{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,6,10]],"date-time":"2026-06-10T16:52:52Z","timestamp":1781110372557,"version":"3.54.1"},"reference-count":33,"publisher":"MDPI AG","issue":"15","license":[{"start":{"date-parts":[[2020,7,22]],"date-time":"2020-07-22T00:00:00Z","timestamp":1595376000000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/creativecommons.org\/licenses\/by\/4.0\/"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["Sensors"],"abstract":"<jats:p>Recently, the press-pack insulated gate bipolar transistor (IGBT) has usually been used in direct current (DC) transmission. The press-pack IGBT (PPI) adopts a parallel layout of boss chips, and the currents of each chip will be uneven in the process of turning on and off, which will affect the reliability of the device. To measure the currents of each chip, based on the analysis of the principle and equivalent model of the Rogowski coil, this paper puts forward the design scheme and design index of multi-layer printed circuit board (PCB) Rogowski coil with good high-frequency performance, strong anti-interference ability and sufficient sensitivity. With the simulation analysis of Altium Designer and ANSYS softwares, a 1 mm thick, 76-turn integrated four-layer PCB Rogowski coil is designed. Then, adding a composite integrator, an integrated Rogowski coil sensor for measurement of PPI chips currents is designed. The Pspice simulation and the experiment results show that the sensor is fully satisfied with the chip current measurement.<\/jats:p>","DOI":"10.3390\/s20154080","type":"journal-article","created":{"date-parts":[[2020,7,23]],"date-time":"2020-07-23T11:26:01Z","timestamp":1595503561000},"page":"4080","update-policy":"https:\/\/doi.org\/10.3390\/mdpi_crossmark_policy","source":"Crossref","is-referenced-by-count":20,"title":["Integrated Rogowski Coil Sensor for Press-Pack Insulated Gate Bipolar Transistor Chips"],"prefix":"10.3390","volume":"20","author":[{"given":"Chaoqun","family":"Jiao","sequence":"first","affiliation":[{"name":"School of Electrical Engineering, Beijing Jiaotong University, No.3 ShangYuanCun, Haidian District, Beijing 100044, China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Zuoming","family":"Zhang","sequence":"additional","affiliation":[{"name":"Rizhao Power Supply Company of State Grid Shandong Electric Power Company, Yantai Road 68, Donggang District, Rizhao, Shandong 276800, China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Zhibin","family":"Zhao","sequence":"additional","affiliation":[{"name":"State Key Laboratory of Alternate Electrical Power System with Renewable Energy Sources, North China Electric Power University, No.2, Beinong Road, Changping District, Beijing 102206, China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Xiumin","family":"Zhang","sequence":"additional","affiliation":[{"name":"School of Electrical Engineering, Beijing Jiaotong University, No.3 ShangYuanCun, Haidian District, Beijing 100044, China"}],"role":[{"vocabulary":"crossref","role":"author"}]}],"member":"1968","published-online":{"date-parts":[[2020,7,22]]},"reference":[{"key":"ref_1","doi-asserted-by":"crossref","unstructured":"Bock, B., Krafft, E., and Steimel, A. (2003, January 2\u20134). Measurement of multiple chip current in a Press-Pack IGBT using Rogowski Coils. Proceedings of the 10th European Conference on Power Electronics an Applications (EPE), Toulouse, France.","DOI":"10.1080\/09398368.2003.11463526"},{"key":"ref_2","doi-asserted-by":"crossref","unstructured":"M\u00fcsing, A., Ortiz, G., and Kolar, J.W. (2010, January 21\u201324). Optimization of the current distribution in press-pack high power IGBT modules. Proceedings of the 2010 International Power Electronics Conference, Sapporo, Japan.","DOI":"10.1109\/IPEC.2010.5543573"},{"key":"ref_3","doi-asserted-by":"crossref","unstructured":"Alvarez, R., and Bernet, S. (2011). A new delay time compensation principle for parallel connected IGBTs. IEEE Energy Convers. Congr. Expo. (ECCE).","DOI":"10.1109\/ECCE.2011.6064173"},{"key":"ref_4","doi-asserted-by":"crossref","first-page":"3485","DOI":"10.1109\/TIA.2014.2305905","article-title":"Sinusoidal Current Operation of Delay-Time Compensation for Parallel-Connected IGBTs","volume":"50","author":"Alvarez","year":"2012","journal-title":"IEEE Trans. Ind. Appl."