{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,3,14]],"date-time":"2026-03-14T06:20:23Z","timestamp":1773469223317,"version":"3.50.1"},"reference-count":30,"publisher":"MDPI AG","issue":"21","license":[{"start":{"date-parts":[[2022,10,24]],"date-time":"2022-10-24T00:00:00Z","timestamp":1666569600000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/creativecommons.org\/licenses\/by\/4.0\/"}],"funder":[{"name":"the Ministry of Economic Affairs, Labour and Tourism of Baden-W\u00fcrttemberg, Germany"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["Sensors"],"abstract":"<jats:p>This paper describes the characterization of inkjet-printed resistive temperature sensors according to the international standard IEC 61928-2. The goal is to evaluate such sensors comprehensively, to identify important manufacturing processes, and to generate data for inkjet-printed temperature sensors according to the mentioned standard for the first time, which will enable future comparisons across different publications. Temperature sensors were printed with a silver nanoparticle ink on injection-molded parts. After printing, the sensors were sintered with different parameters to investigate their influences on the performance. Temperature sensors were characterized in a temperature range from 10 \u00b0C to 85 \u00b0C at 60% RH. It turned out that the highest tested sintering temperature of 200 \u00b0C, the longest dwell time of 24 h, and a coating with fluoropolymer resulted in the best sensor properties, which are a high temperature coefficient of resistance, low hysteresis, low non-repeatability, and low maximum error. The determined hysteresis, non-repeatability, and maximum error are below 1.4% of the full-scale output (FSO), and the temperature coefficient of resistance is 1.23\u20131.31 \u00d7 10\u22123 K\u22121. These results show that inkjet printing is a capable technology for the manufacturing of temperature sensors for applications up to 85 \u00b0C, such as lab-on-a-chip devices.<\/jats:p>","DOI":"10.3390\/s22218145","type":"journal-article","created":{"date-parts":[[2022,10,24]],"date-time":"2022-10-24T11:53:55Z","timestamp":1666612435000},"page":"8145","update-policy":"https:\/\/doi.org\/10.3390\/mdpi_crossmark_policy","source":"Crossref","is-referenced-by-count":20,"title":["Inkjet-Printed Temperature Sensors Characterized according to Standards"],"prefix":"10.3390","volume":"22","author":[{"ORCID":"https:\/\/orcid.org\/0000-0001-8877-8244","authenticated-orcid":false,"given":"Jonas","family":"J\u00e4ger","sequence":"first","affiliation":[{"name":"Hahn-Schickard, Allmandring 9b, 70569 Stuttgart, Germany"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-3071-0412","authenticated-orcid":false,"given":"Adrian","family":"Schwenck","sequence":"additional","affiliation":[{"name":"Hahn-Schickard, Allmandring 9b, 70569 Stuttgart, Germany"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-4285-4907","authenticated-orcid":false,"given":"Daniela","family":"Walter","sequence":"additional","affiliation":[{"name":"Hahn-Schickard, Allmandring 9b, 70569 Stuttgart, Germany"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-9585-3422","authenticated-orcid":false,"given":"Andr\u00e9","family":"B\u00fclau","sequence":"additional","affiliation":[{"name":"Hahn-Schickard, Allmandring 9b, 70569 Stuttgart, Germany"}]},{"given":"Kerstin","family":"Gl\u00e4ser","sequence":"additional","affiliation":[{"name":"Hahn-Schickard, Allmandring 9b, 70569 Stuttgart, Germany"}]},{"ORCID":"https:\/\/orcid.org\/0000-0003-1824-9376","authenticated-orcid":false,"given":"Andr\u00e9","family":"Zimmermann","sequence":"additional","affiliation":[{"name":"Hahn-Schickard, Allmandring 9b, 70569 Stuttgart, Germany"},{"name":"Institute for Micro Integration (IFM), University of Stuttgart, Allmandring 9b, 70569 Stuttgart, Germany"}]}],"member":"1968","published-online":{"date-parts":[[2022,10,24]]},"reference":[{"key":"ref_1","doi-asserted-by":"crossref","first-page":"5483","DOI":"10.1007\/s11664-021-09078-1","article-title":"Brief Review of Nanosilver Sintering: Manufacturing and Reliability","volume":"50","author":"Wang","year":"2021","journal-title":"J. Electron. Mater."},{"key":"ref_2","unstructured":"Polzinger, B. (2017). Inkjetdruck von Silberleiterbahnen zur Anwendung als Temperatursensor. [Ph.D. Thesis, Institut for Microintegration at Stuttgart University]."