{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,4,14]],"date-time":"2026-04-14T15:48:39Z","timestamp":1776181719957,"version":"3.50.1"},"reference-count":37,"publisher":"MDPI AG","issue":"17","license":[{"start":{"date-parts":[[2022,9,4]],"date-time":"2022-09-04T00:00:00Z","timestamp":1662249600000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/creativecommons.org\/licenses\/by\/4.0\/"}],"funder":[{"name":"EU H2020 project Int5Gent","award":["957403"],"award-info":[{"award-number":["957403"]}]},{"name":"EU H2020 project Int5Gent","award":["824962"],"award-info":[{"award-number":["824962"]}]},{"name":"EU H2020 project Int5Gent","award":["61620106001"],"award-info":[{"award-number":["61620106001"]}]},{"name":"EU H2020 project Int5Gent","award":["20590730400"],"award-info":[{"award-number":["20590730400"]}]},{"name":"EU H2020 project car2tera","award":["957403"],"award-info":[{"award-number":["957403"]}]},{"name":"EU H2020 project car2tera","award":["824962"],"award-info":[{"award-number":["824962"]}]},{"name":"EU H2020 project car2tera","award":["61620106001"],"award-info":[{"award-number":["61620106001"]}]},{"name":"EU H2020 project car2tera","award":["20590730400"],"award-info":[{"award-number":["20590730400"]}]},{"name":"Projects of International Cooperation and Exchanges NSFC","award":["957403"],"award-info":[{"award-number":["957403"]}]},{"name":"Projects of International Cooperation and Exchanges NSFC","award":["824962"],"award-info":[{"award-number":["824962"]}]},{"name":"Projects of International Cooperation and Exchanges NSFC","award":["61620106001"],"award-info":[{"award-number":["61620106001"]}]},{"name":"Projects of International Cooperation and Exchanges NSFC","award":["20590730400"],"award-info":[{"award-number":["20590730400"]}]},{"name":"Science and Technology Innovation Action Plan of Shanghai","award":["957403"],"award-info":[{"award-number":["957403"]}]},{"name":"Science and Technology Innovation Action Plan of Shanghai","award":["824962"],"award-info":[{"award-number":["824962"]}]},{"name":"Science and Technology Innovation Action Plan of Shanghai","award":["61620106001"],"award-info":[{"award-number":["61620106001"]}]},{"name":"Science and Technology Innovation Action Plan of Shanghai","award":["20590730400"],"award-info":[{"award-number":["20590730400"]}]},{"name":"Chalmers AoA Project \u201cImproving road safety by high frequency 5G localization and sensing\u201d","award":["957403"],"award-info":[{"award-number":["957403"]}]},{"name":"Chalmers AoA Project \u201cImproving road safety by high frequency 5G localization and sensing\u201d","award":["824962"],"award-info":[{"award-number":["824962"]}]},{"name":"Chalmers AoA Project \u201cImproving road safety by high frequency 5G localization and sensing\u201d","award":["61620106001"],"award-info":[{"award-number":["61620106001"]}]},{"name":"Chalmers AoA Project \u201cImproving road safety by high frequency 5G localization and sensing\u201d","award":["20590730400"],"award-info":[{"award-number":["20590730400"]}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["Sensors"],"abstract":"<jats:p>This paper presents a novel substrateless packaging solution for the D-band active e mixer MMIC module, using a waveguide line with a glide-symmetric periodic electromagnetic bandgap (EBG) hole configuration. The proposed packaging concept has the benefit of being able to control signal propagation behavior by using a cost-effective EBG hole configuration for millimeter-wave- and terahertz (THz)-frequency-band applications. Moreover, the mixer MMIC is connected to the proposed hollow rectangular waveguide line via a novel wire-bond wideband transition without using any intermediate substrate. A simple periodical nail structure is utilized to suppress the unwanted modes in the