{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,5,4]],"date-time":"2026-05-04T07:50:24Z","timestamp":1777881024583,"version":"3.51.4"},"reference-count":42,"publisher":"MDPI AG","issue":"9","license":[{"start":{"date-parts":[[2024,4,26]],"date-time":"2024-04-26T00:00:00Z","timestamp":1714089600000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/creativecommons.org\/licenses\/by\/4.0\/"}],"funder":[{"name":"National Natural Science Foundation of China","award":["52275527"],"award-info":[{"award-number":["52275527"]}]},{"name":"National Natural Science Foundation of China","award":["52275526"],"award-info":[{"award-number":["52275526"]}]},{"name":"National Natural Science Foundation of China","award":["2022ZX01A27"],"award-info":[{"award-number":["2022ZX01A27"]}]},{"name":"National Natural Science Foundation of China","award":["2023M740941"],"award-info":[{"award-number":["2023M740941"]}]},{"name":"National Natural Science Foundation of China","award":["LBH-Z23179"],"award-info":[{"award-number":["LBH-Z23179"]}]},{"name":"National Natural Science Foundation of China","award":["GZC20233484"],"award-info":[{"award-number":["GZC20233484"]}]},{"DOI":"10.13039\/100017366","name":"Key Research and Development Program of Heilongjiang","doi-asserted-by":"publisher","award":["52275527"],"award-info":[{"award-number":["52275527"]}],"id":[{"id":"10.13039\/100017366","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/100017366","name":"Key Research and Development Program of Heilongjiang","doi-asserted-by":"publisher","award":["52275526"],"award-info":[{"award-number":["52275526"]}],"id":[{"id":"10.13039\/100017366","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/100017366","name":"Key Research and Development Program of Heilongjiang","doi-asserted-by":"publisher","award":["2022ZX01A27"],"award-info":[{"award-number":["2022ZX01A27"]}],"id":[{"id":"10.13039\/100017366","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/100017366","name":"Key Research and Development Program of Heilongjiang","doi-asserted-by":"publisher","award":["2023M740941"],"award-info":[{"award-number":["2023M740941"]}],"id":[{"id":"10.13039\/100017366","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/100017366","name":"Key Research and Development Program of Heilongjiang","doi-asserted-by":"publisher","award":["LBH-Z23179"],"award-info":[{"award-number":["LBH-Z23179"]}],"id":[{"id":"10.13039\/100017366","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/100017366","name":"Key Research and Development Program of Heilongjiang","doi-asserted-by":"publisher","award":["GZC20233484"],"award-info":[{"award-number":["GZC20233484"]}],"id":[{"id":"10.13039\/100017366","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100002858","name":"China Postdoctoral Science Foundation","doi-asserted-by":"publisher","award":["52275527"],"award-info":[{"award-number":["52275527"]}],"id":[{"id":"10.13039\/501100002858","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100002858","name":"China Postdoctoral Science Foundation","doi-asserted-by":"publisher","award":["52275526"],"award-info":[{"award-number":["52275526"]}],"id":[{"id":"10.13039\/501100002858","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100002858","name":"China Postdoctoral Science Foundation","doi-asserted-by":"publisher","award":["2022ZX01A27"],"award-info":[{"award-number":["2022ZX01A27"]}],"id":[{"id":"10.13039\/501100002858","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100002858","name":"China Postdoctoral Science Foundation","doi-asserted-by":"publisher","award":["2023M740941"],"award-info":[{"award-number":["2023M740941"]}],"id":[{"id":"10.13039\/501100002858","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100002858","name":"China Postdoctoral Science Foundation","doi-asserted-by":"publisher","award":["LBH-Z23179"],"award-info":[{"award-number":["LBH-Z23179"]}],"id":[{"id":"10.13039\/501100002858","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100002858","name":"China