{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,10,12]],"date-time":"2025-10-12T01:07:43Z","timestamp":1760231263779,"version":"build-2065373602"},"reference-count":9,"publisher":"MDPI AG","issue":"17","license":[{"start":{"date-parts":[[2022,9,2]],"date-time":"2022-09-02T00:00:00Z","timestamp":1662076800000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/creativecommons.org\/licenses\/by\/4.0\/"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["Sensors"],"abstract":"<jats:p>A high data rate RF-DAC and a power detector (PD) are designed and fabricated in a 250 nm indium phosphide (InP) double heterojunction bipolar transistor (DHBT) technology. A communication link using the Tx-Rx over polymer microwave fiber (PMF) is measured. The link consists of a pulse amplitude modulation (PAM) modulator and a PD as a demodulator, as well as a one-meter-long dielectric waveguide. The working frequency range of the complete link is verified to be 110\u2013150 GHz. The peak output power of the PAM modulator is 5 dBm, and it has a \u22123 dB bandwidth of 43 GHz. The PD consists of a parallel connected common emitter configured transistor and a common base configured transistor to suppress the odd-order harmonics at the PD\u2019s output, as well as a stacked transistor to amplify the output signal. Tx and Rx chips, including pads, occupy a total area of only 0.83 mm2. The PMF link can support a PAM-4 signal with 22 Gbps data transmission, and a PAM-2 signal with 30 Gbps data transmission, with a bit error rate (BER) of &lt;10\u221212, with demodulation performed in real time. Furthermore, the energy efficiency for the link (Tx + Rx) is 4.1 pJ\/bit, using digital data input and receiving PAM-2 output (5.6 pJ\/bit for PAM-4).<\/jats:p>","DOI":"10.3390\/s22176645","type":"journal-article","created":{"date-parts":[[2022,9,8]],"date-time":"2022-09-08T04:18:32Z","timestamp":1662610712000},"page":"6645","update-policy":"https:\/\/doi.org\/10.3390\/mdpi_crossmark_policy","source":"Crossref","is-referenced-by-count":1,"title":["Transmitter and Receiver Circuits for a High-Speed Polymer Fiber-Based PAM-4 Communication Link"],"prefix":"10.3390","volume":"22","author":[{"ORCID":"https:\/\/orcid.org\/0000-0001-8109-7219","authenticated-orcid":false,"given":"Frida","family":"Str\u00f6mbeck","sequence":"first","affiliation":[{"name":"Microwave Electronics Laboratory, Chalmers University of Technology, 41258 Gothenburg, Sweden"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0000-0003-3022-0066","authenticated-orcid":false,"given":"Mingquan","family":"Bao","sequence":"additional","affiliation":[{"name":"Microwave Electronics Laboratory, Chalmers University of Technology, 41258 Gothenburg, Sweden"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0000-0003-0487-1527","authenticated-orcid":false,"given":"Zhongxia Simon","family":"He","sequence":"additional","affiliation":[{"name":"Microwave Electronics Laboratory, Chalmers University of Technology, 41258 Gothenburg, Sweden"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Herbert","family":"Zirath","sequence":"additional","affiliation":[{"name":"Microwave Electronics Laboratory, Chalmers University of Technology, 41258 Gothenburg, Sweden"}],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"1968","published-online":{"date-parts":[[2022,9,2]]},"reference":[{"key":"ref_1","unstructured":"car2tera.eu (2022, July 13). Next Generation Smart Automotive Electronic Systems. Available online: https:\/\/car2tera.eu\/about\/."},{"key":"ref_2","doi-asserted-by":"crossref","unstructured":"Voineau, F., Dehos, C., Martineau, B., Si\u00e9, M., Perchicot, M., Nguyen, N.H., Ghiotto, A., and Kerherv\u00e9, E. (2018, January 15\u201318). A 12 Gb\/s 64QAM and OFDM Compatible Millimeter-Wave Communication Link Using a Novel Plastic Waveguide Design. In Proceeding of the 2018 IEEE Radio and Wireless Symposium (RWS), Anaheim, CA, USA.","DOI":"10.1109\/RWS.2018.8305001"},{"key":"ref_3","doi-asserted-by":"crossref","unstructured":"Van Thienen, N., Zhang, Y., De Wit, M., and Reynaert, P. (2016, January 12\u201315). An 18 Gbps Polymer Microwave Fiber (PMF) Communication Link in 40nm CMOS. In Proceeding of the 2016 European Solid-State Circuits Conference, Lausanne, Switzerland.","DOI":"10.1109\/ESSCIRC.2016.7598346"},{"key":"ref_4","doi-asserted-by":"crossref","first-page":"1515","DOI":"10.1109\/TMTT.2014.2321115","article-title":"A High-Speed Power Detector for D-Band Commu-emptynication","volume":"62","author":"Bao","year":"2014","journal-title":"IEEE Trans. Microw. Theory Tech."},{"key":"ref_5","doi-asserted-by":"crossref","unstructured":"Hacker, J., Seo, M., Young, A., Griffith, Z., Urteaga, M., Reed, T., and Rodwell, M. (2010, January 23\u201328). THz MMICs based on InP HBT Technology. In Proceeding of the 2010 IEEE MTT-S International Microwave Symposium, Anaheim, CA, USA.","DOI":"10.1109\/MWSYM.2010.5517225"},{"key":"ref_6","unstructured":"Bao, M. (2017). Power Detector. (US 9841445B2), U.S. Patent."},{"key":"ref_7","doi-asserted-by":"crossref","first-page":"1960","DOI":"10.1109\/JSSC.2019.2907163","article-title":"Analysis and Design of a Foam-Cladded PMF Link With Phase Tuning in 28-nm CMOS","volume":"54","author":"Zhang","year":"2019","journal-title":"IEEE J. Solid-State Circuits"},{"key":"ref_8","doi-asserted-by":"crossref","first-page":"674","DOI":"10.1109\/LMWC.2013.2283862","article-title":"High-Speed mm-Wave Data-Link Based on Hollow Plastic Cable and CMOS Transceiver","volume":"23","author":"Kim","year":"2013","journal-title":"IEEE Microw. Wirel. Compon. Lett."},{"key":"ref_9","doi-asserted-by":"crossref","unstructured":"Dens, K., Vaes, J., Ooms, S., Wagner, M., and Reynaert, P. (2021, January 13\u201322). A PAM4 Dielectric Waveguide Link in 28 nm CMOS. In Proceeding of the ESSCIRC 2021\u2014IEEE 47th European Solid State Circuits Conference (ESSCIRC), Grenoble, France.","DOI":"10.1109\/ESSCIRC53450.2021.9567741"}],"container-title":["Sensors"],"original-title":[],"language":"en","link":[{"URL":"https:\/\/www.mdpi.com\/1424-8220\/22\/17\/6645\/pdf","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2025,10,11]],"date-time":"2025-10-11T00:22:24Z","timestamp":1760142144000},"score":1,"resource":{"primary":{"URL":"https:\/\/www.mdpi.com\/1424-8220\/22\/17\/6645"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2022,9,2]]},"references-count":9,"journal-issue":{"issue":"17","published-online":{"date-parts":[[2022,9]]}},"alternative-id":["s22176645"],"URL":"https:\/\/doi.org\/10.3390\/s22176645","relation":{},"ISSN":["1424-8220"],"issn-type":[{"type":"electronic","value":"1424-8220"}],"subject":[],"published":{"date-parts":[[2022,9,2]]}}}