},{"key":"ref_5","doi-asserted-by":"crossref","unstructured":"Mo, S., Zhao, Z., Sun, P., Lu, Y., and Tang, X. (2017, January 16\u201319). Influence of package parasitic inductance on transient current distribution characteristics of press pack igbt. Proceedings of the 2017 Sixth Asia-Pacific Conference on Antennas and Propagation (APCAP), Xi\u2019an, China.","DOI":"10.1109\/APCAP.2017.8420381"},{"key":"ref_6","doi-asserted-by":"crossref","unstructured":"Long, H.Y., Sweet, M.R., Narayanan, E.M.S., and Li, G. (2017, January 26\u201330). Reliability study and modelling of IGBT press-pack power modules. Proceedings of the 2017 IEEE Applied Power Electronics Conference and Exposition (APEC), Tampa, FL, USA.","DOI":"10.1109\/APEC.2017.7931082"},{"key":"ref_7","doi-asserted-by":"crossref","unstructured":"Zhu, N., Chen, M., Yan, R., Mantooth, A., and Xu, D. (2018, January 23\u201327). Die Current Balancing of a Press-Pack SiC MOSFET. Proceedings of the 2018 IEEE Energy Conversion Congress and Exposition (ECCE), Portland, OR, USA.","DOI":"10.1109\/ECCE.2018.8557940"},{"key":"ref_8","doi-asserted-by":"crossref","unstructured":"Chen, Z., Zhang, X., Pan, Y., and Li, J. (2018, January 4\u20137). Research on the Current Distribution Characteristics within a Single Chip of press pack IGBT. Proceedings of the 2018 IEEE International Power Electronics and Application Conference and Exposition (PEAC), Shenzhen, China.","DOI":"10.1109\/PEAC.2018.8590314"},{"key":"ref_9","doi-asserted-by":"crossref","unstructured":"Xianwei, M., Mengyue, H., Heli, M., Yangchun, C., and Jun, Z. (2018, January 10\u201313). Research on the Measuring System for IGBT Current Distribution. Proceedings of the 2018 IEEE International Conference on High Voltage Engineering and Application (ICHVE), Athens, Greece.","DOI":"10.1109\/ICHVE.2018.8641908"},{"key":"ref_10","doi-asserted-by":"crossref","unstructured":"Deng, Z. (2020). Influence of Uneven Pressure Distribution on Current Distribution in Paralleled Multi-Chips Press Pack IGBT. Smart Grid.","DOI":"10.12677\/SG.2020.103008"},{"key":"ref_11","unstructured":"Li, H.Y., and Jiang, G.X. (1989). A Rogowski coil of nS order for measuring fast-rising high current. Adv. Technol. Electr. Eng. Energy, 40\u201345."},{"key":"ref_12","first-page":"41","article-title":"Development of nanosecond Rogowsky coil","volume":"25","author":"Li","year":"1991","journal-title":"J. Xi\u2019an Jiaotong Univ."},{"key":"ref_13","first-page":"53","article-title":"Frequency response analysis of passive RC integrator","volume":"34","author":"Bing","year":"2008","journal-title":"High Volt. Technol."},{"key":"ref_14","doi-asserted-by":"crossref","unstructured":"Gerber, D., Guillod, T., and Biela, J. (2011, January 19\u201323). IGBT gate-drive with PCB Rogowski Coil for improved short circuit detection and current turn-off capability. Proceedings of the IEEE Pulsed Power Conference, Chicago, IL, USA.","DOI":"10.1109\/PPC.2011.6191615"},{"key":"ref_15","doi-asserted-by":"crossref","first-page":"2641","DOI":"10.1109\/TPS.2013.2280379","article-title":"Gate Unit with Improved Short-Circuit Detection and Turn-Off Capability for 4.5-kV Press-Pack IGBTs Operated at 4-kA Pulse Current","volume":"41","author":"Gerber","year":"2013","journal-title":"IEEE Trans. Plasma Sci."},{"key":"ref_16","unstructured":"Minjiang, X. (2013). Research on the Characteristics and Application Technology of Traveling Wave Based on Rogowski coil. [Ph.D. thesis, Shandong University]."},{"key":"ref_17","doi-asserted-by":"crossref","unstructured":"Liu, Y., Xie, X., Hu, Y., Qian, Y., Sheng, G., and Jiang, X. (2016). A Novel Transient Fault Current Sensor Based on the PCB Rogowski Coil for Overhead Transmission. Sensors, 16.","DOI":"10.3390\/s16050742"},{"key":"ref_18","doi-asserted-by":"crossref","first-page":"344","DOI":"10.1109\/TEMC.2013.2252906","article-title":"Design of PCB Rogowski Coil and Analysis of Anti-interference Property","volume":"58","author":"Tao","year":"2016","journal-title":"IEEE Trans. Electromagn. Compat."},{"key":"ref_19","unstructured":"Koga, M., Tsukuda, M., Nakashima, K., and Omura, I. (2016, January 8\u201310). Application-specific micro Rogowski Coil for power modules-Design tool, novel coil pattern and demonstration. Proceedings of the CIPS 2016, 9th International Conference on Integrated Power Electronics Systems, Nuremberg, Germany."},{"key":"ref_20","doi-asserted-by":"crossref","first-page":"479","DOI":"10.1016\/j.microrel.2016.07.011","article-title":"Micro PCB Rogowski Coil for current monitoring and protection of high voltage power modules","volume":"64","author":"Tsukuda","year":"2016","journal-title":"Microelectron. Reliab."