{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,7,25]],"date-time":"2026-07-25T17:25:17Z","timestamp":1785000317964,"version":"3.55.0"},"reference-count":21,"publisher":"MDPI AG","issue":"15","license":[{"start":{"date-parts":[[2022,8,7]],"date-time":"2022-08-07T00:00:00Z","timestamp":1659830400000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/creativecommons.org\/licenses\/by\/4.0\/"}],"funder":[{"name":"Natural Sciences and Engineering Research Council of Canada"},{"name":"Regrouppement Strat\u00e9gique pour la Micro\u00e9lectronique du Qu\u00e9bec"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["Sensors"],"abstract":"<jats:p>This paper presents a method to monitor the thermal peaks that are major concerns when designing Integrated Circuits (ICs) in various advanced technologies. The method aims at detecting the thermal peak in Systems on Chip (SoC) using arrays of oscillators distributed over the area of the chip. Measured frequencies are mapped to local temperatures that are used to produce a chip thermal mapping. Then, an indication of the local temperature of a single heat source is obtained in real-time using the Gradient Direction Sensor (GDS) technique. The proposed technique does not require external sensors, and it provides a real-time monitoring of thermal peaks. This work is performed with Field-Programmable Gate Array (FPGA), which acts as a System-on-Chip, and the detected heat source is validated with a thermal camera. A maximum error of 0.3 \u00b0C is reported between thermal camera and FPGA measurements.<\/jats:p>","DOI":"10.3390\/s22155904","type":"journal-article","created":{"date-parts":[[2022,8,9]],"date-time":"2022-08-09T04:16:55Z","timestamp":1660018615000},"page":"5904","update-policy":"https:\/\/doi.org\/10.3390\/mdpi_crossmark_policy","source":"Crossref","is-referenced-by-count":14,"title":["Towards Real-Time Monitoring of Thermal Peaks in Systems-on-Chip (SoC)"],"prefix":"10.3390","volume":"22","author":[{"ORCID":"https:\/\/orcid.org\/0000-0002-4472-6124","authenticated-orcid":false,"given":"Aziz","family":"Oukaira","sequence":"first","affiliation":[{"name":"Electrical Engineering Department, Polytechnique Montreal, Montreal, QC H3T 1J4, Canada"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-2215-5375","authenticated-orcid":false,"given":"Ahmad","family":"Hassan","sequence":"additional","affiliation":[{"name":"Electrical Engineering Department, Polytechnique Montreal, Montreal, QC H3T 1J4, Canada"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-7476-7920","authenticated-orcid":false,"given":"Mohamed","family":"Ali","sequence":"additional","affiliation":[{"name":"Electrical Engineering Department, Polytechnique Montreal, Montreal, QC H3T 1J4, Canada"},{"name":"Microelectronics Department, Electronics Research Institute, Cairo 12622, Egypt"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-3404-9959","authenticated-orcid":false,"given":"Yvon","family":"Savaria","sequence":"additional","affiliation":[{"name":"Electrical Engineering Department, Polytechnique Montreal, Montreal, QC H3T 1J4, Canada"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0003-1781-3211","authenticated-orcid":false,"given":"Ahmed","family":"Lakhssassi","sequence":"additional","affiliation":[{"name":"Department of Engineering Computer Science, University of Qu\u00e9bec in Outaouais, Gatineau, QC J8X 3X7, Canada"}],"role":[{"vocabulary":"crossref","role":"author"}]}],"member":"1968","published-online":{"date-parts":[[2022,8,7]]},"reference":[{"key":"ref_1","doi-asserted-by":"crossref","first-page":"24540","DOI":"10.1109\/ACCESS.2022.3152379","article-title":"A Versatile SoC\/SiP Sensor Interface for Industrial Applications: Implementation Challenges","volume":"10","author":"Ali","year":"2022","journal-title":"IEEE Access"},{"key":"ref_2","doi-asserted-by":"crossref","first-page":"802","DOI":"10.1109\/TCPMT.2021.3064030","article-title":"A Review of Recent Research on Heat Transfer in Three-Dimensional Integrated Circuits (3D ICs)","volume":"11","author":"Salvi","year":"2021","journal-title":"IEEE Trans. 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Solid State Circuits"}],"container-title":["Sensors"],"original-title":[],"language":"en","link":[{"URL":"https:\/\/www.mdpi.com\/1424-8220\/22\/15\/5904\/pdf","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2025,10,11]],"date-time":"2025-10-11T00:05:26Z","timestamp":1760141126000},"score":1,"resource":{"primary":{"URL":"https:\/\/www.mdpi.com\/1424-8220\/22\/15\/5904"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2022,8,7]]},"references-count":21,"journal-issue":{"issue":"15","published-online":{"date-parts":[[2022,8]]}},"alternative-id":["s22155904"],"URL":"https:\/\/doi.org\/10.3390\/s22155904","relation":{},"ISSN":["1424-8220"],"issn-type":[{"value":"1424-8220","type":"electronic"}],"subject":[],"published":{"date-parts":[[2022,8,7]]}}}