{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,12,23]],"date-time":"2025-12-23T18:23:42Z","timestamp":1766514222348,"version":"build-2065373602"},"reference-count":27,"publisher":"MDPI AG","issue":"2","license":[{"start":{"date-parts":[[2024,1,11]],"date-time":"2024-01-11T00:00:00Z","timestamp":1704931200000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/creativecommons.org\/licenses\/by\/4.0\/"}],"funder":[{"name":"Mathematics of Information Technology and Complex Systems (MITACS) funding agency","award":["IT32628"],"award-info":[{"award-number":["IT32628"]}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["Sensors"],"abstract":"<jats:p>This paper details the development and validation of a temperature sensing methodology using an un-trimmed oscillator-based integrated sensor implemented in the 0.18-\u03bcm SOI XFAB process, with a focus on thermal monitoring in system-on-chip (SoC) based DC-DC converters. Our study identifies a quadratic relationship between the oscillator output frequency and temperature, which forms the basis of our proposed calibration mechanism. This mechanism aims at mitigating process variation effects, enabling accurate temperature-to-frequency mapping. Our research proposes and characterizes several trimming-free calibration techniques, covering a spectrum from zero to thirty-one frequency-temperature measurement points. Notably, the Corrected One-Point calibration method, requiring only a single ambient temperature measurement, emerges as a practical solution that removes the need for a temperature chamber. This method, after adjustment, successfully reduces the maximum error to within \u00b12.95 \u00b0C. Additionally, the Two-Point calibration method demonstrates improved precision with a maximum positive error of +1.56 \u00b0C at \u221215 \u00b0C and a maximum negative error of \u22123.13 \u00b0C at +10 \u00b0C (R2 value of 0.9958). The Three-Point calibration method performed similarly, yielding an R2 value of 0.9956. The findings of this study indicate that competitive results in temperature sensor calibration can be achieved without circuit trimming, offering a viable alternative or a complementary approach to traditional trimming techniques.<\/jats:p>","DOI":"10.3390\/s24020440","type":"journal-article","created":{"date-parts":[[2024,1,11]],"date-time":"2024-01-11T03:21:41Z","timestamp":1704943301000},"page":"440","update-policy":"https:\/\/doi.org\/10.3390\/mdpi_crossmark_policy","source":"Crossref","is-referenced-by-count":2,"title":["Calibration of Ring Oscillator-Based Integrated Temperature Sensors for Power Management Systems"],"prefix":"10.3390","volume":"24","author":[{"ORCID":"https:\/\/orcid.org\/0000-0003-0081-4840","authenticated-orcid":false,"given":"Nader","family":"El-Zarif","sequence":"first","affiliation":[{"name":"Department of Electrical Engineering, Polytechnique Montreal, Montreal, QC H3T 1J4, Canada"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Mostafa","family":"Amer","sequence":"additional","affiliation":[{"name":"Department of Electrical Engineering, Polytechnique Montreal, Montreal, QC H3T 1J4, Canada"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-7476-7920","authenticated-orcid":false,"given":"Mohamed","family":"Ali","sequence":"additional","affiliation":[{"name":"Department of Electrical Engineering, Polytechnique Montreal, Montreal, QC H3T 1J4, Canada"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-2215-5375","authenticated-orcid":false,"given":"Ahmad","family":"Hassan","sequence":"additional","affiliation":[{"name":"Department of Electrical Engineering, Polytechnique Montreal, Montreal, QC H3T 1J4, Canada"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-4472-6124","authenticated-orcid":false,"given":"Aziz","family":"Oukaira","sequence":"additional","affiliation":[{"name":"Department of Computer Science and Engineering, University of Quebec in Outaouais, Gatineau, QC J8X 3X7, Canada"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Christian Jesus B.","family":"Fayomi","sequence":"additional","affiliation":[{"name":"Department of Computer Science, University of Quebec in Montreal, Montreal, QC H3C 3P8, Canada"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Yvon","family":"Savaria","sequence":"additional","affiliation":[{"name":"Department of Electrical Engineering, Polytechnique Montreal, Montreal, QC H3T 1J4, Canada"}],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"1968","published-online":{"date-parts":[[2024,1,11]]},"reference":[{"key":"ref_1","doi-asserted-by":"crossref","first-page":"256","DOI":"10.1109\/JESTPE.2019.2953102","article-title":"A review of advanced thermal management solutions and the implications for integration in high-voltage packages","volume":"8","author":"Iradukunda","year":"2019","journal-title":"IEEE J. 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