transition. Additionally, the presented solution does not impose any limitations on the chip\u2019s dimensions or shape. The packaged mixer module shows a return loss lower than 10 dB for LO (70\u201385 GHz) and RF (150\u2013170 GHz) ports, achieving a better performance than that of traditional waveguide transitions. The module could be used as a transmitter or receiver, and the conversion loss shows good agreement in multiple samples. The proposed packaging solution has the advantages of satisfactory frequency performance, broadband adaptability, low production costs, and excellent repeatability for millimeter-wave- and THz-band systems, which would facilitate the commercialization of millimeter-wave and THz products.<\/jats:p>","DOI":"10.3390\/s22176696","type":"journal-article","created":{"date-parts":[[2022,9,8]],"date-time":"2022-09-08T04:18:32Z","timestamp":1662610712000},"page":"6696","update-policy":"https:\/\/doi.org\/10.3390\/mdpi_crossmark_policy","source":"Crossref","is-referenced-by-count":10,"title":["Substrateless Packaging for a D-Band MMIC Based on a Waveguide with a Glide-Symmetric EBG Hole Configuration"],"prefix":"10.3390","volume":"22","author":[{"ORCID":"https:\/\/orcid.org\/0000-0002-8974-0763","authenticated-orcid":false,"given":"Weihua","family":"Yu","sequence":"first","affiliation":[{"name":"Beijing Key Laboratory of Millimeter-Wave and Terahertz Wave Technology, School of Integrated Circuits and Electronics, Beijing Institute of Technology, Beijing 100081, China"},{"name":"BIT Chongqing Institute of Microelectronics and Microsystems, Chongqing 400031, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Abbas","family":"Vosoogh","sequence":"additional","affiliation":[{"name":"Microwave Electronics Laboratory, Department of Microtechnology and Nanosciense (MC2), Chalmers University of Technology, SE-41296 Gothenburg, Sweden"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Bowu","family":"Wang","sequence":"additional","affiliation":[{"name":"Beijing Key Laboratory of Millimeter-Wave and Terahertz Wave Technology, School of Integrated Circuits and Electronics, Beijing Institute of Technology, Beijing 100081, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0000-0003-0487-1527","authenticated-orcid":false,"given":"Zhongxia Simon","family":"He","sequence":"additional","affiliation":[{"name":"Microwave Electronics Laboratory, Department of Microtechnology and Nanosciense (MC2), Chalmers University of Technology, SE-41296 Gothenburg, Sweden"},{"name":"SinoWave AB, SE-43650 Hov\u00e5s, Sweden"}],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"1968","published-online":{"date-parts":[[2022,9,4]]},"reference":[{"key":"ref_1","doi-asserted-by":"crossref","unstructured":"Pfeiffer, U.R., Jain, R., Grzyb, J., Malz, S., Hillger, P., and Rodr\u00edguez-V\u00edzquez, P. (2018, January 15\u201317). Current Status of Terahertz Integrated Circuits\u2014From Components to Systems. Proceedings of the 2018 IEEE BiCMOS and Compound Semiconductor Integrated Circuits and Technology Symposium (BCICTS), San Diego, CA, USA.","DOI":"10.1109\/BCICTS.2018.8551068"},{"key":"ref_2","doi-asserted-by":"crossref","unstructured":"Weimann, N. (2020, January 2\u20134). InP HBT Technology for THz Applications. Proceedings of the 2020 IEEE International Symposium on Radio-Frequency Integration Technology (RFIT), Hiroshima, Japan.","DOI":"10.1109\/RFIT49453.2020.9226243"},{"key":"ref_3","doi-asserted-by":"crossref","first-page":"1068","DOI":"10.1109\/JPROC.2015.2500024","article-title":"SiGe HBT Technology: Future Trends and TCAD-Based Roadmap","volume":"105","author":"Rosenbaum","year":"2017","journal-title":"Proc. IEEE"},{"key":"ref_4","unstructured":"(2022, July 01). FCC Online Table of Frequency Allocations. Federal Communications Commission, Washington, DC, USA, Available online: https:\/\/transition.fcc.gov\/oet\/spectrum\/table\/fcctable.pdf."