":[{"URL":"https:\/\/www.mdpi.com\/1424-8220\/19\/5\/1155\/pdf","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2025,10,11]],"date-time":"2025-10-11T12:36:59Z","timestamp":1760186219000},"score":1,"resource":{"primary":{"URL":"https:\/\/www.mdpi.com\/1424-8220\/19\/5\/1155"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2019,3,7]]},"references-count":16,"journal-issue":{"issue":"5","published-online":{"date-parts":[[2019,3]]}},"alternative-id":["s19051155"],"URL":"https:\/\/doi.org\/10.3390\/s19051155","relation":{},"ISSN":["1424-8220"],"issn-type":[{"value":"1424-8220","type":"electronic"}],"subject":[],"published":{"date-parts":[[2019,3,7]]}}}