{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,10,29]],"date-time":"2025-10-29T03:51:52Z","timestamp":1761709912279,"version":"build-2065373602"},"reference-count":37,"publisher":"MDPI AG","issue":"5","license":[{"start":{"date-parts":[[2022,3,3]],"date-time":"2022-03-03T00:00:00Z","timestamp":1646265600000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/creativecommons.org\/licenses\/by\/4.0\/"}],"funder":[{"DOI":"10.13039\/501100003661","name":"Korea Institute for Advancement of Technology","doi-asserted-by":"publisher","award":["P0012770"],"award-info":[{"award-number":["P0012770"]}],"id":[{"id":"10.13039\/501100003661","id-type":"DOI","asserted-by":"publisher"}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["Sensors"],"abstract":"<jats:p>Fault diagnosis systems are used to improve the productivity and reduce the costs of the manufacturing process. However, the feature variables in existing systems are extracted based on the classification performance of the final model, thereby limiting their applications to models with different conditions. This paper proposes an algorithm to improve the characteristics of feature variables by considering the cutting conditions. Regardless of the frequency band, the noise of the measurement data was reduced through an oversampling method, setting a window length through a cutter sampling frequency, and improving its sensitivity to shock signal. An experiment was subsequently performed to confirm the performance of the model. Using normal and wear tools on AI7075 and SM45C, the diagnosis accuracies were 97.1% and 95.6%, respectively, with a reduction of 85% and 83%, respectively, in the time required to develop a diagnosis model. Therefore, the proposed algorithm reduced the model computation time and developed a model with high accuracy by enhancing the characteristics of the feature variable. The results of this study can contribute significantly to the establishment of a high-precision monitoring system for various processing processes.<\/jats:p>","DOI":"10.3390\/s22051975","type":"journal-article","created":{"date-parts":[[2022,3,3]],"date-time":"2022-03-03T20:36:30Z","timestamp":1646339790000},"page":"1975","update-policy":"https:\/\/doi.org\/10.3390\/mdpi_crossmark_policy","source":"Crossref","is-referenced-by-count":5,"title":["Tool-Condition Diagnosis Model with Shock-Sharpening Algorithm for Drilling Process"],"prefix":"10.3390","volume":"22","author":[{"ORCID":"https:\/\/orcid.org\/0000-0003-4233-612X","authenticated-orcid":false,"given":"Byeonghui","family":"Park","sequence":"first","affiliation":[{"name":"Department of Mechanical Design and Production Engineering, Konkuk University, Seoul 05030, Korea"}]},{"ORCID":"https:\/\/orcid.org\/0000-0003-2396-9044","authenticated-orcid":false,"given":"Yoonjae","family":"Lee","sequence":"additional","affiliation":[{"name":"Department of Mechanical Design and Production Engineering, Konkuk University, Seoul 05030, Korea"}]},{"given":"Myeonghwan","family":"Yeo","sequence":"additional","affiliation":[{"name":"Department of Mechanical Design and Production Engineering, Konkuk University, Seoul 05030, Korea"}]},{"given":"Haemi","family":"Lee","sequence":"additional","affiliation":[{"name":"Department of Mechanical Design and Production Engineering, Konkuk University, Seoul 05030, Korea"}]},{"given":"Changbeom","family":"Joo","sequence":"additional","affiliation":[{"name":"Department of Mechanical Engineering, Stevens Institute of Technology, 1 Castle Pointe Terrace, Hoboken, NJ 07030, USA"}]},{"ORCID":"https:\/\/orcid.org\/0000-0001-9862-2833","authenticated-orcid":false,"given":"Changwoo","family":"Lee","sequence":"additional","affiliation":[{"name":"Department of Mechanical and Aerospace Engineering, Konkuk University, Seoul 05030, Korea"}]}],"member":"1968","published-online":{"date-parts":[[2022,3,3]]},"reference":[{"key":"ref_1","doi-asserted-by":"crossref","unstructured":"Peng, C.Y., Raihany, U., Kuo, S.W., and Chen, Y.Z. 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