},{"key":"ref_5","doi-asserted-by":"crossref","unstructured":"Li, Y., and Hansryd, J. (2018, January 6\u20139). Fixed Wireless Communication Links Beyond 100 GHZ. Proceedings of the 2018 Asia-Pacific Microwave Conference (APMC), Kyoto, Japan.","DOI":"10.23919\/APMC.2018.8617636"},{"key":"ref_6","doi-asserted-by":"crossref","first-page":"624","DOI":"10.1109\/TTHZ.2019.2943572","article-title":"Toward Industrial Exploitation of THz Frequencies: Integration of SiGe MMICs in Silicon-Micromachined Waveguide Systems","volume":"9","author":"Campion","year":"2019","journal-title":"IEEE Trans. Terahertz Sci. Technol."},{"key":"ref_7","doi-asserted-by":"crossref","first-page":"842","DOI":"10.1109\/LMWC.2014.2303161","article-title":"Direct Machining of Low-Loss THz Waveguide Components with an RF Choke","volume":"24","author":"Lewis","year":"2014","journal-title":"IEEE Microw. Wirel. Compon. Lett."},{"key":"ref_8","doi-asserted-by":"crossref","first-page":"248","DOI":"10.1109\/TTHZ.2018.2791841","article-title":"A Very Low Loss 220\u2013325 GHz Silicon Micromachined Waveguide Technology","volume":"8","author":"Beuerle","year":"2018","journal-title":"IEEE Trans. Terahertz Sci. Technol."},{"key":"ref_9","doi-asserted-by":"crossref","unstructured":"Kildal, P. (2013, January 2). Gap Waveguides and PMC Packaging: Octave Bandwidth mm- and sub mm-Wave Applications of Soft & Hard Surfaces, EBGs and AMCs. Proceedings of the 2013 Asia-Pacific Microwave Conference Proceedings (APMC), Seoul, Korea.","DOI":"10.1109\/APMC.2013.6695182"},{"key":"ref_10","doi-asserted-by":"crossref","first-page":"1823","DOI":"10.1109\/TAP.2016.2634282","article-title":"Wideband and high-gain corporate-fed gap waveguide slot array antenna with ETSI class II radiation pattern in V-band","volume":"65","author":"Vosoogh","year":"2016","journal-title":"IEEE Trans. Antennas Propag."},{"key":"ref_11","doi-asserted-by":"crossref","first-page":"2601","DOI":"10.1109\/TMTT.2020.2986111","article-title":"Groove Gap Waveguide Filter Based on Horizontally Polarized Resonators for V-Band Applications","volume":"68","author":"Rezaee","year":"2020","journal-title":"IEEE Trans. Microw. Theory Tech."},{"key":"ref_12","unstructured":"Alfonso, E., Zaman, A.U., Pucci, E., and Kildal, P. (2012\u20132, January 29). Gap Waveguide Components for Millimetre-Wave Systems: Couplers, Filters, Antennas, MMIC Packaging. Proceedings of the 2012 International Symposium on Antennas and Propagation (ISAP), Nagoys, Japan."},{"key":"ref_13","doi-asserted-by":"crossref","first-page":"40","DOI":"10.1109\/MAP.2019.2943306","article-title":"W-Band Gap Waveguide Antenna Array: Passive\/Active Component Gap Waveguide Transition Interface for System Integration","volume":"63","author":"Shi","year":"2021","journal-title":"IEEE Antennas Propag. Mag."},{"key":"ref_14","first-page":"938","article-title":"Miniaturized W-band Gap Waveguide Bandpass Filter Using the MEMS Technique for Both Waveguide and Surface Mounted Packaging","volume":"66","author":"Shi","year":"2019","journal-title":"IEEE Trans. Circuits Syst. II Express Briefs"},{"key":"ref_15","doi-asserted-by":"crossref","first-page":"3783","DOI":"10.1109\/TMTT.2019.2919539","article-title":"Compact Integrated Full-Duplex Gap Waveguide-Based Radio Front End for Multi-Gbit\/s Point-to-Point Backhaul Links at E-Band","volume":"67","author":"Vosoogh","year":"2019","journal-title":"IEEE Trans. Microw. Theory Tech."},{"key":"ref_16","doi-asserted-by":"crossref","first-page":"2056","DOI":"10.1109\/LAWP.2018.2833740","article-title":"Performance Assessment of Gap-Waveguide Array Antennas: CNC Milling Versus Three-Dimensional Printing","volume":"17","year":"2018","journal-title":"IEEE Antennas Wirel. Propag. Lett."