{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,10,11]],"date-time":"2025-10-11T01:46:31Z","timestamp":1760147191316,"version":"build-2065373602"},"reference-count":19,"publisher":"MDPI AG","issue":"2","license":[{"start":{"date-parts":[[2023,1,14]],"date-time":"2023-01-14T00:00:00Z","timestamp":1673654400000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/creativecommons.org\/licenses\/by\/4.0\/"}],"funder":[{"name":"Ministry of Science and Technology of Taiwan","award":["Grant MOST 110-2221-E-011-052"],"award-info":[{"award-number":["Grant MOST 110-2221-E-011-052"]}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["Sensors"],"abstract":"<jats:p>In the PCB process, overcoming common-mode noise radiation is critical. In past years, most studies have focused on a common-mode noise filter (CMNF) that can solve electromagnetic interference in high-speed digital systems by blocking and absorbing common-mode noise radiation. Unfortunately, connecting with any reflective common-mode noise filter (R-CMNF) and reducing the area of an absorptive common-mode noise filter (A-CMNF) are the most troublesome tasks in the PCB process. A novel equivalent circuit is proposed in this research to minimize the complexity of the design and improve accuracy. Detailed analyses of this proposed approach are entirely depicted in this article. The experiment result shows that 9% of fractional bandwidth centered at 2.25 Hz can achieve at least 90% absorption efficiency. With our proposed method, the area of A-CMNF is smaller than in state-of-the-art research.<\/jats:p>","DOI":"10.3390\/s23020957","type":"journal-article","created":{"date-parts":[[2023,1,16]],"date-time":"2023-01-16T05:30:07Z","timestamp":1673847007000},"page":"957","update-policy":"https:\/\/doi.org\/10.3390\/mdpi_crossmark_policy","source":"Crossref","is-referenced-by-count":5,"title":["Design Compact Absorptive Common-Mode Noise Suppression Filter with Series Unified Circuit"],"prefix":"10.3390","volume":"23","author":[{"ORCID":"https:\/\/orcid.org\/0000-0001-8052-1882","authenticated-orcid":false,"given":"Cheng-Yi","family":"Zhuang","sequence":"first","affiliation":[{"name":"Department of Electronic and Computer Engineering, National Taiwan University of Science and Technology, Taipei City 106, Taiwan"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0000-0003-1980-0609","authenticated-orcid":false,"given":"Ding-Bing","family":"Lin","sequence":"additional","affiliation":[{"name":"Department of Electronic and Computer Engineering, National Taiwan University of Science and Technology, Taipei City 106, Taiwan"}],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"1968","published-online":{"date-parts":[[2023,1,14]]},"reference":[{"key":"ref_1","doi-asserted-by":"crossref","first-page":"624","DOI":"10.1109\/TEMC.2013.2257796","article-title":"Overview of Signal Integrity and EMC Design Technologies on PCB: Fundamentals and Latest Progress","volume":"55","author":"Wu","year":"2013","journal-title":"IEEE Trans. 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