Postdoctoral Science Foundation","doi-asserted-by":"publisher","award":["GZC20233484"],"award-info":[{"award-number":["GZC20233484"]}],"id":[{"id":"10.13039\/501100002858","id-type":"DOI","asserted-by":"publisher"}]},{"name":"Heilongjiang Postdoctoral Fund","award":["52275527"],"award-info":[{"award-number":["52275527"]}]},{"name":"Heilongjiang Postdoctoral Fund","award":["52275526"],"award-info":[{"award-number":["52275526"]}]},{"name":"Heilongjiang Postdoctoral Fund","award":["2022ZX01A27"],"award-info":[{"award-number":["2022ZX01A27"]}]},{"name":"Heilongjiang Postdoctoral Fund","award":["2023M740941"],"award-info":[{"award-number":["2023M740941"]}]},{"name":"Heilongjiang Postdoctoral Fund","award":["LBH-Z23179"],"award-info":[{"award-number":["LBH-Z23179"]}]},{"name":"Heilongjiang Postdoctoral Fund","award":["GZC20233484"],"award-info":[{"award-number":["GZC20233484"]}]},{"name":"Postdoctoral Fellowship Program of CPSF","award":["52275527"],"award-info":[{"award-number":["52275527"]}]},{"name":"Postdoctoral Fellowship Program of CPSF","award":["52275526"],"award-info":[{"award-number":["52275526"]}]},{"name":"Postdoctoral Fellowship Program of CPSF","award":["2022ZX01A27"],"award-info":[{"award-number":["2022ZX01A27"]}]},{"name":"Postdoctoral Fellowship Program of CPSF","award":["2023M740941"],"award-info":[{"award-number":["2023M740941"]}]},{"name":"Postdoctoral Fellowship Program of CPSF","award":["LBH-Z23179"],"award-info":[{"award-number":["LBH-Z23179"]}]},{"name":"Postdoctoral Fellowship Program of CPSF","award":["GZC20233484"],"award-info":[{"award-number":["GZC20233484"]}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["Sensors"],"abstract":"<jats:p>As process nodes of advanced integrated circuits continue to decrease below 10 nm, the requirement for overlay accuracy is becoming stricter. The alignment sensor measures the position of the alignment mark relative to the wafer; thus, sub-nanometer alignment position accuracy is vital. The Phase Grating Alignment (PGA) method is widely used due to its high precision and stability. However, the alignment error caused by the mark asymmetry is the key obstacle preventing PGA technology from achieving sub-nanometer alignment accuracy. This error can be corrected using many methods, such as process verification and multi-channel weighted methods based on multi-diffraction, multi-wavelength and multi-polarization state alignment sensors. However, the mark asymmetry is unpredictable, complex and difficult to obtain in advance. In this case, the fixed-weight method cannot effectively reduce the alignment error. Therefore, an adaptive weighted method based on the error distribution characteristic of a multi-channel is proposed. Firstly, the simulation result proves that the error distribution characteristic of the multi-alignment result has a strong correlation with the mark asymmetry. Secondly, a concrete method of constructing weight values based on error distribution is described. We assume that the relationship between the weight value of each channel and the deviations of all channels\u2019 results is second-order linear. Finally, without other prior process correction in the simulation experiment, the residual error\u2019s Root Mean Square (RMS) of fixed weighted method is 14.0 nm, while the RMS of the adaptive weighted method is 0.01 nm, when dealing with five typical types of mark asymmetry. The adaptive weighted method exhibits a more stable error correction effect under unpredictable and complicated mark asymmetry.