{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,10,13]],"date-time":"2025-10-13T20:04:14Z","timestamp":1760385854605,"version":"build-2065373602"},"reference-count":39,"publisher":"MDPI AG","issue":"13","license":[{"start":{"date-parts":[[2021,6,24]],"date-time":"2021-06-24T00:00:00Z","timestamp":1624492800000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/creativecommons.org\/licenses\/by\/4.0\/"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["Sensors"],"abstract":"<jats:p>In this paper, small-sized acoustic horns, the sensitivity enhancement package for the MEMS-based thermal acoustic particle velocity sensor, have been designed and optimized. Four kinds of acoustic horns, including tube horn, double cone horn, double paradox horn, and exponential horn, were analyzed through numerical calculation. Considering both the amplification factor and effective length of amplification zone, a small-sized double cone horn with middle tube is designed and further optimized. A three-wire thermal acoustic particle velocity sensor was fabricated and packaged in the 3D printed double cone tube (DCT) horn. Experiment results show that an amplification factor of 6.63 at 600 Hz and 6.93 at 1 kHz was achieved. A good 8-shape directivity pattern was also obtained for the optimized DCT horn with the lateral inhibition ratio of 50.3 dB. No additional noise was introduced, demonstrating the DCT horn\u2019s potential in improving the sensitivity of acoustic particle velocity sensors.<\/jats:p>","DOI":"10.3390\/s21134337","type":"journal-article","created":{"date-parts":[[2021,6,24]],"date-time":"2021-06-24T23:22:14Z","timestamp":1624576934000},"page":"4337","update-policy":"https:\/\/doi.org\/10.3390\/mdpi_crossmark_policy","source":"Crossref","is-referenced-by-count":5,"title":["Design and Optimization of Sensitivity Enhancement Package for MEMS-Based Thermal Acoustic Particle Velocity Sensor"],"prefix":"10.3390","volume":"21","author":[{"given":"Wenhan","family":"Chang","sequence":"first","affiliation":[{"name":"Institute of Microelectronics, Peking University, Beijing 100871, China"}]},{"given":"Lingmeng","family":"Yang","sequence":"additional","affiliation":[{"name":"Institute of Microelectronics, Peking University, Beijing 100871, China"}]},{"given":"Zhezheng","family":"Zhu","sequence":"additional","affiliation":[{"name":"Institute of Microelectronics, Peking University, Beijing 100871, China"}]},{"given":"Zhenchuan","family":"Yang","sequence":"additional","affiliation":[{"name":"Institute of Microelectronics, Peking University, Beijing 100871, China"}]},{"given":"Yilong","family":"Hao","sequence":"additional","affiliation":[{"name":"Institute of Microelectronics, Peking University, Beijing 100871, China"}]},{"given":"Chengchen","family":"Gao","sequence":"additional","affiliation":[{"name":"Institute of Microelectronics, Peking University, Beijing 100871, China"}]}],"member":"1968","published-online":{"date-parts":[[2021,6,24]]},"reference":[{"key":"ref_1","unstructured":"Kino, G. 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