{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,2,13]],"date-time":"2026-02-13T22:56:22Z","timestamp":1771023382447,"version":"3.50.1"},"reference-count":24,"publisher":"MDPI AG","issue":"14","license":[{"start":{"date-parts":[[2023,7,12]],"date-time":"2023-07-12T00:00:00Z","timestamp":1689120000000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/creativecommons.org\/licenses\/by\/4.0\/"}],"funder":[{"DOI":"10.13039\/501100003052","name":"Ministry of Trade, Industry and Energy (MOTIE, Korea)","doi-asserted-by":"publisher","award":["20000874"],"award-info":[{"award-number":["20000874"]}],"id":[{"id":"10.13039\/501100003052","id-type":"DOI","asserted-by":"publisher"}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["Sensors"],"abstract":"<jats:p>With the continuous reduction in size and increase in density of semiconductor devices, there is a growing demand for contact solutions that enable high-speed testing in automotive, 5G, and artificial intelligence-based devices. Although existing solutions, such as spring pins and rubber sockets, have been effective in various applications, there is still a need for new solutions that accommodate fine-pitch, high-speed, and high-density requirements. This study proposes a novel three-dimensional microelectromechanical system spring structure coaxial socket for semiconductor chip package testing. The socket design incorporates impedance matching for high-speed testing and addresses the challenges of fine-pitch and high-density applications. Mechanical tests are conducted to evaluate the durability of the structure and electrical tests are performed to verify electrical characteristics by utilizing a vector network analyzer up to 60 GHz. Our results have revealed promising performance and will help in further optimizing the design for potential production in the field and industry.<\/jats:p>","DOI":"10.3390\/s23146350","type":"journal-article","created":{"date-parts":[[2023,7,13]],"date-time":"2023-07-13T01:58:11Z","timestamp":1689213491000},"page":"6350","update-policy":"https:\/\/doi.org\/10.3390\/mdpi_crossmark_policy","source":"Crossref","is-referenced-by-count":2,"title":["Fabrication and Characterization of Three-Dimensional Microelectromechanical System Coaxial Socket Device for Semiconductor Package Testing"],"prefix":"10.3390","volume":"23","author":[{"ORCID":"https:\/\/orcid.org\/0000-0002-3750-1488","authenticated-orcid":false,"given":"Tae-Kyun","family":"Kim","sequence":"first","affiliation":[{"name":"Department of Electrical and Electronic Engineering, Yonsei University, Seoul 03722, Republic of Korea"},{"name":"PMT (Protec MEMS Technology) Inc., Asan-si 31413, Republic of Korea"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0000-0001-6711-289X","authenticated-orcid":false,"given":"Jong-Gwan","family":"Yook","sequence":"additional","affiliation":[{"name":"Department of Electrical and Electronic Engineering, Yonsei University, Seoul 03722, Republic of Korea"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Joo-Yong","family":"Kim","sequence":"additional","affiliation":[{"name":"PMT (Protec MEMS Technology) Inc., Asan-si 31413, Republic of Korea"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Yong-Ho","family":"Cho","sequence":"additional","affiliation":[{"name":"PMT (Protec MEMS Technology) Inc., Asan-si 31413, Republic of Korea"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Uh-Hyeon","family":"Lee","sequence":"additional","affiliation":[{"name":"PMT (Protec MEMS Technology) Inc., Asan-si 31413, Republic of Korea"}],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"1968","published-online":{"date-parts":[[2023,7,12]]},"reference":[{"key":"ref_1","doi-asserted-by":"crossref","unstructured":"Liang, C.L., Lin, Y.S., Kao, C.L., Tarng, D., Wang, S.B., Hung, Y.C., and Lin, K.L. 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