{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,2,5]],"date-time":"2026-02-05T06:10:19Z","timestamp":1770271819094,"version":"3.49.0"},"reference-count":27,"publisher":"MDPI AG","issue":"13","license":[{"start":{"date-parts":[[2024,7,2]],"date-time":"2024-07-02T00:00:00Z","timestamp":1719878400000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/creativecommons.org\/licenses\/by\/4.0\/"}],"funder":[{"name":"National Natural Science Foundation of China (NSFC)","award":["62293493"],"award-info":[{"award-number":["62293493"]}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["Sensors"],"abstract":"<jats:p>A sensitive, miniaturized, ultrawideband probe is proposed for near-field measurements. The proposed probe is based on a new V-shaped tip design and a slope structure resulting in better field distribution and impedance matching with a span bandwidth from 10 kHz up to 52 GHz, which is compatible with ultrawideband applications. The proposed E-probe fabrication process utilizes a four-layer printed circuit board (PCB) using Rogers RO4003 (tm) and RO4450 high-performance dielectrics, with \u03b5r = 3.55 and 3.3, respectively. The probe length is 40 mm with a minimum width of 4 mm, which is suitable for narrow, complex, and integrated PCBs. The passive E-probe sensitivity is \u2212106.29 dBm and \u221287.48 dBm at 2 GHz and 40 GHz, respectively. It has a very small spatial resolution of 0.5 mm at 20, 25, 30, and 35 GHz. The probe is small and cheap and can diagnose electromagnetic interference (EMI) in electronic systems such as telemetry, UAVs, and avionics.<\/jats:p>","DOI":"10.3390\/s24134295","type":"journal-article","created":{"date-parts":[[2024,7,2]],"date-time":"2024-07-02T05:08:34Z","timestamp":1719896914000},"page":"4295","update-policy":"https:\/\/doi.org\/10.3390\/mdpi_crossmark_policy","source":"Crossref","is-referenced-by-count":5,"title":["A Miniaturized Ultrawideband V-Shaped Tip E-Probe for Near-Field Measurements"],"prefix":"10.3390","volume":"24","author":[{"ORCID":"https:\/\/orcid.org\/0009-0005-4331-3917","authenticated-orcid":false,"given":"Mahmoud Mohammed","family":"Khodeir","sequence":"first","affiliation":[{"name":"School of Electronic and Information Engineering, Beihang University, Beiijng 100191, China"}]},{"ORCID":"https:\/\/orcid.org\/0000-0003-0994-7578","authenticated-orcid":false,"given":"Zhaowen","family":"Yan","sequence":"additional","affiliation":[{"name":"School of Electronic and Information Engineering, Beihang University, Beiijng 100191, China"}]},{"given":"Fuyu","family":"Zhao","sequence":"additional","affiliation":[{"name":"School of Electronic and Information Engineering, Beihang University, Beiijng 100191, China"}]}],"member":"1968","published-online":{"date-parts":[[2024,7,2]]},"reference":[{"key":"ref_1","doi-asserted-by":"crossref","unstructured":"Paul, C.R. (2006). Introduction to Electromagnetic Compatibility, John Wiley & Sons.","DOI":"10.1002\/0471758159"},{"key":"ref_2","doi-asserted-by":"crossref","unstructured":"Adamczyk, B. (2017). Foundations of Electromagnetic Compatibility: With Practical Applications, John Wiley & Sons.","DOI":"10.1002\/9781119120810"},{"key":"ref_3","doi-asserted-by":"crossref","unstructured":"Ott, H.W. (2009). Electromagnetic Compatibility Engineering, John Wiley & Sons.","DOI":"10.1002\/9780470508510"},{"key":"ref_4","unstructured":"(2024, March 01). IEEE Electromagnetic Compatibility Society (IEEE EMC Society). Available online: https:\/\/www.emcs.org\/."},{"key":"ref_5","unstructured":"(2024, March 01). International Electrotechnical Commission (IEC) Standards Related to EMC. Available online: https:\/\/www.iec.ch\/emc\/."