<\/jats:p>","DOI":"10.3390\/s24092756","type":"journal-article","created":{"date-parts":[[2024,4,26]],"date-time":"2024-04-26T03:23:47Z","timestamp":1714101827000},"page":"2756","update-policy":"https:\/\/doi.org\/10.3390\/mdpi_crossmark_policy","source":"Crossref","is-referenced-by-count":3,"title":["Adaptive Weighted Error-Correction Method Based on the Error Distribution Characteristics of Multi-Channel Alignment"],"prefix":"10.3390","volume":"24","author":[{"ORCID":"https:\/\/orcid.org\/0009-0002-1075-5995","authenticated-orcid":false,"given":"Peiyu","family":"Song","sequence":"first","affiliation":[{"name":"Center of Ultra-Precision Optoelectronic Instrument Engineering, Harbin Institute of Technology, Harbin 150001, China"},{"name":"Key Lab of Ultra-Precision Intelligent Instrumentation, Harbin Institute of Technology, Ministry of Industry and Information Technology, Harbin 150001, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-4420-385X","authenticated-orcid":false,"given":"Weibo","family":"Wang","sequence":"additional","affiliation":[{"name":"Center of Ultra-Precision Optoelectronic Instrument Engineering, Harbin Institute of Technology, Harbin 150001, China"},{"name":"Key Lab of Ultra-Precision Intelligent Instrumentation, Harbin Institute of Technology, Ministry of Industry and Information Technology, Harbin 150001, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-1932-9231","authenticated-orcid":false,"given":"Biwei","family":"Wu","sequence":"additional","affiliation":[{"name":"Center of Ultra-Precision Optoelectronic Instrument Engineering, Harbin Institute of Technology, Harbin 150001, China"},{"name":"Key Lab of Ultra-Precision Intelligent Instrumentation, Harbin Institute of Technology, Ministry of Industry and Information Technology, Harbin 150001, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0000-0003-1933-0897","authenticated-orcid":false,"given":"Limin","family":"Zou","sequence":"additional","affiliation":[{"name":"Center of Ultra-Precision Optoelectronic Instrument Engineering, Harbin Institute of Technology, Harbin 150001, China"},{"name":"Key Lab of Ultra-Precision Intelligent Instrumentation, Harbin Institute of Technology, Ministry of Industry and Information Technology, Harbin 150001, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Tianpeng","family":"Zhan","sequence":"additional","affiliation":[{"name":"Center of Ultra-Precision Optoelectronic Instrument Engineering, Harbin Institute of Technology, Harbin 150001, China"},{"name":"Key Lab of Ultra-Precision Intelligent Instrumentation, Harbin Institute of Technology, Ministry of Industry and Information Technology, Harbin 150001, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Jiubin","family":"Tan","sequence":"additional","affiliation":[{"name":"Center of Ultra-Precision Optoelectronic Instrument Engineering, Harbin Institute of Technology, Harbin 150001, China"},{"name":"Key Lab of Ultra-Precision Intelligent Instrumentation, Harbin Institute of Technology, Ministry of Industry and Information Technology, Harbin 150001, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Xuemei","family":"Ding","sequence":"additional","affiliation":[{"name":"Center of Ultra-Precision Optoelectronic Instrument Engineering, Harbin Institute of Technology, Harbin 150001, China"},{"name":"Key Lab of Ultra-Precision Intelligent Instrumentation, Harbin Institute of Technology, Ministry of Industry and Information Technology, Harbin 150001, China"}],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"1968","published-online":{"date-parts":[[2024,4,26]]},"reference":[{"key":"ref_1","doi-asserted-by":"crossref","unstructured":"He, R., Cheng, J., and Wang, F. (2024). Handbook of Integrated Circuit Industry, Springer.","DOI":"10.1007\/978-981-99-2836-1_37"},{"key":"ref_2","unstructured":"Wang, X. (2020). Integrated Circuit and Lithographic Tool, Science Press."