{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,10,11]],"date-time":"2025-10-11T01:25:52Z","timestamp":1760145952880,"version":"build-2065373602"},"reference-count":20,"publisher":"MDPI AG","issue":"18","license":[{"start":{"date-parts":[[2024,9,11]],"date-time":"2024-09-11T00:00:00Z","timestamp":1726012800000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/creativecommons.org\/licenses\/by\/4.0\/"}],"funder":[{"DOI":"10.13039\/501100012166","name":"National Key Research and Development Program of China","doi-asserted-by":"publisher","award":["2020YFA0714001","2018YFF01013001","2017YFA0701000","62471119","61988102","61921002","62071108","23ZDYF0471","2023T160443","2022NSFSC0513"],"award-info":[{"award-number":["2020YFA0714001","2018YFF01013001","2017YFA0701000","62471119","61988102","61921002","62071108","23ZDYF0471","2023T160443","2022NSFSC0513"]}],"id":[{"id":"10.13039\/501100012166","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100001809","name":"Natural Science Foundation of China","doi-asserted-by":"publisher","award":["2020YFA0714001","2018YFF01013001","2017YFA0701000","62471119","61988102","61921002","62071108","23ZDYF0471","2023T160443","2022NSFSC0513"],"award-info":[{"award-number":["2020YFA0714001","2018YFF01013001","2017YFA0701000","62471119","61988102","61921002","62071108","23ZDYF0471","2023T160443","2022NSFSC0513"]}],"id":[{"id":"10.13039\/501100001809","id-type":"DOI","asserted-by":"publisher"}]},{"name":"Key Science and Technology Program of Sichuan Province","award":["2020YFA0714001","2018YFF01013001","2017YFA0701000","62471119","61988102","61921002","62071108","23ZDYF0471","2023T160443","2022NSFSC0513"],"award-info":[{"award-number":["2020YFA0714001","2018YFF01013001","2017YFA0701000","62471119","61988102","61921002","62071108","23ZDYF0471","2023T160443","2022NSFSC0513"]}]},{"DOI":"10.13039\/501100002858","name":"China Postdoctoral Science Foundation","doi-asserted-by":"publisher","award":["2020YFA0714001","2018YFF01013001","2017YFA0701000","62471119","61988102","61921002","62071108","23ZDYF0471","2023T160443","2022NSFSC0513"],"award-info":[{"award-number":["2020YFA0714001","2018YFF01013001","2017YFA0701000","62471119","61988102","61921002","62071108","23ZDYF0471","2023T160443","2022NSFSC0513"]}],"id":[{"id":"10.13039\/501100002858","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100018542","name":"Natural Science Foundation of Sichuan Province","doi-asserted-by":"publisher","award":["2020YFA0714001","2018YFF01013001","2017YFA0701000","62471119","61988102","61921002","62071108","23ZDYF0471","2023T160443","2022NSFSC0513"],"award-info":[{"award-number":["2020YFA0714001","2018YFF01013001","2017YFA0701000","62471119","61988102","61921002","62071108","23ZDYF0471","2023T160443","2022NSFSC0513"]}],"id":[{"id":"10.13039\/501100018542","id-type":"DOI","asserted-by":"publisher"}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["Sensors"],"abstract":"<jats:p>This paper presents a method to enhance extended interaction oscillator (EIO) output power based on a dual-cavity parallel structure (DCPS). This stucture consists of two conventional ladder-line structures in parallel through a connecting structure, which improves the coupling efficiency between the cavities. The dual output power fusion structure employs an H-T type combiner as the output coupler, which can effectively combine the two input waves in phase to further increase the output power. The dispersion characteristics, coupling impedance, and field distribution of the DCPS are investigated through numerical and simulation calculations, and the optimal operating parameters and output structure are obtained by PIC simulation. At an operating voltage of 12.6 kV, current density of 200 A\/cm2, and longitudinal magnetic field of 0.5 T, the DCPS EIO exhibits an output power exceeding 600 W at a frequency of 140.6 GHz. This represents a nearly three-fold enhancement compared with the 195 W output of the conventional ladder-line EIO structure. These findings demonstrate the significant improvement in output power and interaction efficiency achieved by the DCPS for the EIO device.<\/jats:p>","DOI":"10.3390\/s24185891","type":"journal-article","created":{"date-parts":[[2024,9,11]],"date-time":"2024-09-11T05:45:12Z","timestamp":1726033512000},"page":"5891","update-policy":"https:\/\/doi.org\/10.3390\/mdpi_crossmark_policy","source":"Crossref","is-referenced-by-count":0,"title":["Research of a 0.14 THz Dual-Cavity Parallel Structure Extended Interaction Oscillator"],"prefix":"10.3390","volume":"24","author":[{"given":"Chuanhong","family":"Xiao","sequence":"first","affiliation":[{"name":"School of Electronic Science and Engineering, University of Electronic Science and Technology of China, Chengdu 610054, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Ruizhe","family":"Ren","sequence":"additional","affiliation":[{"name":"School of Electronic Science and Engineering, University of Electronic Science and Technology of China, Chengdu 610054, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Zhenhua","family":"Wu","sequence":"additional","affiliation":[{"name":"School of Electronic Science and Engineering, University of Electronic Science and Technology of China, Chengdu 610054, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Yijun","family":"Li","sequence":"additional","affiliation":[{"name":"State Key Laboratory of Polymer Materials Engineering, Polymer Research Institute, Sichuan University, Chengdu 610041, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Qing","family":"You","sequence":"additional","affiliation":[{"name":"School of Electronic Science and Engineering, University of Electronic Science and Technology of China, Chengdu 610054, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Zongjun","family":"Shi","sequence":"additional","affiliation":[{"name":"School of Electronic Science and Engineering, University of Electronic Science and Technology of China, Chengdu 610054, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-5772-3029","authenticated-orcid":false,"given":"Kaichun","family":"Zhang","sequence":"additional","affiliation":[{"name":"School of Electronic Science and Engineering, University of Electronic Science and Technology of China, Chengdu 610054, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Xiaoxing","family":"Chen","sequence":"additional","affiliation":[{"name":"School of Electronic Science and Engineering, University of Electronic Science and Technology of China, Chengdu 610054, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Mingzhou","family":"Zhan","sequence":"additional","affiliation":[{"name":"School of Physics, University of Electronic Science and Technology of China, Chengdu 610054, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Diwei","family":"Liu","sequence":"additional","affiliation":[{"name":"School of Electronic Science and Engineering, University of Electronic Science and Technology of China, Chengdu 610054, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Renbin","family":"Zhong","sequence":"additional","affiliation":[{"name":"School of Electronic Science and Engineering, University of Electronic Science and Technology of China, Chengdu 610054, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Shenggang","family":"Liu","sequence":"additional","affiliation":[{"name":"School of Electronic Science and Engineering, University of Electronic Science and Technology of China, Chengdu 610054, China"}],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"1968","published-online":{"date-parts":[[2024,9,11]]},"reference":[{"key":"ref_1","doi-asserted-by":"crossref","first-page":"54","DOI":"10.1109\/TTHZ.2011.2151610","article-title":"Vacuum Electronic High Power Terahertz Sources","volume":"1","author":"Booske","year":"2011","journal-title":"IEEE Trans. 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