},{"key":"ref_6","doi-asserted-by":"crossref","first-page":"650","DOI":"10.1109\/19.769679","article-title":"Electrooptic sensor for near-field measurement","volume":"48","author":"Cecelja","year":"1999","journal-title":"IEEE Trans. Instrum. Meas."},{"key":"ref_7","unstructured":"Thiele, L., Geise, R., Spieker, H., Sch\u00fc\u00fcr, J., and Enders, A. (2010, January 12\u201316). Electro-optical-sensor for near-field measurements of large antennas. Proceedings of the Fourth European Conference on Antennas and Propagation, Barcelona, Spain."},{"key":"ref_8","first-page":"39","article-title":"Fiber-mounted Electro-optic Probe for Microwave Electric-field Measurement in Plasma Environment","volume":"114","author":"Togo","year":"2013","journal-title":"IEICE Tech. Rep. IEICE Tech. Rep."},{"key":"ref_9","doi-asserted-by":"crossref","unstructured":"Shi, H., Ma, J., Li, X., Liu, J., Li, C., and Zhang, S. (2018). A quantum-based microwave magnetic field sensor. Sensors, 18.","DOI":"10.3390\/s18103288"},{"key":"ref_10","doi-asserted-by":"crossref","first-page":"2276","DOI":"10.1109\/TMTT.2018.2812204","article-title":"Noninvasive Imaging Method of Microwave Near Field Based on Solid-State Quantum Sensing","volume":"66","author":"Yang","year":"2018","journal-title":"IEEE Trans. Microw. Theory Tech."},{"key":"ref_11","unstructured":"(2005). Integrated Circuits\u2014Measurement of Electromagnetic Emissions, 150 KHz to 1 GHz\u2014Part 3: Measurement of Radiated Emissions\u2014Surface Scan Method (Standard No. IEC TS 61967-3:2005)."},{"key":"ref_12","unstructured":"Ostermann, T., and Deutschmann, B. (25, January 25\u201328). Characterization of the EME of integrated circuits with the help of the IEC standard 61967 [electromagnetic emission]. Proceedings of the Eighth IEEE European Test Workshop, Maastricht, The Netherlands."},{"key":"ref_13","doi-asserted-by":"crossref","unstructured":"Li, G., Pommerenke, D., and Min, J. (2017, January 7\u201311). A low frequency electric field probe for near-field measurement in EMC applications. Proceedings of the 2017 IEEE International Symposium on Electromagnetic Compatibility & Signal\/Power Integrity (EMCSI), Washington, DC, USA.","DOI":"10.1109\/ISEMC.2017.8077921"},{"key":"ref_14","doi-asserted-by":"crossref","first-page":"908","DOI":"10.1109\/LMWC.2014.2361433","article-title":"A high-sensitivity electric probe based on board-level edge plating and LC resonance","volume":"24","author":"Song","year":"2014","journal-title":"IEEE Microw. Wirel. Compon. Lett."},{"key":"ref_15","doi-asserted-by":"crossref","first-page":"1283","DOI":"10.1109\/LAWP.2019.2915258","article-title":"An Ultrawideband Electric Probe Based on U-Shaped Structure for Near-Field Measurement From 9 kHz to 40 GHz","volume":"18","author":"Liu","year":"2019","journal-title":"IEEE Antennas Wirel. Propag. Lett."},{"key":"ref_16","doi-asserted-by":"crossref","first-page":"1694","DOI":"10.1109\/22.734563","article-title":"Calibration of electric coaxial near-field probes and applications","volume":"46","author":"Gao","year":"1998","journal-title":"IEEE Trans. Microw. Theory Tech."},{"key":"ref_17","doi-asserted-by":"crossref","unstructured":"Fano, W.G., Alonso, R., and Carducci, L.M. (2016, January 7\u20139). Near field magnetic probe applied to switching power supply. Proceedings of the 2016 IEEE Global Electromagnetic Compatibility Conference (GEMCCON), Mar del Plata, Argentina.","DOI":"10.1109\/GEMCCON.2016.7797317"},{"key":"ref_18","doi-asserted-by":"crossref","first-page":"4233","DOI":"10.1109\/TMTT.2013.2288089","article-title":"Space difference magnetic near-field probe with spatial resolution improvement","volume":"61","author":"Chou","year":"2013","journal-title":"IEEE Trans. Microw. Theory Tech."