{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,7,7]],"date-time":"2026-07-07T05:14:55Z","timestamp":1783401295440,"version":"3.54.6"},"reference-count":30,"publisher":"MDPI AG","issue":"15","license":[{"start":{"date-parts":[[2020,7,22]],"date-time":"2020-07-22T00:00:00Z","timestamp":1595376000000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/creativecommons.org\/licenses\/by\/4.0\/"}],"funder":[{"DOI":"10.13039\/501100013076","name":"National Major Science and Technology Projects of China","doi-asserted-by":"publisher","award":["2017ZX02519"],"award-info":[{"award-number":["2017ZX02519"]}],"id":[{"id":"10.13039\/501100013076","id-type":"DOI","asserted-by":"publisher"}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["Sensors"],"abstract":"<jats:p>To meet the urgent market demand for small package size and high reliability performance for automotive CMOS image sensor (CIS) application, wafer level chip scale packaging (WLCSP) technology using through silicon vias (TSV) needs to be developed to replace current chip on board (COB) packages. In this paper, a WLCSP with the size of 5.82 mm \u00d7 5.22 mm and thickness of 850 \u03bcm was developed for the backside illumination (BSI) CIS chip using a 65 nm node with a size of 5.8 mm \u00d7 5.2 mm. The packaged product has 1392 \u00d7 976 pixels and a resolution of up to 60 frames per second with more than 120 dB dynamic range. The structure of the 3D package was designed and the key fabrication processes on a 12\u201d inch wafer were investigated. More than 98% yield and excellent optical performance of the CIS package was achieved after process optimization. The final packages were qualified by AEC-Q100 Grade 2.<\/jats:p>","DOI":"10.3390\/s20154077","type":"journal-article","created":{"date-parts":[[2020,7,22]],"date-time":"2020-07-22T07:31:28Z","timestamp":1595403088000},"page":"4077","update-policy":"https:\/\/doi.org\/10.3390\/mdpi_crossmark_policy","source":"Crossref","is-referenced-by-count":13,"title":["Development of Reliable, High Performance WLCSP for BSI CMOS Image Sensor for Automotive Application"],"prefix":"10.3390","volume":"20","author":[{"given":"Tianshen","family":"Zhou","sequence":"first","affiliation":[{"name":"School of Materials Science and Engineering, Shanghai Jiao Tong University, Shanghai 200240, China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Shuying","family":"Ma","sequence":"additional","affiliation":[{"name":"Huatian Technology (Kunshan) Electronics Co., Ltd., Kunshan 215300, China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Daquan","family":"Yu","sequence":"additional","affiliation":[{"name":"School of Electronic Science and Engineering, Xiamen University, Xiamen 361005, China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Ming","family":"Li","sequence":"additional","affiliation":[{"name":"School of Materials Science and Engineering, Shanghai Jiao Tong University, Shanghai 200240, China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Tao","family":"Hang","sequence":"additional","affiliation":[{"name":"School of Materials Science and Engineering, Shanghai Jiao Tong University, Shanghai 200240, China"}],"role":[{"vocabulary":"crossref","role":"author"}]}],"member":"1968","published-online":{"date-parts":[[2020,7,22]]},"reference":[{"key":"ref_1","doi-asserted-by":"crossref","first-page":"395","DOI":"10.1109\/TITS.2011.2159493","article-title":"Cognitive cars: A new frontier for ADAS research","volume":"13","author":"Li","year":"2011","journal-title":"IEEE Trans. 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