{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,7,20]],"date-time":"2026-07-20T15:43:26Z","timestamp":1784562206979,"version":"3.55.0"},"reference-count":22,"publisher":"MDPI AG","issue":"14","license":[{"start":{"date-parts":[[2022,7,19]],"date-time":"2022-07-19T00:00:00Z","timestamp":1658188800000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/creativecommons.org\/licenses\/by\/4.0\/"}],"funder":[{"DOI":"10.13039\/501100001659","name":"German Research Foundation","doi-asserted-by":"publisher","award":["418311604"],"award-info":[{"award-number":["418311604"]}],"id":[{"id":"10.13039\/501100001659","id-type":"DOI","asserted-by":"publisher"}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["Sensors"],"abstract":"<jats:p>Structural health monitoring of lightweight constructions made of composite materials can be performed using guided ultrasonic waves. If modern fiber metal laminates are used, this requires integrated sensors that can record the inner displacement oscillations caused by the propagating guided ultrasonic waves. Therefore, we developed a robust MEMS vibrometer that can be integrated while maintaining the structural and functional compliance of the laminate. This vibrometer is directly sensitive to the high-frequency displacements from structure-borne ultrasound when excited in a frequency range between its first and second eigenfrequency. The vibrometer is mostly realized by processes earlier developed for a pressure sensor but with additional femtosecond laser ablation and encapsulation. The piezoresistive transducer, made from silicon, is encapsulated between top and bottom glass lids. The eigenfrequencies are experimentally determined using an optical micro vibrometer setup. The MEMS vibrometer functionality and usability for structural health monitoring are demonstrated on a customized test rig by recording application-relevant guided ultrasonic wave packages with a central frequency of 100 kHz at a distance of 0.2 m from the exciting ultrasound transducer.<\/jats:p>","DOI":"10.3390\/s22145368","type":"journal-article","created":{"date-parts":[[2022,7,19]],"date-time":"2022-07-19T05:37:53Z","timestamp":1658209073000},"page":"5368","update-policy":"https:\/\/doi.org\/10.3390\/mdpi_crossmark_policy","source":"Crossref","is-referenced-by-count":12,"title":["MEMS Vibrometer for Structural Health Monitoring Using Guided Ultrasonic Waves"],"prefix":"10.3390","volume":"22","author":[{"ORCID":"https:\/\/orcid.org\/0000-0003-2702-4152","authenticated-orcid":false,"given":"Jan Niklas","family":"Haus","sequence":"first","affiliation":[{"name":"Institute of Microtechnology, Technische Universit\u00e4t Braunschweig, 38124 Braunschweig, Germany"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-9813-5231","authenticated-orcid":false,"given":"Walter","family":"Lang","sequence":"additional","affiliation":[{"name":"Institute for Microsensors, Actuators and Systems, University of Bremen, 28359 Bremen, Germany"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-8834-710X","authenticated-orcid":false,"given":"Thomas","family":"Roloff","sequence":"additional","affiliation":[{"name":"Institute of Mechanics and Adaptronics, Technische Universit\u00e4t Braunschweig, 38106 Braunschweig, Germany"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-8651-5042","authenticated-orcid":false,"given":"Liv","family":"Rittmeier","sequence":"additional","affiliation":[{"name":"Institute of Mechanics and Adaptronics, Technische Universit\u00e4t Braunschweig, 38106 