{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,3,12]],"date-time":"2026-03-12T12:09:31Z","timestamp":1773317371755,"version":"3.50.1"},"reference-count":20,"publisher":"MDPI AG","issue":"7","license":[{"start":{"date-parts":[[2021,3,28]],"date-time":"2021-03-28T00:00:00Z","timestamp":1616889600000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/creativecommons.org\/licenses\/by\/4.0\/"}],"funder":[{"DOI":"10.13039\/501100003725","name":"National Research Foundation of Korea","doi-asserted-by":"publisher","award":["2020R1F1A1052571"],"award-info":[{"award-number":["2020R1F1A1052571"]}],"id":[{"id":"10.13039\/501100003725","id-type":"DOI","asserted-by":"publisher"}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["Sensors"],"abstract":"<jats:p>A readout circuit incorporating a pixel-level analog-to-digital converter (ADC) is studied for two-dimensional medium wavelength infrared microbolometer arrays. The signal-to-noise ratio (SNR) and charge handling capacity of the unit cell circuit are improved by using the current input pixel-level ADC. The charge handling capacity of the integrator is appropriately extended to maximize the integration time regardless of the magnitude of the input current and low power supply voltage. The readout circuit was fabricated using a 0.35-\u03bcm 2-poly 4-metal CMOS process for a 640 \u00d7 512 array with a pixel size of 40 \u03bcm \u00d7 40 \u03bcm. The peak SNR and dynamic range are 77.1 and 80.1 dB, respectively, with a power consumption of 0.62 \u03bcW per pixel.<\/jats:p>","DOI":"10.3390\/s21072354","type":"journal-article","created":{"date-parts":[[2021,3,28]],"date-time":"2021-03-28T23:27:25Z","timestamp":1616974045000},"page":"2354","update-policy":"https:\/\/doi.org\/10.3390\/mdpi_crossmark_policy","source":"Crossref","is-referenced-by-count":5,"title":["Current Input Pixel-Level ADC with High SNR and Wide Dynamic Range for a Microbolometer"],"prefix":"10.3390","volume":"21","author":[{"given":"Jeongho","family":"Lee","sequence":"first","affiliation":[{"name":"School of Information, Communications and Electronics Engineering, The Catholic University of Korea, Gyeonggi-do 14662, Korea"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0000-0001-7326-2253","authenticated-orcid":false,"given":"Ilku","family":"Nam","sequence":"additional","affiliation":[{"name":"Department of Electrical Engineering, Pusan National University, Busan 46241, Korea"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0000-0001-8803-4966","authenticated-orcid":false,"given":"DooHyung","family":"Woo","sequence":"additional","affiliation":[{"name":"School of Information, Communications and Electronics Engineering, The Catholic University of Korea, Gyeonggi-do 14662, Korea"}],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"1968","published-online":{"date-parts":[[2021,3,28]]},"reference":[{"key":"ref_1","doi-asserted-by":"crossref","unstructured":"Akin, T. (2020, January 18\u201322). Low-Cost LWIR-Band CMOS Infrared (CIR) Microbolometers for High Volume Applications. Proceedings of the IEEE 33rd International Conference on MEMS, Vancouver, BC, Canada.","DOI":"10.1109\/MEMS46641.2020.9056383"},{"key":"ref_2","doi-asserted-by":"crossref","first-page":"909","DOI":"10.1109\/JSEN.2019.2944236","article-title":"A Digital Readout IC for Microbolometer Imagers Offering Low Power and Improved Self-Heating Compensation","volume":"20","author":"Abbasi","year":"2020","journal-title":"IEEE Sens. J."},{"key":"ref_3","doi-asserted-by":"crossref","first-page":"10221","DOI":"10.1109\/JSEN.2019.2928462","article-title":"Uncooled Long-Wavelength Infrared Sensors Using Cytochrome C Protein on Suspension Electrodes with CMOS Readout Circuits","volume":"19","author":"Yen","year":"2019","journal-title":"IEEE Sens. J."},{"key":"ref_4","doi-asserted-by":"crossref","first-page":"350","DOI":"10.1109\/TTHZ.2018.2819502","article-title":"Low-Noise Readout Integrated Circuit for Terahertz Array Detector","volume":"8","author":"Jiang","year":"2018","journal-title":"IEEE Trans. Terahertz Sci. Technol."},{"key":"ref_5","doi-asserted-by":"crossref","first-page":"220","DOI":"10.1016\/S0924-4247(00)00313-7","article-title":"Readout architectures for uncooled IR detector arrays","volume":"84","author":"Jakonis","year":"2000","journal-title":"Sens. Actuators"},{"key":"ref_6","doi-asserted-by":"crossref","first-page":"606","DOI":"10.1109\/TCSII.2005.850456","article-title":"Novel current mode background suppression for 2-D LWIR application","volume":"52","author":"Woo","year":"2005","journal-title":"IEEE Trans. Circuits Syst."