},{"key":"ref_21","doi-asserted-by":"crossref","first-page":"517","DOI":"10.1016\/j.microrel.2017.06.026","article-title":"Clamp type built-in current sensor using PCB in high-voltage power modules","volume":"76","author":"Tsukuda","year":"2017","journal-title":"Microelectron. Reliab."},{"key":"ref_22","doi-asserted-by":"crossref","unstructured":"Jun, Y., Li, G., Liu, H., Yang, G., and Ling, G. (2016, January 25\u201330). Design of a flexible rogowski coil with active integrator applied in lightning current collection. Proceedings of the 2016 33rd International Conference on Lightning Protection (ICLP), Estoril, Portugal.","DOI":"10.1109\/ICLP.2016.7791472"},{"key":"ref_23","doi-asserted-by":"crossref","first-page":"1536","DOI":"10.1109\/TPWRD.2017.2765400","article-title":"HDI PCB Rogowski Coils for Automated Electrical Power System Applications","volume":"33","author":"Habrych","year":"2018","journal-title":"IEEE Trans. Power Deliv."},{"key":"ref_24","unstructured":"Lei, M., Zhen, X., and Changqing, Y. (2019, January 17\u201321). Screen-Returned PCB Rogowski Coil for the Switch Current Measurement of SiC Devices. Proceedings of the 2019 IEEE Applied Power Electronics Conference and Exposition (APEC), Anaheim, CA, USA."},{"key":"ref_25","doi-asserted-by":"crossref","first-page":"6786","DOI":"10.1109\/JSEN.2019.2914730","article-title":"PCB Rogowski Coils for 300kA Current Measurement on a Multi-Split Conductor","volume":"19","author":"Gu","year":"2019","journal-title":"IEEE Sens. J."},{"key":"ref_26","doi-asserted-by":"crossref","first-page":"765","DOI":"10.1049\/iet-pel.2019.0694","article-title":"Structure and modelling of four-layer screen-returned PCB Rogowski coil with very few turns for high-bandwidth SiC current measurement","volume":"13","author":"Ming","year":"2020","journal-title":"IET Power Electron."},{"key":"ref_27","doi-asserted-by":"crossref","first-page":"5801","DOI":"10.1109\/JSEN.2020.2974403","article-title":"A Design Method of Pcb Rogowski Coil in Limited Space and Modified Integral Circuit","volume":"20","author":"Wang","year":"2020","journal-title":"IEEE Sens. J."},{"key":"ref_28","doi-asserted-by":"crossref","first-page":"141","DOI":"10.1007\/BF01656479","article-title":"Die Messung der magnetischen Spannung","volume":"1","author":"Rogowski","year":"1912","journal-title":"Archiv. F\u00fcr Elektrotechnik"},{"key":"ref_29","doi-asserted-by":"crossref","first-page":"511","DOI":"10.1109\/19.492777","article-title":"Machinable Rogowski Coil, design and calibration","volume":"45","author":"Ramboz","year":"1996","journal-title":"IEEE Trans. Instrum. Meas."},{"key":"ref_30","doi-asserted-by":"crossref","unstructured":"Wang, C., Chen, Y., Zhang, G., and Zhou, Z. (2007, January 5\u20139). Design of Printed-Circuit Board Rogowski Coil for Highly Accurate Current Measurement. Proceedings of the International Conference on Mechatronics and Automation, Harbin, China.","DOI":"10.1109\/ICMA.2007.4304180"},{"key":"ref_31","doi-asserted-by":"crossref","unstructured":"Ahmed, A., Coulbeck, L., Castellazzi, A., and Johnson, C.M. (2012, January 4\u20136). Design and test of a PCB Rogowski coil for very high dI\/dt detection. Proceedings of the 15th International Power Electronics and Motion Control Conference, EPE-PEMC 2012 ECCE Europe, Novi Sad, Serbia.","DOI":"10.1109\/EPEPEMC.2012.6397192"},{"key":"ref_32","unstructured":"(2020, May 02). Electromagnetic Compatibility\u2013Test and Measurement Techniques\u2013Surge Immunity Test. Available online: https:\/\/global.ihs.com\/doc_detail.cfm?document_name=IEC%2061000%2D4%2D5&item_s_key=00223184."},{"key":"ref_33","unstructured":"(2020, May 02). Semiconductor Devices-Discrete Devices-Part9: Insulated-Gate Bipolar Transistors (IGBTs). Available online: https:\/\/webstore.iec.ch\/publication\/32214."}],"container-title":["Sensors"],"original-title":[],"language":"en","link":[{"URL":"https:\/\/www.mdpi.com\/1424-8220\/20\/15\/4080\/pdf","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2025,10,11]],"date-time":"2025-10-11T09:50:44Z","timestamp":1760176244000},"score":1,"resource":{"primary":{"URL":"https:\/\/www.mdpi.com\/1424-8220\/20\/15\/4080"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2020,7,22]]},"references-count":33,"journal-issue":{"issue":"15","published-online":{"date-parts":[[2020,8]]}},"alternative-id":["s20154080"],"URL":"https:\/\/doi.org\/10.3390\/s20154080","relation":{},"ISSN":["1424-8220"],"issn-type":[{"value":"1424-8220","type":"electronic"}],"subject":[],"published":{"date-parts":[[2020,7,22]]}}}