},{"key":"ref_3","doi-asserted-by":"crossref","unstructured":"Levinson, H.J. (2005). Principles of Lithography, SPIE Press.","DOI":"10.1117\/3.601520"},{"key":"ref_4","first-page":"226","article-title":"Lithography overlay control improvement using patterned wafer geometry for sub-22nm technology nodes","volume":"Volume 9424","author":"Peterson","year":"2015","journal-title":"Proceedings of the Metrology, Inspection, and Process Control for Microlithography XXIX"},{"key":"ref_5","first-page":"1002","article-title":"Review of overlay error and controlling methods in alignment system for advanced lithography","volume":"Volume 12478","author":"Jin","year":"2022","journal-title":"Proceedings of the Thirteenth International Conference on Information Optics and Photonics (CIOP 2022)"},{"key":"ref_6","first-page":"399","article-title":"Computational scanner wafer mark alignment","volume":"Volume 10147","author":"Menchtchikov","year":"2017","journal-title":"Proceedings of the Optical Microlithography XXX"},{"key":"ref_7","first-page":"645","article-title":"Holistic overlay control for multi-patterning process layers at the 10nm and 7nm nodes","volume":"Volume 9778","author":"Verstappen","year":"2016","journal-title":"Proceedings of the Metrology, Inspection, and Process Control for Microlithography XXX"},{"key":"ref_8","first-page":"1034","article-title":"Co-optimization of RegC and TWINSCAN corrections to improve the intra-field on-product overlay performance","volume":"Volume 9778","author":"Gorhad","year":"2016","journal-title":"Proceedings of the Metrology, Inspection, and Process Control for Microlithography XXX"},{"key":"ref_9","doi-asserted-by":"crossref","first-page":"011006","DOI":"10.1117\/1.JMM.13.1.011006","article-title":"Holistic optimization architecture enabling sub-14-nm projection lithography","volume":"13","author":"Mulkens","year":"2014","journal-title":"J. Micro\/Nanolithogr. MEMS MOEMS"},{"key":"ref_10","first-page":"98","article-title":"NXT: 1980Di immersion scanner for 7nm and 5nm production nodes","volume":"Volume 9780","author":"Weichselbaum","year":"2016","journal-title":"Proceedings of the Optical Microlithography XXIX"},{"key":"ref_11","doi-asserted-by":"crossref","unstructured":"Ma, J., Yu, M., Lambregts, C.J.H., Tsiachris, S., B\u00f6cker, P., Kim, J.Y., Ma, W.K., Han, S., ha Park, C., and Kim, K. (2020, January 25\u201326). Holistic alignment approach for on-product overlay improvement on DUV lithography process with combined solutions. Proceedings of the Optical Microlithography XXXIII, San Jose, CA, USA.","DOI":"10.1117\/12.2552938"},{"key":"ref_12","doi-asserted-by":"crossref","first-page":"9607","DOI":"10.1364\/AO.437440","article-title":"Sub-pixel position estimation algorithm based on Gaussian fitting and sampling theorem interpolation for wafer alignment","volume":"60","author":"Pan","year":"2021","journal-title":"Appl. Opt."},{"key":"ref_13","first-page":"41","article-title":"Improved wafer alignment model algorithm for better on-product overlay","volume":"Volume 10961","author":"Jeong","year":"2019","journal-title":"Proceedings of the Optical Microlithography XXXII"},{"key":"ref_14","doi-asserted-by":"crossref","first-page":"682","DOI":"10.1117\/12.436795","article-title":"Extended ATHENA alignment performance and application for the 100-nm technology node","volume":"Volume 4344","author":"Navarro","year":"2001","journal-title":"Proceedings of the Metrology, Inspection, and Process Control for Microlithography XV"},{"key":"ref_15","doi-asserted-by":"crossref","first-page":"9","DOI":"10.1364\/AO.58.000009","article-title":"Alignment mark optimization for improving signal-to-noise ratio of wafer alignment signal","volume":"58","author":"Du","year":"2019","journal-title":"Appl. Opt."},{"key":"ref_16","doi-asserted-by":"crossref","first-page":"023001","DOI":"10.1088\/2051-672X\/4\/2\/023001","article-title":"Optical wafer metrology sensors for process-robust CD and overlay control in semiconductor device manufacturing","volume":"4","year":"2016","journal-title":"Surf. Topogr. Metrol. Prop."