},{"key":"ref_7","doi-asserted-by":"crossref","first-page":"553","DOI":"10.1109\/TCSII.2005.848984","article-title":"Multiple integration method for a high signal-to-noise ratio readout integrated circuit","volume":"52","author":"Kang","year":"2005","journal-title":"IEEE Trans. Circuits Syst. Express Briefs"},{"key":"ref_8","doi-asserted-by":"crossref","first-page":"1054","DOI":"10.1049\/el.2015.0491","article-title":"14-bit 20 \u03bcW column-level two-step ADC for 640 \u00d7 512 IRFPA","volume":"51","author":"Wang","year":"2015","journal-title":"Electron. Lett."},{"key":"ref_9","first-page":"1922","article-title":"A 14-bit differential-ramp single-slope column-level ADC for 640 \u00d7 512 uncooled infrared imager","volume":"22","author":"Liu","year":"2016","journal-title":"IEEE Int. Symp. Circuits Syst."},{"key":"ref_10","first-page":"1","article-title":"A 16-bit Single-Slope based Pixel-level ADC for 15\u03bcm-pitch 640\u00d7512 MWIR FPAs","volume":"27","author":"Huang","year":"2018","journal-title":"IEEE Int. Symp. Circuits Syst."},{"key":"ref_11","doi-asserted-by":"crossref","first-page":"7227","DOI":"10.1109\/JSEN.2016.2599181","article-title":"Very Wide Dynamic Range ROIC With Pixel-Level ADC for SWIR FPAs","volume":"16","author":"Jo","year":"2016","journal-title":"IEEE Sens. J."},{"key":"ref_12","first-page":"W1","article-title":"Design of ADC in 25 \u03bcm pixels pitch dedicated for IRFPA image processing at LETI","volume":"Volume 6542","author":"Tchagaspanian","year":"2007","journal-title":"Infrared Technology and Applications"},{"key":"ref_13","doi-asserted-by":"crossref","first-page":"115009\u20131\u20135","DOI":"10.1088\/1674-4926\/35\/11\/115009","article-title":"Pixel-level A\/D conversion using voltage reset technique","volume":"35","author":"Li","year":"2014","journal-title":"J. Semicond."},{"key":"ref_14","doi-asserted-by":"crossref","first-page":"1909","DOI":"10.1587\/transele.E94.C.1909","article-title":"Pixel-level ADC with two-step integration for 2-D microbolometer IRFPA","volume":"94","author":"Hwang","year":"2011","journal-title":"Ieice Trans. Electron."},{"key":"ref_15","doi-asserted-by":"crossref","first-page":"208","DOI":"10.1117\/12.178483","article-title":"Approaches and analysis for on-focal-plane analog-to-digital conversion","volume":"Volume 2226","author":"Pain","year":"1994","journal-title":"Infrared Readout Electronics II"},{"key":"ref_16","doi-asserted-by":"crossref","unstructured":"Yang, S., Luo, L., Lu, W., Shi, G., Lyu, B., Niu, Y., Zhang, Y., and Chen, Z. (2017, January 28). A 16-bit two-step pixel-level ADCfor 384\u2217288 infrared focal plane array. Proceedings of the IEEE 12th International Conference on ASIC (ASICON), Guiyang, China.","DOI":"10.1109\/ASICON.2017.8252592"},{"key":"ref_17","doi-asserted-by":"crossref","unstructured":"Robert, J., and Valencic, V. (1985, January 16\u201318). Offset and Charge Injection Compensation in an Incremental Analog to Digital Converter. Proceedings of the 11th European Solid-State Circuits Conference (ESSCIRC), Montreux, Switzerland.","DOI":"10.1109\/ESSCIRC.1985.5467982"},{"key":"ref_18","doi-asserted-by":"crossref","first-page":"82","DOI":"10.1109\/JSEN.2014.2339317","article-title":"TEC-Less ROIC With Self-Bias Equalization for Microbolometer FPA","volume":"15","author":"Jo","year":"2015","journal-title":"IEEE Sens. J."},{"key":"ref_19","doi-asserted-by":"crossref","first-page":"732","DOI":"10.1049\/el:20080879","article-title":"Pixelwise readout circuit with current mirroring injection for microbolometer FPAs","volume":"44","author":"Hwang","year":"2008","journal-title":"Electron. Lett."},{"key":"ref_20","doi-asserted-by":"crossref","unstructured":"Nitta, Y., Muramatsu, Y., Amano, K., Toyama, T., Yamamoto, J., Mishina, M., Suzuki, A., Taura, T., Kato, A., and Kikuchi, M. (2006, January 5\u20139). High-Speed Digital Double Sampling with Analog CDS on Column Parallel ADC Architecture for Low-Noise Active Pixel Sensor. Proceedings of the IEEE International Solid State Circuits Conference, Francisco, CA, USA.","DOI":"10.1109\/ISSCC.2006.1696261"}],"container-title":["Sensors"],"original-title":[],"language":"en","link":[{"URL":"https:\/\/www.mdpi.com\/1424-8220\/21\/7\/2354\/pdf","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2025,10,13]],"date-time":"2025-10-13T13:53:14Z","timestamp":1760363594000},"score":1,"resource":{"primary":{"URL":"https:\/\/www.mdpi.com\/1424-8220\/21\/7\/2354"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2021,3,28]]},"references-count":20,"journal-issue":{"issue":"7","published-online":{"date-parts":[[2021,4]]}},"alternative-id":["s21072354"],"URL":"https:\/\/doi.org\/10.3390\/s21072354","relation":{},"ISSN":["1424-8220"],"issn-type":[{"value":"1424-8220","type":"electronic"}],"subject":[],"published":{"date-parts":[[2021,3,28]]}}}