Braunschweig, Germany"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-1840-3591","authenticated-orcid":false,"given":"Sarah","family":"Bornemann","sequence":"additional","affiliation":[{"name":"Institute for Microsensors, Actuators and Systems, University of Bremen, 28359 Bremen, Germany"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-1873-9140","authenticated-orcid":false,"given":"Michael","family":"Sinapius","sequence":"additional","affiliation":[{"name":"Institute of Mechanics and Adaptronics, Technische Universit\u00e4t Braunschweig, 38106 Braunschweig, Germany"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0003-2090-6259","authenticated-orcid":false,"given":"Andreas","family":"Dietzel","sequence":"additional","affiliation":[{"name":"Institute of Microtechnology, Technische Universit\u00e4t Braunschweig, 38124 Braunschweig, Germany"}],"role":[{"vocabulary":"crossref","role":"author"}]}],"member":"1968","published-online":{"date-parts":[[2022,7,19]]},"reference":[{"key":"ref_1","doi-asserted-by":"crossref","unstructured":"Giurgiutiu, V. (2008). Structural Health Monitoring with Piezoelectric Wafer Active Sensors, Academic Press\/Elsevier.","DOI":"10.1016\/B978-012088760-6.50008-8"},{"key":"ref_2","doi-asserted-by":"crossref","unstructured":"Lammering, R., Gabbert, U., Sinapius, M., Schuster, T., and Wierach, P. (2017). Lamb-Wave Based Structural Health Monitoring in Polymer Composites, Springer.","DOI":"10.1007\/978-3-319-49715-0"},{"key":"ref_3","doi-asserted-by":"crossref","first-page":"11090","DOI":"10.1109\/JSEN.2019.2935158","article-title":"Multi-Frequency Piezoelectric Micromachined Ultrasonic Transducers","volume":"19","author":"Kazari","year":"2019","journal-title":"IEEE Sensors J."},{"key":"ref_4","doi-asserted-by":"crossref","first-page":"5693","DOI":"10.1007\/s11664-019-07383-4","article-title":"Fabrication and Annealing Temperature Optimization for a Piezoelectric ZnO Based MEMS Acoustic Sensor","volume":"48","author":"Kumar","year":"2019","journal-title":"J. Electron. Mater."},{"key":"ref_5","doi-asserted-by":"crossref","first-page":"112212","DOI":"10.1016\/j.sna.2020.112212","article-title":"Towards a better understanding of the CMUTs potential for SHM applications","volume":"313","author":"Butaud","year":"2020","journal-title":"Sens. Actuators A Phys."},{"key":"ref_6","first-page":"354","article-title":"Impact and acoustic emission performance of polyvinylidene fluoride sensor embedded in glass fiber-reinforced polymer composite structure","volume":"29","author":"Jain","year":"2021","journal-title":"Polym. Polym. Compos."},{"key":"ref_7","doi-asserted-by":"crossref","first-page":"260","DOI":"10.1016\/j.matpr.2020.03.081","article-title":"Fatigue testing and damage evaluation using smart CFRP composites with embedded PZT transducers","volume":"34","author":"Andreades","year":"2021","journal-title":"Mater. Today Proc."},{"key":"ref_8","doi-asserted-by":"crossref","unstructured":"Feng, T., and Aliabadi, M.H.F. (2021). Structural Integrity Assessment of Composites Plates with Embedded PZT Transducers for Structural Health Monitoring. Materials, 14.","DOI":"10.3390\/ma14206148"},{"key":"ref_9","doi-asserted-by":"crossref","unstructured":"Chen, X., Maxwell, L., Li, F., Kumar, A., Ransom, E., Topac, T., Lee, S., Faisal Haider, M., Dardona, S., and Chang, F.K. (2020). Design and Integration of a Wireless Stretchable Multimodal Sensor Network in a Composite Wing. Sensors, 20.","DOI":"10.3390\/s20092528"},{"key":"ref_10","doi-asserted-by":"crossref","first-page":"178","DOI":"10.1007\/s10921-014-0226-z","article-title":"Effect of localized microstructure evolution on higher harmonic generation of guided waves","volume":"33","author":"Lissenden","year":"2014","journal-title":"J. Nondestruct. Eval."