},{"key":"ref_17","first-page":"827","article-title":"Improving scanner wafer alignment performance by target optimization","volume":"Volume 9778","author":"Leray","year":"2016","journal-title":"Proceedings of the Metrology, Inspection, and Process Control for Microlithography XXX"},{"key":"ref_18","doi-asserted-by":"crossref","first-page":"79","DOI":"10.1117\/12.436730","article-title":"W-CMP alignment using ASML\u2019s ATHENA system on an I-line stepper","volume":"Volume 4344","author":"Prasad","year":"2001","journal-title":"Proceedings of the Metrology, Inspection, and Process Control for Microlithography XV"},{"key":"ref_19","doi-asserted-by":"crossref","unstructured":"Yen, L.S., Said, S.M., Soin, N., Ibrahim, K., and Sang, K.B. (December, January 29). Study on alignment capability and overlay performance in 130nm BEOL lithography process. Proceedings of the 2006 IEEE International Conference on Semiconductor Electronics, Kuala Lumpur, Malaysia.","DOI":"10.1109\/SMELEC.2006.380703"},{"key":"ref_20","doi-asserted-by":"crossref","first-page":"102","DOI":"10.1117\/12.275950","article-title":"Effect of processing on the overlay performance of a wafer stepper","volume":"Volume 3050","author":"Dirksen","year":"1997","journal-title":"Proceedings of the Metrology, Inspection, and Process Control for Microlithography XI"},{"key":"ref_21","doi-asserted-by":"crossref","first-page":"382","DOI":"10.1117\/12.350826","article-title":"Improved wafer stepper alignment performance using an enhanced phase grating alignment system","volume":"Volume 3677","author":"Neijzen","year":"1999","journal-title":"Proceedings of the Metrology, Inspection, and Process Control for Microlithography XIII"},{"key":"ref_22","first-page":"81","article-title":"Reduction in overlay error from mark asymmetry using simulation, ORION, and alignment models","volume":"Volume 10587","author":"Menchtchikov","year":"2018","journal-title":"Proceedings of the Optical Microlithography XXXI"},{"key":"ref_23","doi-asserted-by":"crossref","first-page":"6380","DOI":"10.1364\/OL.505346","article-title":"X-ray-based overlay metrology using reciprocal space slicing analysis","volume":"48","author":"Zhang","year":"2023","journal-title":"Opt. Lett."},{"key":"ref_24","doi-asserted-by":"crossref","unstructured":"Hsieh, H.C., Wu, M.R., and Huang, X.T. (2023). Designing Highly Precise Overlay Targets for Asymmetric Sidewall Structures Using Quasi-Periodic Line Widths and Finite-Difference Time-Domain Simulation. Sensors, 23.","DOI":"10.3390\/s23094482"},{"key":"ref_25","doi-asserted-by":"crossref","first-page":"1389","DOI":"10.1364\/AO.449500","article-title":"Optimized wavelength selection for diffraction-based overlay measurement by minimum asymmetry factor variation with finite-difference time-domain simulation","volume":"61","author":"Hsieh","year":"2022","journal-title":"Appl. Opt."},{"key":"ref_26","doi-asserted-by":"crossref","first-page":"107051","DOI":"10.1016\/j.optlaseng.2022.107051","article-title":"Improving the cross-layer misalignment measurement accuracy by pattern-center shift induced error calibration","volume":"155","author":"Hsieh","year":"2022","journal-title":"Opt. Lasers Eng."},{"key":"ref_27","doi-asserted-by":"crossref","first-page":"2897","DOI":"10.1364\/AO.387066","article-title":"Multiobjective optimization for target design in diffraction-based overlay metrology","volume":"59","author":"Shi","year":"2020","journal-title":"Appl. Opt."},{"key":"ref_28","first-page":"1905001","article-title":"Effect of phase grating asymmetry on position measurement accuracy","volume":"41","author":"Yang","year":"2021","journal-title":"Acta Opt. Sin."},{"key":"ref_29","first-page":"119","article-title":"Holistic feedforward control for the 5 nm logic node and beyond","volume":"Volume 10961","author":"Megens","year":"2019","journal-title":"Proceedings of the Optical Microlithography XXXII"},{"key":"ref_30","unstructured":"Keij, S., Setija, I.D., van der Zouw, G., and Ebert, E.W. (March, January 28). Advances in phase-grating-based wafer alignment systems. Proceedings of the Metrology, Inspection, and Process Control for Microlithography XIX, San Jose, CA, USA."