},{"key":"ref_17","doi-asserted-by":"crossref","first-page":"164","DOI":"10.1109\/TAP.2020.3008620","article-title":"Millimeter-Wave 3-D-Printed Antenna Array Based on Gap-Waveguide Technology and Split E-Plane Waveguide","volume":"69","author":"Padilla","year":"2021","journal-title":"IEEE Trans. Antennas Propag."},{"key":"ref_18","unstructured":"Rahiminejad, S., Raza, H., Zaman, A.U., Haasl, S., Enoksson, P., and Kildal, P. (2013, January 8\u201312). Micromachined Gap Waveguides for 100 GHz Applications. Proceedings of the 2013 7th European Conference on Antennas and Propagation (EuCAP), Gothenburg, Sweden."},{"key":"ref_19","doi-asserted-by":"crossref","first-page":"542","DOI":"10.1109\/LMWC.2017.2701308","article-title":"Design Guidelines for Gap Waveguide Technology Based on Glide-Symmetric Holey Structures","volume":"27","author":"Ebrahimpouri","year":"2017","journal-title":"IEEE Microw. Wirel. Compon. Lett."},{"key":"ref_20","doi-asserted-by":"crossref","first-page":"4984","DOI":"10.1109\/TMTT.2020.3023751","article-title":"Accurate Characterization and Design Guidelines of Glide-Symmetric Holey EBG","volume":"68","author":"Chen","year":"2020","journal-title":"IEEE Trans. Microw. Theory Tech."},{"key":"ref_21","doi-asserted-by":"crossref","first-page":"282","DOI":"10.1109\/TTHZ.2019.2905775","article-title":"Novel Air-Filled Waveguide Transmission Line Based on Multilayer Thin Metal Plates","volume":"9","author":"Vosoogh","year":"2019","journal-title":"IEEE Trans. Terahertz Sci. Technol."},{"key":"ref_22","doi-asserted-by":"crossref","unstructured":"Vosoogh, A., Braz\u00e1lez, A.A., Li, Y., and He, Z.S. (2020, January 15\u201320). A Compact Mass-producible E-band Bandpass Filter Based on Multi-layer Waveguide Technology. Proceedings of the 2020 14th European Conference on Antennas and Propagation (EuCAP), Copenhagen, Denmark.","DOI":"10.23919\/EuCAP48036.2020.9136082"},{"key":"ref_23","doi-asserted-by":"crossref","first-page":"476","DOI":"10.1109\/LMWC.2018.2832013","article-title":"Wideband Phase Shifter in Groove Gap Waveguide Technology Implemented with Glide-Symmetric Holey EBG","volume":"28","author":"Ebrahimpouri","year":"2018","journal-title":"IEEE Microw. Wirel. Compon. Lett."},{"key":"ref_24","doi-asserted-by":"crossref","first-page":"31","DOI":"10.1109\/LMWC.2019.2953211","article-title":"Holey Glide-Symmetric Filters for 5G at Millimeter-Wave Frequencies","volume":"30","author":"Fonseca","year":"2020","journal-title":"IEEE Microw. Wirel. Compon. Lett."},{"key":"ref_25","doi-asserted-by":"crossref","first-page":"1925","DOI":"10.1109\/TAP.2019.2944535","article-title":"Glide-Symmetric Holey Leaky-Wave Antenna with Low Dispersion for 60 GHz Point-to-Point Communications","volume":"68","author":"Chen","year":"2020","journal-title":"IEEE Trans. Antennas Propag."},{"key":"ref_26","doi-asserted-by":"crossref","first-page":"9","DOI":"10.1109\/TTHZ.2011.2159558","article-title":"An Overview of Solid-State Integrated Circuit Amplifiers in the Submillimeter-Wave and THz Regime","volume":"1","author":"Samoska","year":"2011","journal-title":"IEEE Trans. Terahertz Sci. Technol."},{"key":"ref_27","doi-asserted-by":"crossref","first-page":"486","DOI":"10.1109\/LMWC.2013.2272610","article-title":"A 243 GHz LNA Module Based on mHEMT MMICs With Integrated Waveguide Transitions","volume":"23","author":"Hurm","year":"2013","journal-title":"IEEE Microw. Wirel. Compon. Lett."},{"key":"ref_28","doi-asserted-by":"crossref","first-page":"2741","DOI":"10.1109\/TMTT.2015.2461160","article-title":"A Wide-Band CMOS to Waveguide Transition at mm-Wave Frequencies with Wire-Bonds","volume":"63","author":"Jameson","year":"2015","journal-title":"IEEE Trans. Microw. Theory Tech."