},{"key":"ref_3","unstructured":"Lupo, D., Kirchmeyer, S., Hecker, K., and Krausmann, J. (2020). OE-A Roadmap for Organic and Printed Electronics, OE-A. [8th ed.]."},{"key":"ref_4","doi-asserted-by":"crossref","first-page":"1252960","DOI":"10.1155\/2020\/1252960","article-title":"Layered 3D Printing by Tethered Pyro-Electrospinning","volume":"2020","author":"Coppola","year":"2020","journal-title":"Adv. Polym. Technol."},{"key":"ref_5","doi-asserted-by":"crossref","first-page":"054103","DOI":"10.1063\/1.4907005","article-title":"Investigation on cone jetting regimes of liquid droplets subjected to pyroelectric fields induced by laser blasts","volume":"106","author":"Gennari","year":"2015","journal-title":"Appl. Phys. Lett."},{"key":"ref_6","doi-asserted-by":"crossref","unstructured":"Mueller, M., and Franke, J. (2017, January 6\u20139). Feasability study of piezo jet printed silver ink structures for interconnection and condition monitoring of power electronics components. Proceedings of the 2017 IEEE 19th Electronics Packaging Technology Conference (EPTC), Singapore.","DOI":"10.1109\/EPTC.2017.8277552"},{"key":"ref_7","doi-asserted-by":"crossref","first-page":"2101029","DOI":"10.1002\/aelm.202101029","article-title":"Ultra-Thin Chips with Printed Interconnects on Flexible Foils","volume":"8","author":"Ma","year":"2022","journal-title":"Adv. Electron. Mater."},{"key":"ref_8","doi-asserted-by":"crossref","unstructured":"Slade, P.G. (1999). Electrical Contacts: Principles and Applications, CRC Press.","DOI":"10.1201\/9780585139319"},{"key":"ref_9","doi-asserted-by":"crossref","unstructured":"Zikulnig, J., Khalifa, M., Rauter, L., Lammer, H., and Kosel, J. (2021). Low-Cost Inkjet-Printed Temperature Sensors on Paper Substrate for the Integration into Natural Fiber-Reinforced Lightweight Components. Chemosensors, 9.","DOI":"10.3390\/chemosensors9050095"},{"key":"ref_10","doi-asserted-by":"crossref","first-page":"015008","DOI":"10.1088\/2058-8585\/ab0cea","article-title":"Inkjet printing and characterisation of a resistive temperature sensor on paper substrate","volume":"4","author":"Zikulnig","year":"2019","journal-title":"Flex. Print. Electron."},{"key":"ref_11","unstructured":"Sette, D. (2014). Functional Printing: From the Study of Printed Layers to the Prototyping of Flexible Devices. [Ph.D. Thesis, Universit\u00e9 de Grenoble]."},{"key":"ref_12","doi-asserted-by":"crossref","unstructured":"Courbat, J., Kim, Y.B., Briand, D., and de Rooij, N.F. (2011, January 5\u20139). Inkjet Printing on Paper for the Realization of Humidity and Temperature Sensors. Proceedings of the 2011 16th International Solid-State Sensors, Actuators and Microsystems Conference, Beijing, China.","DOI":"10.1109\/TRANSDUCERS.2011.5969506"},{"key":"ref_13","unstructured":"Felba, J., Nitsch, K., Piasecki, T., Paluch, P., Moscicki, A., and Kinart, A. (2009, January 26\u201330). The Influence of Thermal Process on Electrical Conductivity of Microstructures: Made by Ink-Jet Painting with the Use of Ink Containing Nano Sized Silver Particles. Proceedings of the 2009 9th IEEE Conference on Nanotechnology (IEEE-NANO), Genoa, Italy."},{"key":"ref_14","doi-asserted-by":"crossref","first-page":"025012","DOI":"10.1088\/0960-1317\/23\/2\/025012","article-title":"Large-area compatible fabrication and encapsulation of inkjet-printed humidity sensors on flexible foils with integrated thermal compensation","volume":"23","author":"Quintero","year":"2013","journal-title":"J. Micromech. Microeng."},{"key":"ref_15","doi-asserted-by":"crossref","unstructured":"Kirtania, S.G., Riheen, M.A., Kim, S.U., Sekhar, K., Wisniewska, A., and Sekhar, P.K. (2020). Inkjet Printing on a New Flexible Ceramic Substrate for Internet of Things (IoT) Applications. Micromachines, 11.","DOI":"10.3390\/mi11090841"},{"key":"ref_16","unstructured":"Nitzsche, K., Ullrich, H.-J., and Bauch, J. (1993). Funktionswerkstoffe der Elektrotechnik und Elektronik: Mit 120 Tabellen, Aufl. Leipzig Stuttgart, Deutscher Verlag f\u00fcr Grundstoffindustrie. [2nd ed.]."},{"key":"ref_17","doi-asserted-by":"crossref","first-page":"158","DOI":"10.1016\/j.jallcom.2014.01.184","article-title":"A study on the electrical and mechanical properties of printed Ag thin films for flexible device application","volume":"596","author":"Kim","year":"2014","journal-title":"J. Alloys Compd."