{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,3,19]],"date-time":"2026-03-19T04:51:24Z","timestamp":1773895884248,"version":"3.50.1"},"reference-count":26,"publisher":"MDPI AG","issue":"22","license":[{"start":{"date-parts":[[2019,11,7]],"date-time":"2019-11-07T00:00:00Z","timestamp":1573084800000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/creativecommons.org\/licenses\/by\/4.0\/"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["Sensors"],"abstract":"<jats:p>Three dimensional (3D) imaging technology has been widely used for many applications, such as human\u2013computer interactions, making industrial measurements, and dealing with cultural relics. However, existing active methods often require both large apertures of projector and camera to maximize light throughput, resulting in a shallow working volume in which projector and camera are simultaneously in focus. In this paper, we propose a novel method to extend the working range of the structured light 3D imaging system based on the focal stack. Specifically in the case of large depth variation scenes, we first adopted the gray code method for local, 3D shape measurement with multiple focal distance settings. Then we extracted the texture map of each focus position into a focal stack to generate a global coarse depth map. Under the guidance of the global coarse depth map, the high-quality 3D shape measurement of the overall scene was obtained by local, 3D shape-measurement fusion. To validate the method, we developed a prototype system that can perform high-quality measurements in the depth range of 400 mm with a measurement error of 0.08%.<\/jats:p>","DOI":"10.3390\/s19224845","type":"journal-article","created":{"date-parts":[[2019,11,7]],"date-time":"2019-11-07T06:52:36Z","timestamp":1573109556000},"page":"4845","update-policy":"https:\/\/doi.org\/10.3390\/mdpi_crossmark_policy","source":"Crossref","is-referenced-by-count":22,"title":["Guided, Fusion-Based, Large Depth-of-field 3D Imaging Using a Focal Stack"],"prefix":"10.3390","volume":"19","author":[{"ORCID":"https:\/\/orcid.org\/0000-0002-6193-753X","authenticated-orcid":false,"given":"Yuhao","family":"Xiao","sequence":"first","affiliation":[{"name":"Department of Electronic Engineering, Tsinghua University, Beijing 100084, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-2131-3044","authenticated-orcid":false,"given":"Guijin","family":"Wang","sequence":"additional","affiliation":[{"name":"Department of Electronic Engineering, Tsinghua University, Beijing 100084, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Xiaowei","family":"Hu","sequence":"additional","affiliation":[{"name":"Department of Electronic Engineering, Tsinghua University, Beijing 100084, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Chenbo","family":"Shi","sequence":"additional","affiliation":[{"name":"ShanDong MingJia Technology Co., Ltd., Taian 271021, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Long","family":"Meng","sequence":"additional","affiliation":[{"name":"ShanDong MingJia Technology Co., Ltd., Taian 271021, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Huazhong","family":"Yang","sequence":"additional","affiliation":[{"name":"Department of Electronic Engineering, Tsinghua University, Beijing 100084, China"}],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"1968","published-online":{"date-parts":[[2019,11,7]]},"reference":[{"key":"ref_1","doi-asserted-by":"crossref","unstructured":"Liberadzki, P., Adamczyk, M., Witkowski, M., and Sitnik, R. 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