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In this paper, we present the design, fabrication, and characterization of an FBAR filter for the 3.0 GHz\u20133.2 GHz S-band. Using a scandium-doped aluminum nitride (Sc0.2Al0.8N) film, the filter is designed through a combined acoustic\u2013electromagnetic simulation method, and the FBAR and filter are fabricated using an eight-step lithographic process. The measured FBAR presents an effective electromechanical coupling coefficient (keff2) value up to 13.3%, and the measured filter demonstrates a \u22123 dB bandwidth of 115 MHz (from 3.013 GHz to 3.128 GHz), a low insertion loss of \u22122.4 dB, and good out-of-band rejection of \u221230 dB. The measured 1 dB compression point of the fabricated filter is 30.5 dBm, and the first series resonator burns out first as the input power increases. This work paves the way for research on high-power RF filters in mobile communication.<\/jats:p>","DOI":"10.3390\/s24092939","type":"journal-article","created":{"date-parts":[[2024,5,6]],"date-time":"2024-05-06T14:26:11Z","timestamp":1715005571000},"page":"2939","update-policy":"https:\/\/doi.org\/10.3390\/mdpi_crossmark_policy","source":"Crossref","is-referenced-by-count":9,"title":["Design and Fabrication of a Film Bulk Acoustic Wave Filter for 3.0 GHz\u20133.2 GHz S-Band"],"prefix":"10.3390","volume":"24","author":[{"ORCID":"https:\/\/orcid.org\/0000-0002-5170-3705","authenticated-orcid":false,"given":"Chao","family":"Gao","sequence":"first","affiliation":[{"name":"The Institute of Technological Sciences, Hubei Key Laboratory of Electronic Manufacturing and Packaging Integration, Wuhan University, Wuhan 430072, China"}]},{"given":"Yupeng","family":"Zheng","sequence":"additional","affiliation":[{"name":"The Institute of Technological Sciences, Hubei Key Laboratory of Electronic Manufacturing and Packaging Integration, Wuhan University, Wuhan 430072, China"}]},{"given":"Haiyang","family":"Li","sequence":"additional","affiliation":[{"name":"The Institute of Technological Sciences, Hubei Key Laboratory of Electronic Manufacturing and Packaging Integration, Wuhan University, Wuhan 430072, China"}]},{"given":"Yuqi","family":"Ren","sequence":"additional","affiliation":[{"name":"The Institute of Technological Sciences, Hubei Key Laboratory of Electronic Manufacturing and Packaging Integration, Wuhan University, Wuhan 430072, China"}]},{"given":"Xiyu","family":"Gu","sequence":"additional","affiliation":[{"name":"The Institute of Technological Sciences, Hubei Key Laboratory of Electronic Manufacturing and Packaging Integration, Wuhan University, Wuhan 430072, China"}]},{"given":"Xiaoming","family":"Huang","sequence":"additional","affiliation":[{"name":"The Institute of Technological Sciences, Hubei Key Laboratory of Electronic Manufacturing and Packaging Integration, Wuhan University, Wuhan 430072, China"}]},{"given":"Yaxin","family":"Wang","sequence":"additional","affiliation":[{"name":"The Institute of Technological Sciences, Hubei Key Laboratory of Electronic Manufacturing and Packaging Integration, Wuhan University, Wuhan 430072, China"}]},{"given":"Yuanhang","family":"Qu","sequence":"additional","affiliation":[{"name":"The Institute of Technological Sciences, Hubei Key Laboratory of Electronic Manufacturing and Packaging Integration, Wuhan University, Wuhan 430072, China"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-6251-7123","authenticated-orcid":false,"given":"Yan","family":"Liu","sequence":"additional","affiliation":[{"name":"The Institute of Technological Sciences, Hubei Key Laboratory of Electronic Manufacturing and Packaging Integration, Wuhan University, Wuhan 430072, China"}]},{"ORCID":"https:\/\/orcid.org\/0000-0003-0555-5745","authenticated-orcid":false,"given":"Yao","family":"Cai","sequence":"additional","affiliation":[{"name":"The Institute of Technological Sciences, Hubei Key Laboratory of Electronic Manufacturing and Packaging Integration, Wuhan University, Wuhan 430072, China"},{"name":"Hubei Yangtze Memory Laboratories, Wuhan 430205, China"}]},{"ORCID":"https:\/\/orcid.org\/0000-0003-1986-2674","authenticated-orcid":false,"given":"Chengliang","family":"Sun","sequence":"additional","affiliation":[{"name":"The Institute of Technological Sciences, Hubei Key Laboratory of Electronic Manufacturing and Packaging Integration, Wuhan University, Wuhan 430072, China"},{"name":"Hubei Yangtze Memory Laboratories, Wuhan 430205, China"},{"name":"Wuhan Institute of Quantum Technology, Wuhan 430072, China"}]}],"member":"1968","published-online":{"date-parts":[[2024,5,5]]},"reference":[{"key":"ref_1","doi-asserted-by":"crossref","unstructured":"AlJoumayly, M., Rothemund, R., Schaefer, M., and Heeren, W. 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