},{"key":"ref_18","doi-asserted-by":"crossref","first-page":"74","DOI":"10.1016\/S0921-5093(01)00942-X","article-title":"Sintering study of 316L stainless steel metal injection molding parts using Taguchi method: Final density","volume":"311","author":"Ji","year":"2001","journal-title":"Mater. Sci. Eng. A"},{"key":"ref_19","unstructured":"Werner, C. (2014). Untersuchungen zur Sinterung Aerosol Jet und Ink Jet gedruckter Ag- und CuNiMn-Mikrostrukturen. [Ph.D. Thesis, University Bremen]."},{"key":"ref_20","doi-asserted-by":"crossref","first-page":"7110","DOI":"10.1007\/s10853-012-6366-6","article-title":"Impact of variable frequency microwave and rapid thermal sintering on microstructure of inkjet-printed silver nanoparticles","volume":"47","author":"Cauchois","year":"2012","journal-title":"J. Mater. Sci."},{"key":"ref_21","doi-asserted-by":"crossref","first-page":"14396","DOI":"10.1007\/s10854-018-9572-4","article-title":"Significance of encapsulating organic temperature sensors through spatial atmospheric atomic layer deposition for protection against humidity","volume":"29","author":"Rehman","year":"2018","journal-title":"J. Mater. Sci. Mater. Electron."},{"key":"ref_22","doi-asserted-by":"crossref","first-page":"1232","DOI":"10.1109\/TCPMT.2022.3169558","article-title":"Contacting Inkjet-Printed Silver Structures and SMD by ICA and Solder","volume":"12","author":"Buschkamp","year":"2022","journal-title":"IEEE Trans. Compon. Packag. Manuf. Technol."},{"key":"ref_23","doi-asserted-by":"crossref","unstructured":"Trotter, M., Juric, D., Bagherian, Z., Borst, N., Gl\u00e4ser, K., Meissner, T., von Stetten, F., and Zimmermann, A. (2020). Inkjet-Printing of Nanoparticle Gold and Silver Ink on Cyclic Olefin Copolymer for DNA-Sensing Applications. Sensors, 20.","DOI":"10.3390\/s20051333"},{"key":"ref_24","doi-asserted-by":"crossref","unstructured":"Bernstein, H. (2022). Measuring Electronics and Sensors: Basics of Measurement Technology, Sensors, Analog and Digital Signal Processing, Springer Fachmedien.","DOI":"10.1007\/978-3-658-35067-3"},{"key":"ref_25","unstructured":"(2008). Process Measurement and Control Devices\u2014General Methods and Procedures for Evaluating Performance\u2014Part 2: Tests under Reference Conditions (Standard No. IEC 61298-2:2008)."},{"key":"ref_26","doi-asserted-by":"crossref","unstructured":"Fraden, J. (2016). Handbook of Modern Sensors, Springer International Publishing.","DOI":"10.1007\/978-3-319-19303-8"},{"key":"ref_27","doi-asserted-by":"crossref","unstructured":"Schwenck, A., Gr\u00f6zinger, T., G\u00fcnther, T., Schumacher, A., Schuhmacher, D., Werum, K., and Zimmermann, A. (2021). Characterization of a PCB Based Pressure Sensor and Its Joining Methods for the Metal Membrane. Sensors, 21.","DOI":"10.3390\/s21165557"},{"key":"ref_28","doi-asserted-by":"crossref","unstructured":"Roudenko, J., Neermann, S., Schirmer, J., Reichenberger, M., and Franke, J. (2021, January 8\u201311). Sintering of digitally printed silver nanoparticle inks on flexible and rigid substrates by NIR- and UVradiation. Proceedings of the 2021 14th International Congress Molded Interconnect Devices (MID), Amberg, Germany.","DOI":"10.1109\/MID50463.2021.9361627"},{"key":"ref_29","doi-asserted-by":"crossref","first-page":"2000775","DOI":"10.1002\/pssa.202000775","article-title":"Two-Step Flash-Light Sintering of Copper-based Inkjet-Printed Patterns Onto Polymer Substrates used in Flexible Electronic Devices","volume":"218","author":"Kang","year":"2021","journal-title":"Phys. Status Solidi A"},{"key":"ref_30","doi-asserted-by":"crossref","unstructured":"Keck, J., Freisinger, B., Juric, D., Glaser, K., Volker, M., Eberhardt, W., and Zimmermann, A. (2018, January 25\u201326). Low-Temperature Sintering of Nanometal Inks on Polymer Substrates. Proceedings of the 2018 13th International Congress Molded Interconnect Devices (MID), W\u00fcrzburg, Germany.","DOI":"10.1109\/ICMID.2018.8527053"}],"container-title":["Sensors"],"original-title":[],"language":"en","link":[{"URL":"https:\/\/www.mdpi.com\/1424-8220\/22\/21\/8145\/pdf","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2025,10,11]],"date-time":"2025-10-11T01:01:56Z","timestamp":1760144516000},"score":1,"resource":{"primary":{"URL":"https:\/\/www.mdpi.com\/1424-8220\/22\/21\/8145"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2022,10,24]]},"references-count":30,"journal-issue":{"issue":"21","published-online":{"date-parts":[[2022,11]]}},"alternative-id":["s22218145"],"URL":"https:\/\/doi.org\/10.3390\/s22218145","relation":{},"ISSN":["1424-8220"],"issn-type":[{"value":"1424-8220","type":"electronic"}],"subject":[],"published":{"date-parts":[[2022,10,24]]}}}