{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,6,4]],"date-time":"2026-06-04T01:57:48Z","timestamp":1780538268019,"version":"3.54.1"},"reference-count":32,"publisher":"MDPI AG","issue":"9","license":[{"start":{"date-parts":[[2024,4,30]],"date-time":"2024-04-30T00:00:00Z","timestamp":1714435200000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/creativecommons.org\/licenses\/by\/4.0\/"}],"funder":[{"DOI":"10.13039\/501100009890","name":"Autonomous Province of Trento","doi-asserted-by":"publisher","award":["C63C22000720003"],"award-info":[{"award-number":["C63C22000720003"]}],"id":[{"id":"10.13039\/501100009890","id-type":"DOI","asserted-by":"publisher"}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["Sensors"],"abstract":"<jats:p>Packaging solutions have recently evolved to become smart and intelligent thanks to technologies such as RFID tracking and communication systems, but the integration of sensing functionality in these systems is still under active development. In this paper, chipless RFID humidity sensors suitable for smart packaging are proposed together with a novel strategy to tune their performances and their operating range. The sensors are flexible, fast, low-cost and easy to fabricate and can be read wirelessly. The sensitivity and the humidity range where they can be used are adjustable by changing one of the sensor\u2019s structural parameters. Moreover, these sensors are proposed as double parameter sensors, using both the frequency shift and the intensity variation of the resonance peak for the measure of the relative humidity. The results show that the sensitivity can vary remarkably among the sensors proposed, together with the operative range. The sensor suitability in two specific smart packaging applications is discussed. In the first case, a threshold sensor in the low-humidity range for package integrity verification is analyzed, and in the second case, a more complex measurement of humidity in non-hermetic packages is investigated. The discussion shows that the sensor configuration can easily be adapted to the different application needs.<\/jats:p>","DOI":"10.3390\/s24092879","type":"journal-article","created":{"date-parts":[[2024,5,3]],"date-time":"2024-05-03T08:02:22Z","timestamp":1714723342000},"page":"2879","update-policy":"https:\/\/doi.org\/10.3390\/mdpi_crossmark_policy","source":"Crossref","is-referenced-by-count":24,"title":["Applications of Chipless RFID Humidity Sensors to Smart Packaging Solutions"],"prefix":"10.3390","volume":"24","author":[{"ORCID":"https:\/\/orcid.org\/0000-0002-8194-805X","authenticated-orcid":false,"given":"Viviana","family":"Mulloni","sequence":"first","affiliation":[{"name":"Center for Sensors and Devices, Fondazione Bruno Kessler, 38123 Trento, Italy"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-9582-1834","authenticated-orcid":false,"given":"Giada","family":"Marchi","sequence":"additional","affiliation":[{"name":"Center for Sensors and Devices, Fondazione Bruno Kessler, 38123 Trento, Italy"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-6688-6161","authenticated-orcid":false,"given":"Andrea","family":"Gaiardo","sequence":"additional","affiliation":[{"name":"Center for Sensors and Devices, Fondazione Bruno Kessler, 38123 Trento, Italy"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0003-2621-5555","authenticated-orcid":false,"given":"Matteo","family":"Valt","sequence":"additional","affiliation":[{"name":"Center for Sensors and Devices, Fondazione Bruno Kessler, 38123 Trento, Italy"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0001-9477-9243","authenticated-orcid":false,"given":"Massimo","family":"Donelli","sequence":"additional","affiliation":[{"name":"Department of Civil Environmental and Mechanical Engineering, University of Trento, 38123 Trento, Italy"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0003-4624-170X","authenticated-orcid":false,"given":"Leandro","family":"Lorenzelli","sequence":"additional","affiliation":[{"name":"Center for Sensors and Devices, Fondazione Bruno Kessler, 38123 Trento, Italy"}],"role":[{"vocabulary":"crossref","role":"author"}]}],"member":"1968","published-online":{"date-parts":[[2024,4,30]]},"reference":[{"key":"ref_1","doi-asserted-by":"crossref","first-page":"R1","DOI":"10.1111\/j.1365-2621.2005.tb09052.x","article-title":"Intelligent Packaging: Concepts and Applications","volume":"70","author":"Yam","year":"2005","journal-title":"J. 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