{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,5,6]],"date-time":"2026-05-06T04:40:26Z","timestamp":1778042426005,"version":"3.51.4"},"reference-count":107,"publisher":"MDPI AG","issue":"3","license":[{"start":{"date-parts":[[2020,1,28]],"date-time":"2020-01-28T00:00:00Z","timestamp":1580169600000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/creativecommons.org\/licenses\/by\/4.0\/"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["Sensors"],"abstract":"<jats:p>The paper presents a review of some of the significant research done on 3D printed mold-based sensors performed in recent times. The utilization of the master molds to fabricate the different parts of the sensing prototypes have been followed for quite some time due to certain distinct advantages. Some of them are easy template preparation, easy customization of the developed products, quick fabrication, and minimized electronic waste. The paper explains the different kinds of sensors and actuators that have been developed using this technique, based on their varied structural dimensions, processed raw materials, designing, and product testing. These differences in the attributes were based on their individualistic application. Furthermore, some of the challenges related to the existing sensors and their possible respective solutions have also been mentioned in the paper. Finally, a market survey has been provided, stating the estimated increase in the annual growth of 3D printed sensors. It also states the type of 3D printing that has been preferred over the years, along with the range of sensors, and their related applications.<\/jats:p>","DOI":"10.3390\/s20030703","type":"journal-article","created":{"date-parts":[[2020,1,28]],"date-time":"2020-01-28T09:37:09Z","timestamp":1580204229000},"page":"703","update-policy":"https:\/\/doi.org\/10.3390\/mdpi_crossmark_policy","source":"Crossref","is-referenced-by-count":55,"title":["Recent Progress in 3D Printed Mold-Based Sensors"],"prefix":"10.3390","volume":"20","author":[{"given":"Shan","family":"He","sequence":"first","affiliation":[{"name":"School of Chemistry and Chemical Engineering, Guangzhou University, Guangzhou 510006, China"},{"name":"Institute for NanoScale Scale Science and Technology, College of Science and Engineering, Flinders University, Bedford Park 5042, Australia"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Shilun","family":"Feng","sequence":"additional","affiliation":[{"name":"School of Electrical and Electronic Engineering, Nanyang Technological University, Singapore 639798, Singapore"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Anindya","family":"Nag","sequence":"additional","affiliation":[{"name":"DGUT-CNAM Institute, Dongguan University of Technology, Dongguan 523808, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Nasrin","family":"Afsarimanesh","sequence":"additional","affiliation":[{"name":"DGUT-CNAM Institute, Dongguan University of Technology, Dongguan 523808, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-8422-9288","authenticated-orcid":false,"given":"Tao","family":"Han","sequence":"additional","affiliation":[{"name":"DGUT-CNAM Institute, Dongguan University of Technology, Dongguan 523808, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Subhas Chandra","family":"Mukhopadhyay","sequence":"additional","affiliation":[{"name":"School of Engineering, Macquarie University, Sydney 2109, Australia"}],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"1968","published-online":{"date-parts":[[2020,1,28]]},"reference":[{"key":"ref_1","doi-asserted-by":"crossref","first-page":"678","DOI":"10.1016\/j.future.2017.09.010","article-title":"A review of the smart world","volume":"96","author":"Liu","year":"2019","journal-title":"Future Gener. 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