{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,10,11]],"date-time":"2025-10-11T00:55:01Z","timestamp":1760144101776,"version":"build-2065373602"},"reference-count":27,"publisher":"MDPI AG","issue":"6","license":[{"start":{"date-parts":[[2024,3,7]],"date-time":"2024-03-07T00:00:00Z","timestamp":1709769600000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/creativecommons.org\/licenses\/by\/4.0\/"}],"funder":[{"name":"GRA KAM","award":["No. SV9-4906"],"award-info":[{"award-number":["No. SV9-4906"]}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["Sensors"],"abstract":"<jats:p>Multilayer printed circuit boards (PCBs) can be produced not only in the traditional way but also additively. Both traditional and additive manufacturing can lead to invisible defects in the internal structure of the electronic component, eventually leading to the spontaneous failure of the device. No matter what kind of technology is used for the production of PCBs, when they are used in important structures, quality control is important to ensure the reliability of the component. The nondestructive testing (NDT) of the structure of manufactured electronic components can help ensure the quality of devices. Investigations of possible changes in the structure of the product can help identify the causes of defects. Different types of manufacturing technologies can lead to diverse types of possible defects. Therefore, employing several nondestructive inspection techniques could be preferable for the inspection of electronic components. In this article, we present a comparison of various NDT techniques for the evaluation of the quality of PCBs produced using traditional and additive manufacturing technologies. The methodology for investigating the internal structure of PCBs is based on several of the most reliable and widely used technologies, namely, acoustic microscopy, active thermography, and radiography. All of the technologies investigated have their advantages and disadvantages, so if high-reliability products are to be produced, it would be advantageous to carry out tests using multiple technologies in order to detect the various types of defects and determine their parameters.<\/jats:p>","DOI":"10.3390\/s24061719","type":"journal-article","created":{"date-parts":[[2024,3,7]],"date-time":"2024-03-07T04:19:02Z","timestamp":1709785142000},"page":"1719","update-policy":"https:\/\/doi.org\/10.3390\/mdpi_crossmark_policy","source":"Crossref","is-referenced-by-count":11,"title":["Comparison of Different NDT Techniques for Evaluation of the Quality of PCBs Produced Using Traditional vs. Additive Manufacturing Technologies"],"prefix":"10.3390","volume":"24","author":[{"ORCID":"https:\/\/orcid.org\/0000-0002-8073-5597","authenticated-orcid":false,"given":"Elena","family":"Jasi\u016bnien\u0117","sequence":"first","affiliation":[{"name":"Department of Electronics Engineering, Kaunas University of Technology, Studentu St. 50, LT-51368 Kaunas, Lithuania"},{"name":"Prof. K. Barsauskas Ultrasound Research Insititute, Kaunas University of Technology, K. Barsausko St. 59, LT-51423 Kaunas, Lithuania"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0000-0003-2408-5427","authenticated-orcid":false,"given":"Renaldas","family":"Rai\u0161utis","sequence":"additional","affiliation":[{"name":"Prof. K. Barsauskas Ultrasound Research Insititute, Kaunas University of Technology, K. Barsausko St. 59, LT-51423 Kaunas, Lithuania"},{"name":"Department of Electrical Power Systems, Kaunas University of Technology, Studentu St. 50, LT-51368 Kaunas, Lithuania"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0000-0001-9960-7619","authenticated-orcid":false,"given":"Vykintas","family":"Samaitis","sequence":"additional","affiliation":[{"name":"Prof. K. Barsauskas Ultrasound Research Insititute, Kaunas University of Technology, K. Barsausko St. 59, LT-51423 Kaunas, Lithuania"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0000-0003-3977-7549","authenticated-orcid":false,"given":"Audrius","family":"Jankauskas","sequence":"additional","affiliation":[{"name":"Prof. K. Barsauskas Ultrasound Research Insititute, Kaunas University of Technology, K. Barsausko St. 59, LT-51423 Kaunas, Lithuania"}],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"1968","published-online":{"date-parts":[[2024,3,7]]},"reference":[{"key":"ref_1","doi-asserted-by":"crossref","first-page":"15921","DOI":"10.1109\/ACCESS.2023.3245093","article-title":"Printed Circuit Board Defect Detection Methods Based on Image Processing, Machine Learning and Deep Learning: A Survey","volume":"11","author":"Ling","year":"2023","journal-title":"IEEE Access"},{"key":"ref_2","doi-asserted-by":"crossref","first-page":"33","DOI":"10.1109\/OJPEL.2021.3052541","article-title":"Current and Potential Applications of Additive Manufacturing for Power Electronics","volume":"2","author":"Lopera","year":"2021","journal-title":"IEEE Open J. Power Electron."},{"key":"ref_3","doi-asserted-by":"crossref","unstructured":"Butt, J. (2020). Exploring the Interrelationship between Additive Manufacturing and Industry 4.0. 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