},{"key":"ref_11","doi-asserted-by":"crossref","unstructured":"Haus, J.N., Rittmeier, L., Roloff, T., Mikhaylenko, A., Bornemann, S., Sinapius, M., Rauter, N., Lang, W., and Dietzel, A. (2021). Micro-Oscillator as Integrable Sensor for Structure-Borne Ultrasound. Eng. Proc., 10.","DOI":"10.3390\/ecsa-8-11313"},{"key":"ref_12","unstructured":"Analog Devices (2022, June 14). 3-Axis, \u00b12 g\/\u00b14 g\/\u00b18 g\/\u00b116 g Digital Accelerometer. 2022. Rev. G. Available online: https:\/\/www.analog.com\/media\/en\/technical-documentation\/data-sheets\/ADXL345.pdf."},{"key":"ref_13","unstructured":"STMicroelectronics (2022, June 14). MEMS Digital Output Motion Sensor: High-Performance 3-Axis Accelerometer for Automobile Applications. 2021. Rev. 4. Available online: https:\/\/www.st.com\/resource\/en\/datasheet\/ais2ih.pdf."},{"key":"ref_14","doi-asserted-by":"crossref","unstructured":"Younis, M.I. (2011). MEMS Linear and Nonlinear Statics and Dynamics, Springer Science & Business Media.","DOI":"10.1007\/978-1-4419-6020-7"},{"key":"ref_15","unstructured":"Lang, W. (2019). Sensors and Measurement Systems, River Publishers."},{"key":"ref_16","unstructured":"Inman, D.J., and Singh, R.C. (1994). Engineering Vibration, Prentice Hall."},{"key":"ref_17","unstructured":"Meirovitch, L. (1967). Analytical Methods in Vibrations, McMillan Pub. Co. Inc."},{"key":"ref_18","unstructured":"Weaver, W., Timoshenko, S.P., and Young, D.H. (1991). Vibration Problems in Engineering, John Wiley & Sons."},{"key":"ref_19","doi-asserted-by":"crossref","unstructured":"Haus, J.N., Schwerter, M., Schneider, M., G\u00e4ding, M., Leester-Sch\u00e4del, M., Schmid, U., and Dietzel, A. (2021). Robust Pressure Sensor in SOI Technology with Butterfly Wiring for Airfoil Integration. Sensors, 21.","DOI":"10.3390\/s21186140"},{"key":"ref_20","doi-asserted-by":"crossref","first-page":"202","DOI":"10.1061\/(ASCE)CP.1943-5487.0000081","article-title":"Graphical user interface for guided acoustic waves","volume":"25","author":"Bocchini","year":"2011","journal-title":"J. Comput. Civ. Eng."},{"key":"ref_21","doi-asserted-by":"crossref","unstructured":"Rittmeier, L., Roloff, T., Haus, J.N., Dietzel, A., and Sinapius, M. (2021). Design of a Characterisation Environment for a MEMS Ultrasound Sensor under Guided Ultrasonic Wave Excitation. Eng. Proc., 10.","DOI":"10.3390\/ecsa-8-11306"},{"key":"ref_22","doi-asserted-by":"crossref","unstructured":"Bornemann, S., and Lang, W. (2021). Experimental Study on Stress Impact during FML Manufacturing on the Functional Conformity of an Embeddable SHM-Sensor-Node. Eng. Proc., 10.","DOI":"10.3390\/ecsa-8-11323"}],"container-title":["Sensors"],"original-title":[],"language":"en","link":[{"URL":"https:\/\/www.mdpi.com\/1424-8220\/22\/14\/5368\/pdf","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2025,10,10]],"date-time":"2025-10-10T23:53:32Z","timestamp":1760140412000},"score":1,"resource":{"primary":{"URL":"https:\/\/www.mdpi.com\/1424-8220\/22\/14\/5368"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2022,7,19]]},"references-count":22,"journal-issue":{"issue":"14","published-online":{"date-parts":[[2022,7]]}},"alternative-id":["s22145368"],"URL":"https:\/\/doi.org\/10.3390\/s22145368","relation":{"has-preprint":[{"id-type":"doi","id":"10.20944\/preprints202206.0245.v1","asserted-by":"object"}]},"ISSN":["1424-8220"],"issn-type":[{"value":"1424-8220","type":"electronic"}],"subject":[],"published":{"date-parts":[[2022,7,19]]}}}