{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,5,14]],"date-time":"2026-05-14T22:52:54Z","timestamp":1778799174737,"version":"3.51.4"},"reference-count":24,"publisher":"MDPI AG","issue":"1","license":[{"start":{"date-parts":[[2019,12,18]],"date-time":"2019-12-18T00:00:00Z","timestamp":1576627200000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/creativecommons.org\/licenses\/by\/4.0\/"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["Sensors"],"abstract":"<jats:p>Despite all the growth forecasts of the smart textiles market, there is no stable automated manufacturing process for attaching classic electronics to textiles. The great amount of manual production steps causes high prices, which slow down market growth. During the production process, the contacting step offers the greatest potential to reduce manual manufacturing steps. For this reason, we have analyzed various contacting methods for electronic parts on conductive yarns that have a high potential for automation. The chosen methods were thermode soldering, insulation\u2013displacement connectors and anisotropic conductive adhesives. In order to ensure reliable mechanical contacting, the samples were tested in a peeling experiment. The examination of the contact resistances took place in the context of a resistance test using four-wire measuring technology.<\/jats:p>","DOI":"10.3390\/s20010005","type":"journal-article","created":{"date-parts":[[2019,12,23]],"date-time":"2019-12-23T03:15:01Z","timestamp":1577070901000},"page":"5","update-policy":"https:\/\/doi.org\/10.3390\/mdpi_crossmark_policy","source":"Crossref","is-referenced-by-count":13,"title":["Analysis of Hot Bar Soldering, Insulation Displacement Connections (IDC), and Anisotropic Conductive Adhesives (ACA), for the Automated Production of Smart Textiles"],"prefix":"10.3390","volume":"20","author":[{"ORCID":"https:\/\/orcid.org\/0000-0001-7808-5727","authenticated-orcid":false,"given":"Sebastian","family":"Micus","sequence":"first","affiliation":[{"name":"German Institutes of Textile and Fiber Research DITF, 73770 Denkendorf, Germany"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Ivan","family":"Kirsten","sequence":"additional","affiliation":[{"name":"German Institutes of Textile and Fiber Research DITF, 73770 Denkendorf, Germany"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-3489-7157","authenticated-orcid":false,"given":"Michael","family":"Haupt","sequence":"additional","affiliation":[{"name":"German Institutes of Textile and Fiber Research DITF, 73770 Denkendorf, Germany"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"G\u00f6tz T.","family":"Gresser","sequence":"additional","affiliation":[{"name":"German Institutes of Textile and Fiber Research DITF, 73770 Denkendorf, Germany"}],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"1968","published-online":{"date-parts":[[2019,12,18]]},"reference":[{"key":"ref_1","unstructured":"Ohnemus, J. (2018). FashionTech-Smart Textiles: Kurzexpertise im Auftrag des BMWi, ZEW Zentrum f\u00fcr europ\u00e4ische Wirtschaftsforschung."},{"key":"ref_2","doi-asserted-by":"crossref","unstructured":"Jones, M.T., Martin, T.L., and Sawyer, B. (2008, January 13\u201317). An Architecture for Electronic Textiles. Proceedings of the ICST 3rd International Conference on Body Area Networks, Tempe, AZ, USA.","DOI":"10.4108\/ICST.BODYNETS2008.2967"},{"key":"ref_3","first-page":"106","article-title":"Locally LSR Over-Molding of Textile Integrated Actors and Sensors","volume":"1","author":"Micus","year":"2019","journal-title":"J. Multidiscip. Res. Rev."},{"key":"ref_4","doi-asserted-by":"crossref","unstructured":"Kirstein, T. (2013). Multidisciplinary Know-How for Smart-Textiles Developers, Elsevier.","DOI":"10.1533\/9780857093530"},{"key":"ref_5","unstructured":"Armada Miyachi (2019, July 30). Hot Bar Reflow Soldering Fundamentals: A High Quality Selective Soldering Technology. Available online: http:\/\/www.amadamiyachi.com\/servlet\/servlet.FileDownload?retURL=%2Fapex%2Feducational-resources_articles&file=01580000001d0TZ."},{"key":"ref_6","unstructured":"Klein Wassink, R. (1991). Weichloeten in der Elektronik, Leuza."},{"key":"ref_7","unstructured":"Sprivieri, J. (2019, May 07). Step Up to the Bar-Hot-Bar Soldering Attached Flex Circuits to Printed Curcuit Boards. Available online: https:\/\/www.assemblymag.com\/articles\/84473-step-up-to-the-bar."},{"key":"ref_8","unstructured":"Fuchs, A. (2017). Thermode for an electrically heated soldering head. (Patent: DE102015224741A1)."