},{"key":"ref_29","doi-asserted-by":"crossref","first-page":"4102","DOI":"10.1109\/TAP.2012.2207077","article-title":"130-GHz On-Chip Meander Slot Antennas With Stacked Dielectric Resonators in Standard CMOS Technology","volume":"60","author":"Hou","year":"2012","journal-title":"IEEE Trans. Antennas Propag."},{"key":"ref_30","doi-asserted-by":"crossref","unstructured":"Hou, Z.J., Yang, Y., Zhu, X., Liao, S., Man, S.K., and Xue, Q. (2017, January 4\u20139). A 320 GHz on-chip slot antenna array using CBCPW feeding network in 0.13-\u03bcm SiGe technology. Proceedings of the 2017 IEEE MTT-S International Microwave Symposium (IMS), Honololu, HI, USA.","DOI":"10.1109\/MWSYM.2017.8058710"},{"key":"ref_31","doi-asserted-by":"crossref","first-page":"63","DOI":"10.1007\/s10762-018-0551-x","article-title":"A D-Band Rectangular Waveguide-to-Coplanar Waveguide Transition Using Wire Bonding Probe","volume":"40","author":"Dong","year":"2019","journal-title":"J. Infrared Millim. Terahertz Waves"},{"key":"ref_32","doi-asserted-by":"crossref","first-page":"3623","DOI":"10.1109\/TMTT.2016.2607177","article-title":"Substrateless Amplifier Module Realized by Ridge Gap Waveguide Technology for Millimeter-Wave Applications","volume":"64","author":"Ahmadi","year":"2016","journal-title":"IEEE Trans. Microw. Theory Tech."},{"key":"ref_33","doi-asserted-by":"crossref","unstructured":"Gao, Z., Tang, M., Gao, P., Yue, H., and Tang, Y. (2020, January 20\u201323). Design and Measurement of D-Band Bonding-Wire Interconnection on Quartz Glass Substrate. Proceedings of the 2020 International Conference on Microwave and Millimeter Wave Technology (ICMMT), Shanghai, China.","DOI":"10.1109\/ICMMT49418.2020.9386791"},{"key":"ref_34","doi-asserted-by":"crossref","unstructured":"Hassona, A., Vassilev, V., Zaman, A.U., and Zirath, H. (2020, January 15\u201320). Packaging Technique of Highly Integrated Circuits Based on EBG Structure for +100 GHz Applications. Proceedings of the 2020 14th European Conference on Antennas and Propagation (EuCAP), Copenhagen, Denmark.","DOI":"10.23919\/EuCAP48036.2020.9135289"},{"key":"ref_35","doi-asserted-by":"crossref","first-page":"321","DOI":"10.1109\/TTHZ.2020.2972362","article-title":"Nongalvanic Generic Packaging Solution Demonstrated in a Fully Integrated D-Band Receiver","volume":"10","author":"Hassona","year":"2020","journal-title":"IEEE Trans. Terahertz Sci. Technol."},{"key":"ref_36","doi-asserted-by":"crossref","unstructured":"Li, Y., H\u00f6rberg, M., Eriksson, K., Campion, J., Hassona, A., Vecchiattini, S., Dahl, T., Lindman, R., Bao, M., and He, Z.S. (2019, January 10\u201313). D-Band SiGe Transceiver Modules Based on Silicon-Micromachined Integration. Proceedings of the 2019 IEEE Asia-Pacific Microwave Conference (APMC), Singapore.","DOI":"10.1109\/APMC46564.2019.9038198"},{"key":"ref_37","doi-asserted-by":"crossref","first-page":"1092","DOI":"10.1109\/LMWC.2017.2763118","article-title":"Silicon Taper Based D -Band Chip to Waveguide Interconnect for Millimeter-Wave Systems","volume":"27","author":"Hassona","year":"2017","journal-title":"IEEE Microw. Wirel. Compon. Lett."}],"container-title":["Sensors"],"original-title":[],"language":"en","link":[{"URL":"https:\/\/www.mdpi.com\/1424-8220\/22\/17\/6696\/pdf","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2025,10,11]],"date-time":"2025-10-11T00:23:15Z","timestamp":1760142195000},"score":1,"resource":{"primary":{"URL":"https:\/\/www.mdpi.com\/1424-8220\/22\/17\/6696"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2022,9,4]]},"references-count":37,"journal-issue":{"issue":"17","published-online":{"date-parts":[[2022,9]]}},"alternative-id":["s22176696"],"URL":"https:\/\/doi.org\/10.3390\/s22176696","relation":{},"ISSN":["1424-8220"],"issn-type":[{"value":"1424-8220","type":"electronic"}],"subject":[],"published":{"date-parts":[[2022,9,4]]}}}