},{"key":"ref_31","unstructured":"Miyasaka, M., Saito, H., Tamura, T., Uchiyama, T., Hinnen, P.C., Lee, H.W., van Kemenade, M., Shahrjerdy, M., and van Leeuwen, R. (March, January 26). The application of SMASH alignment system for 65\u201355-nm logic devices. Proceedings of the Metrology, Inspection, and Process Control for Microlithography XXI, San Jose, CA, USA."},{"key":"ref_32","unstructured":"Aarts, I. (2018). Advancements in Process-Robust Wafer Alignment, SPIE."},{"key":"ref_33","unstructured":"Den Boef, A., Hoogerland, M., and Gajdeezko, B. (2008). Alignment System and Method. (US7564534B2), U.S. Patent."},{"key":"ref_34","doi-asserted-by":"crossref","first-page":"0704004","DOI":"10.3788\/CJL201946.0704004","article-title":"Calibration method for alignment error caused by asymmetric deformation of mark and its application in overlay measurement","volume":"46","author":"Du","year":"2019","journal-title":"Chin. J. Lasers"},{"key":"ref_35","doi-asserted-by":"crossref","first-page":"9814","DOI":"10.1364\/AO.57.009814","article-title":"Calibration method of overlay measurement error caused by asymmetric mark","volume":"57","author":"Du","year":"2018","journal-title":"Appl. Opt."},{"key":"ref_36","doi-asserted-by":"crossref","unstructured":"Yang, G., Li, J., Wang, Y., Ding, M., and Zhong, L. (2021). Analytic design of segmented phase grating for optical sensing in high-precision alignment system. Sensors, 21.","DOI":"10.3390\/s21113805"},{"key":"ref_37","unstructured":"Kumar, N., Roy, S., El Gawhary, O., Pereira, S.F., Coene, W.M., and Urbach, H.P. Towards Grating Reconstruction in Coherent Fourier Scatterometry. Proceedings of the Fringe 2013: 7th International Workshop on Advanced Optical Imaging and Metrology."},{"key":"ref_38","doi-asserted-by":"crossref","first-page":"106620","DOI":"10.1016\/j.optlaseng.2021.106620","article-title":"Moir\u00e9-based sub-nano misalignment sensing via deep learning for lithography","volume":"143","author":"Wang","year":"2021","journal-title":"Opt. Lasers Eng."},{"key":"ref_39","doi-asserted-by":"crossref","first-page":"061601","DOI":"10.1116\/1.4985679","article-title":"Characteristic study of image-based alignment for increasing accuracy in lithography application","volume":"35","author":"Zhang","year":"2017","journal-title":"J. Vac. Sci. Technol. B"},{"key":"ref_40","doi-asserted-by":"crossref","first-page":"128001","DOI":"10.1117\/1.OE.51.12.128001","article-title":"Numerical calculation of the accuracy of approximate analysis methods for binary rectangular groove diffraction phase grating","volume":"51","author":"Wu","year":"2012","journal-title":"Opt. Eng."},{"key":"ref_41","doi-asserted-by":"crossref","unstructured":"Pistor, T.V., and Socha, R.J. (2002, January 4\u20137). Rigorous electromagnetic simulation of stepper alignment. Proceedings of the Metrology, Inspection, and Process Control for Microlithography XVI, Santa Clara, CA, USA.","DOI":"10.1117\/12.473433"},{"key":"ref_42","doi-asserted-by":"crossref","first-page":"022603","DOI":"10.1116\/6.0001666","article-title":"Analysis of diffraction-based wafer alignment rejection for thick aluminum process","volume":"40","author":"Li","year":"2022","journal-title":"J. Vac. Sci. Technol. B"}],"container-title":["Sensors"],"original-title":[],"language":"en","link":[{"URL":"https:\/\/www.mdpi.com\/1424-8220\/24\/9\/2756\/pdf","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2025,10,10]],"date-time":"2025-10-10T14:33:33Z","timestamp":1760106813000},"score":1,"resource":{"primary":{"URL":"https:\/\/www.mdpi.com\/1424-8220\/24\/9\/2756"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2024,4,26]]},"references-count":42,"journal-issue":{"issue":"9","published-online":{"date-parts":[[2024,5]]}},"alternative-id":["s24092756"],"URL":"https:\/\/doi.org\/10.3390\/s24092756","relation":{},"ISSN":["1424-8220"],"issn-type":[{"value":"1424-8220","type":"electronic"}],"subject":[],"published":{"date-parts":[[2024,4,26]]}}}