{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,10,16]],"date-time":"2025-10-16T06:58:36Z","timestamp":1760597916795,"version":"build-2065373602"},"reference-count":33,"publisher":"MDPI AG","issue":"18","license":[{"start":{"date-parts":[[2019,9,14]],"date-time":"2019-09-14T00:00:00Z","timestamp":1568419200000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/creativecommons.org\/licenses\/by\/4.0\/"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["Sensors"],"abstract":"<jats:p>Die attach is a typical process that induces thermal stress in the fabrication of microelectromechanical system (MEMS) devices. One solution to this problem is attaching a portion of the die to the package. In such partial die bonding, the lack of control over the spreading of the adhesive can cause non-uniform attachment. In this case, asymmetric packaging stress could be generated and transferred to the die. The performance of MEMS devices, which employ the differential outputs of the sensing elements, is directly affected by the asymmetric packaging stress. In this paper, we proposed a die-attach structure with a pillar to reduce the asymmetric packaging stress and the changes in packaging stress due to changes in the device temperature. To verify the proposed structure, we fabricated four types of differential resonant accelerometers (DRA) with the silicon-on-glass process. We confirmed experimentally that the pillar can control the spreading of the adhesive and that the asymmetric packaging stress is considerably reduced. The simulation and experimental results indicated that the DRAs manufactured using glass-on-silicon wafers as handle substrates instead of conventional glass wafers have a structure that compensates for the thermal stress.<\/jats:p>","DOI":"10.3390\/s19183979","type":"journal-article","created":{"date-parts":[[2019,9,16]],"date-time":"2019-09-16T03:17:57Z","timestamp":1568603877000},"page":"3979","update-policy":"https:\/\/doi.org\/10.3390\/mdpi_crossmark_policy","source":"Crossref","is-referenced-by-count":10,"title":["Die-Attach Structure of Silicon-on-Glass MEMS Devices Considering Asymmetric Packaging Stress and Thermal Stress"],"prefix":"10.3390","volume":"19","author":[{"given":"Jun Eon","family":"An","sequence":"first","affiliation":[{"name":"School of Electronics Engineering, College of IT Engineering, Kyungpook National University, Daegu 41566, Korea"},{"name":"The 3rd R&amp;D Institute\u20144th Directorate, Agency for Defense Development, Daejeon 34186, Korea"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Usung","family":"Park","sequence":"additional","affiliation":[{"name":"The 3rd R&amp;D Institute\u20144th Directorate, Agency for Defense Development, Daejeon 34186, Korea"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Dong Geon","family":"Jung","sequence":"additional","affiliation":[{"name":"School of Electronics Engineering, College of IT Engineering, Kyungpook National University, Daegu 41566, Korea"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Chihyun","family":"Park","sequence":"additional","affiliation":[{"name":"Micro-infinity Co. Ltd., Suwon 16229, Korea"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Seong Ho","family":"Kong","sequence":"additional","affiliation":[{"name":"School of Electronics Engineering, College of IT Engineering, Kyungpook National University, Daegu 41566, Korea"}],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"1968","published-online":{"date-parts":[[2019,9,14]]},"reference":[{"key":"ref_1","unstructured":"O\u2019Neal, C.B., Malshe, A.P., Singh, S.B., Brown, W., and Eaton, W. (1999, January 14\u201317). Challenges in the packaging of MEMS. Proceedings of the International Symposium on Advanced Packaging Materials. Processes, Properties and Interfaces (IEEE Cat. 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