{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,10,11]],"date-time":"2025-10-11T02:18:09Z","timestamp":1760149089007,"version":"build-2065373602"},"reference-count":48,"publisher":"MDPI AG","issue":"13","license":[{"start":{"date-parts":[[2023,7,4]],"date-time":"2023-07-04T00:00:00Z","timestamp":1688428800000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/creativecommons.org\/licenses\/by\/4.0\/"}],"funder":[{"name":"Departments of Transportation of Iowa, Kansas, South Carolina, and North Carolina","award":["TPF-5(449)"],"award-info":[{"award-number":["TPF-5(449)"]}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["Sensors"],"abstract":"<jats:p>Recent advances in soft polymer materials have enabled the design of soft machines and devices at multiple scales. Their intrinsic compliance and robust mechanical properties and the potential for a rapid scaling of the production process make them ideal candidates for flexible and stretchable electronics and sensors. Large-area electronics (LAE) made from soft polymer materials that are capable of sustaining large deformations and covering large surfaces and are applicable to complex and irregular surfaces and transducing deformations into readable signals have been explored for structural health monitoring (SHM) applications. The authors have previously proposed and developed an LAE consisting of a corrugated soft elastomeric capacitor (cSEC). The corrugation is used to engineer the directional strain sensitivity by using a thermoplastic styrene-ethylene-butadiene-styrene (SEBS). A key limitation of the SEBS-cSEC technology is the need of an epoxy for reliable bonding of the sensor onto the monitored surface, mainly attributable to the sensor\u2019s fabrication process that comprises a solvent that limits its direct deployment through a painting process. Here, with the objective to produce a paintable cSEC, we study an improved solvent-free fabrication method by using a commercial room-temperature-vulcanizing silicone as the host matrix. The matrix is filled with titania particles to form the dielectric layer, yielding a permittivity of 4.05. Carbon black powder is brushed onto the dielectric and encapsulated with the same silicone to form the conductive stretchable electrodes. The sensor is deployed by directly painting a layer of the silicone onto the monitored surface and then depositing the parallel plate capacitor. The electromechanical behavior of the painted silicone-cSEC was characterized and exhibited good linearity, with an R2 value of 0.9901, a gauge factor of 1.58, and a resolution of 70 \u03bc\u03b5. This resolution compared well with that of the epoxied SEBS-cSEC reported in previous work (25 \u03bc\u03b5). Its performance was compared against that of its more mature version, the SEBS-cSEC, in a network configuration on a cantilever plate subjected to a step-deformation and to free vibrations. Results showed that the performance of the painted silicone-sCEC compared well with that of the SEBS-cSEC, but that the use of a silicone paint instead of an epoxy could be responsible for larger noise and the under-estimation of the dominating frequency by 6.7%, likely attributable to slippage.<\/jats:p>","DOI":"10.3390\/s23136146","type":"journal-article","created":{"date-parts":[[2023,7,5]],"date-time":"2023-07-05T00:53:04Z","timestamp":1688518384000},"page":"6146","update-policy":"https:\/\/doi.org\/10.3390\/mdpi_crossmark_policy","source":"Crossref","is-referenced-by-count":2,"title":["Paintable Silicone-Based Corrugated Soft Elastomeric Capacitor for Area Strain Sensing"],"prefix":"10.3390","volume":"23","author":[{"ORCID":"https:\/\/orcid.org\/0000-0003-3057-522X","authenticated-orcid":false,"given":"Han","family":"Liu","sequence":"first","affiliation":[{"name":"Department of Civil, Construction, and Environmental Engineering, Iowa State University, Ames, IA 50011, USA"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-0601-9664","authenticated-orcid":false,"given":"Simon","family":"Laflamme","sequence":"additional","affiliation":[{"name":"Department of Civil, Construction, and Environmental Engineering, Iowa State University, Ames, IA 50011, USA"},{"name":"Department of Electrical and Computer Engineering, Iowa State University, Ames, IA 50011, USA"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Matthias","family":"Kollosche","sequence":"additional","affiliation":[{"name":"Department of Civil, Construction, and Environmental Engineering, Iowa State University, Ames, IA 50011, USA"},{"name":"Harvard John A. Paulson School of Engineering and Applied Sciences, Harvard University, Cambridge, MA 02138, USA"}],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"1968","published-online":{"date-parts":[[2023,7,4]]},"reference":[{"key":"ref_1","doi-asserted-by":"crossref","first-page":"e2321","DOI":"10.1002\/stc.2321","article-title":"A literature review of next-generation smart sensing technology in structural health monitoring","volume":"26","author":"Sony","year":"2019","journal-title":"Struct. 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