},{"key":"ref_19","doi-asserted-by":"crossref","first-page":"3012","DOI":"10.1109\/TIM.2018.2869181","article-title":"A High-Frequency and High Spatial Resolution Probe Design for EMI Prediction","volume":"68","author":"Yang","year":"2019","journal-title":"IEEE Trans. Instrum. Meas."},{"key":"ref_20","doi-asserted-by":"crossref","first-page":"911","DOI":"10.1109\/22.506451","article-title":"A New Miniature Magnetic Field Probe for Measuring Three-Dimensional Fields in Planar High-Frequency Circuits","volume":"44","author":"Gao","year":"1996","journal-title":"IEEE Trans. Microw. Theory Tech."},{"key":"ref_21","doi-asserted-by":"crossref","first-page":"907","DOI":"10.1109\/22.701442","article-title":"Miniature Electric Near-Field Probes for Measuring 3-D Fields in Planar Microwave Circuits","volume":"46","author":"Gao","year":"1998","journal-title":"IEEE Trans. Microw. Theory Tech."},{"key":"ref_22","doi-asserted-by":"crossref","first-page":"2762","DOI":"10.1109\/TIM.2017.2681282","article-title":"A Miniature Ultrawideband Electric Field Probe Based on Coax-Thru-Hole via Array for Near-Field Measurement","volume":"66","author":"Yan","year":"2017","journal-title":"IEEE Trans. Instrum. Meas."},{"key":"ref_23","first-page":"1","article-title":"A Miniaturized Ultrawideband Active Electric Probe With High Sensitivity for Near-Field Measurement","volume":"71","author":"Zhou","year":"2022","journal-title":"IEEE Trans. Instrum. Meas."},{"key":"ref_24","doi-asserted-by":"crossref","first-page":"2552","DOI":"10.1109\/LAWP.2019.2942956","article-title":"A Miniature High-Sensitivity Active Electric Field Probe for Near-Field Measurement","volume":"18","author":"Min","year":"2019","journal-title":"IEEE Antennas Wirel. Propag. Lett."},{"key":"ref_25","first-page":"1","article-title":"An Ultra-Wideband Electric Field Probe With High Sensitivity for Near-Field Measurement","volume":"72","author":"Liu","year":"2023","journal-title":"IEEE Trans. Instrum. Meas."},{"key":"ref_26","doi-asserted-by":"crossref","first-page":"882","DOI":"10.1109\/TIM.2018.2857898","article-title":"Improved-Sensitivity Resonant Electric-Field Probes Based on Planar Spiral Stripline and Rectangular Plate Structure","volume":"68","author":"Wang","year":"2019","journal-title":"IEEE Trans. Instrum. Meas."},{"key":"ref_27","unstructured":"Park, Y., Bang, J., Jung, K., and Choi, J. (2018, January 23\u201326). Design of a broadband electric near-field probe with improved sensitivity using additional tips. Proceedings of the 2018 International Symposium on Antennas and Propagation (ISAP), Busan, Republic of Korea."}],"container-title":["Sensors"],"original-title":[],"language":"en","link":[{"URL":"https:\/\/www.mdpi.com\/1424-8220\/24\/13\/4295\/pdf","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2025,10,10]],"date-time":"2025-10-10T15:08:55Z","timestamp":1760108935000},"score":1,"resource":{"primary":{"URL":"https:\/\/www.mdpi.com\/1424-8220\/24\/13\/4295"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2024,7,2]]},"references-count":27,"journal-issue":{"issue":"13","published-online":{"date-parts":[[2024,7]]}},"alternative-id":["s24134295"],"URL":"https:\/\/doi.org\/10.3390\/s24134295","relation":{},"ISSN":["1424-8220"],"issn-type":[{"value":"1424-8220","type":"electronic"}],"subject":[],"published":{"date-parts":[[2024,7,2]]}}}