},{"key":"ref_9","unstructured":"Fehrenbach, M. (2019, July 10). Prozesse f\u00fcr zuverl\u00e4ssige Verbindungen. Available online: https:\/\/eutect.de\/wp-content\/uploads\/2019\/11\/EUTECT-Prozess-und-Modulbroschu%CC%88re-2019.pdf."},{"key":"ref_10","unstructured":"Woznicki, T. (2019, July 10). Hot-Bar Soldering Attaching Flex CircuitsDirectly to Rigid Boards. Available online: http:\/\/www.flexdude.com\/Back%20Issues\/FCN11-00A.PDF."},{"key":"ref_11","unstructured":"J\u00f6rgens, S. (2004, January 23). Insulation Displacement Technology as Technically Equvalent and more Cost-Effective Alternative Compared to Crimp Technology. Proceedings of the 50th IEEE Holm Conference on Electrical Contacts: The 22nd International Conference on Electrical Contacts, Seattle, WA, USA."},{"key":"ref_12","unstructured":"Lehn, D. (2003, January 21\u201323). Ettachments for E-Textiles. Proceedings of the 7th IEEE International Symposium, White Plains, NY, USA."},{"key":"ref_13","unstructured":"Lehn, D. (2019, July 25). E-Tags E-Textiles Attached Gadgets. Virginia Polytechnic Institute and State University. Available online: https:\/\/www.semanticscholar.org\/paper\/e-TAGs%3A-e-Textile-Attached-Gadgets-Lehn-Neely\/37aa41e6db057925761956d6ac02dfc0e7b904b2."},{"key":"ref_14","doi-asserted-by":"crossref","unstructured":"Martin, T., Jones, M., Chong, J., Quirk, M., Baumann, K., and Passauer, L. (2009). Design and Implementation of an Electronic Textile Jumpsuit, IEEE.","DOI":"10.1109\/ISWC.2009.25"},{"key":"ref_15","doi-asserted-by":"crossref","unstructured":"Linz, T., Krshiwoblozki, M., and Walter, H. (2010). Novel Packaging Technology for Body Sensor Net-Works Based on Adhesive Bonding A Low Cost, Mass Producible and High Reliability Solution, IEEE.","DOI":"10.1109\/BSN.2010.56"},{"key":"ref_16","doi-asserted-by":"crossref","first-page":"1139","DOI":"10.1080\/00405000.2012.664867","article-title":"Contacting electronics to fabric circuits with nonconductive adhesive bonding","volume":"103","author":"Linz","year":"2012","journal-title":"J. Text. Inst."},{"key":"ref_17","first-page":"1","article-title":"Electronics in Textiles\u2014Adhesive Bonding Technology for Reliably Embedding Electronic Modules into Textile Circuits","volume":"85","author":"Linz","year":"2012","journal-title":"AST"},{"key":"ref_18","unstructured":"Jones, I.A., and Wise, R.J. (2019, July 26). Novel Joining Methods Applicable to Textiles and Smart Garments. Available online: https:\/\/www.twi-global.com\/technical-knowledge\/published-papers\/novel-joining-methods-applicable-to-textiles-and-smart-garments-september-2005."},{"key":"ref_19","unstructured":"Haberland, J. (2013). Flip Chip Adhesive Bond Technologies, Fraunhofer IZM."},{"key":"ref_20","unstructured":"J\u00f6rgens, S. (2007). Design von Schneidklemmverbindungen mit FEM-Simulation. Elektron. Prax., Available online: https:\/\/www.elektronikpraxis.vogel.de\/design-von-schneidklemmverbindungen-mit-fem-simulation-a-94508\/."},{"key":"ref_21","unstructured":"Zollinger, R. (2019, May 07). Effektive und sichere Feldmontage mit der Schneidklemmtechnik. Available online: https:\/\/www.elektrotechnik.vogel.de\/effektive-und-sichere-feldmontage-mit-der-schneidklemmtechnik-a-93862\/."},{"key":"ref_22","doi-asserted-by":"crossref","unstructured":"Habenicht, G. (2009). Kleben: Grundlagen, Technologien, Anwendungen, Springer. [6th ed.].","DOI":"10.1007\/978-3-540-85266-7"},{"key":"ref_23","doi-asserted-by":"crossref","first-page":"208","DOI":"10.1109\/95.705466","article-title":"Overview of conductive adhesive interconnection technologies for LCDs","volume":"21","author":"Kristiansen","year":"1998","journal-title":"IEEE Trans. Comp. Packag. Manuf. Technol. A"},{"key":"ref_24","unstructured":"Simon, E., Kallmayer, C., Aschenbrenner, R., and Lang, K.-D. (2010). Novel Approach for Integrating Electronics into Textiles at Room Temperature using a Force-Fit Interconnection, IEEE."}],"container-title":["Sensors"],"original-title":[],"language":"en","link":[{"URL":"https:\/\/www.mdpi.com\/1424-8220\/20\/1\/5\/pdf","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2025,10,11]],"date-time":"2025-10-11T13:43:14Z","timestamp":1760190194000},"score":1,"resource":{"primary":{"URL":"https:\/\/www.mdpi.com\/1424-8220\/20\/1\/5"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2019,12,18]]},"references-count":24,"journal-issue":{"issue":"1","published-online":{"date-parts":[[2020,1]]}},"alternative-id":["s20010005"],"URL":"https:\/\/doi.org\/10.3390\/s20010005","relation":{},"ISSN":["1424-8220"],"issn-type":[{"value":"1424-8220","type":"electronic"}],"subject":[],"published":{"date-parts":[[2019,12,18]]}}}