{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,4,7]],"date-time":"2026-04-07T15:56:28Z","timestamp":1775577388219,"version":"3.50.1"},"reference-count":39,"publisher":"MDPI AG","issue":"9","license":[{"start":{"date-parts":[[2021,5,10]],"date-time":"2021-05-10T00:00:00Z","timestamp":1620604800000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/creativecommons.org\/licenses\/by\/4.0\/"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["Sensors"],"abstract":"<jats:p>This paper reports on a new approach to face verification in long-wavelength infrared radiation. Two face images were combined into one double image, which was then used as an input for a classification based on neural networks. For testing, we exploited two external and one homemade thermal face databases acquired in various variants. The method is reported to achieve a true acceptance rate of about 83%. We proved that the proposed method outperforms other studied baseline methods by about 20 percentage points. We also analyzed the issue of extending the performance of algorithms. We believe that the proposed double image method can also be applied to other spectral ranges and modalities different than the face.<\/jats:p>","DOI":"10.3390\/s21093301","type":"journal-article","created":{"date-parts":[[2021,5,10]],"date-time":"2021-05-10T12:49:49Z","timestamp":1620650989000},"page":"3301","update-policy":"https:\/\/doi.org\/10.3390\/mdpi_crossmark_policy","source":"Crossref","is-referenced-by-count":4,"title":["Thermal Face Verification through Identification"],"prefix":"10.3390","volume":"21","author":[{"ORCID":"https:\/\/orcid.org\/0000-0002-2641-8419","authenticated-orcid":false,"given":"Artur","family":"Grudzie\u0144","sequence":"first","affiliation":[{"name":"Institute of Optoelectronics, Military University of Technology, 2 Gen. S. 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