{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,9,9]],"date-time":"2026-09-09T05:09:00Z","timestamp":1788930540462,"version":"build-2803163510"},"reference-count":81,"publisher":"MDPI AG","issue":"9","license":[{"start":{"date-parts":[[2026,9,7]],"date-time":"2026-09-07T00:00:00Z","timestamp":1788739200000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/creativecommons.org\/licenses\/by\/4.0\/"}],"funder":[{"DOI":"10.13039\/501100001809","name":"the National Natural Science Foundation of China","doi-asserted-by":"crossref","award":["22308268"],"award-info":[{"award-number":["22308268"]}],"id":[{"id":"10.13039\/501100001809","id-type":"DOI","asserted-by":"crossref"}]},{"award":["22308268"],"award-info":[{"award-number":["22308268"]}],"id":[{"id":"https:\/\/ror.org\/01h0zpd94","id-type":"ROR","asserted-by":"publisher"}]},{"name":"Key Medical Research Project of Xi\u2019an Science and Technology Program","award":["25YXYJZD00023"],"award-info":[{"award-number":["25YXYJZD00023"]}]},{"DOI":"10.13039\/501100012226","name":"Fundamental Research Funds for the Central Universities","doi-asserted-by":"publisher","award":["QTZX26019"],"award-info":[{"award-number":["QTZX26019"]}],"id":[{"id":"10.13039\/501100012226","id-type":"DOI","asserted-by":"publisher"}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["Gels"],"abstract":"<jats:p>Flexible and stretchable electronics inevitably undergo stretching, compression, bending and torsion when conformally attached to skin, soft tissues and dynamic organs. While deformation-induced electrical variations act as target signals for motion sensors, they cause resistance\/impedance drift, baseline shift and sensitivity degradation in physiological electrodes, temperature\/chemical sensors, interconnects and stimulation devices, leading to motion artifacts and reduced long-term reliability. Hydrogels are pivotal materials for soft bioelectronic interfaces owing to their high water content, low modulus, tissue compatibility and ionic conductivity. However, their conductive networks are susceptible to structural reconstruction under deformation, dehydration, swelling and cyclic fatigue, meaning that stretchability is by no means equivalent to strain insensitivity. This review focuses on stable resistance\/impedance and functional output within a specified strain window, this paper reviews three representative material systems, liquid metal (LM)-based composite hydrogels, conductive polymer\/elastic network composite hydrogels, and hydrogen-bonded isotropic architectures. It further summarizes three design strategies\u2014geometric and functional compensation, mechanical decoupling and strain isolation, and interfacial engineering for conductive network stabilization\u2014and discusses their applications in wearable epidermal and implantable bioelectronics. Finally, unified evaluation metrics for strain insensitivity are proposed, with future directions covering high-conductivity\u2013low-modulus synergy, long-term water\/ionic stability, robust soft-hard interfaces, multiaxial deformation tolerance and scalable manufacturability.<\/jats:p>","DOI":"10.3390\/gels12090822","type":"journal-article","created":{"date-parts":[[2026,9,7]],"date-time":"2026-09-07T13:53:28Z","timestamp":1788789208000},"page":"822","update-policy":"https:\/\/doi.org\/10.3390\/mdpi_crossmark_policy","source":"Crossref","is-referenced-by-count":0,"title":["Strain-Insensitive Conductive Hydrogel Materials for Motion-Artifact-Free Flexible Bioelectronics"],"prefix":"10.3390","volume":"12","author":[{"ORCID":"https:\/\/orcid.org\/0009-0008-5066-9120","authenticated-orcid":false,"given":"Yarong","family":"Ding","sequence":"first","affiliation":[{"name":"State Key Laboratory of Wide-Bandgap Semiconductor Devices and Integrated Technology, Faculty of Integrated Circuit, Xidian University, Xi\u2019an 710071, China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Yitong","family":"Dou","sequence":"additional","affiliation":[{"name":"State Key Laboratory of Wide-Bandgap Semiconductor Devices and Integrated Technology, Faculty of Integrated Circuit, Xidian University, Xi\u2019an 710071, China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Lei","family":"Bai","sequence":"additional","affiliation":[{"name":"State Key Laboratory of Wide-Bandgap Semiconductor Devices and Integrated Technology, Faculty of Integrated Circuit, Xidian University, Xi\u2019an 710071, China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Zhenyu","family":"Li","sequence":"additional","affiliation":[{"name":"State Key Laboratory of Wide-Bandgap Semiconductor Devices and Integrated Technology, Faculty of Integrated Circuit, Xidian University, Xi\u2019an 710071, China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Jiayi","family":"Qi","sequence":"additional","affiliation":[{"name":"State Key Laboratory of Wide-Bandgap Semiconductor Devices and Integrated Technology, Faculty of Integrated Circuit, Xidian University, Xi\u2019an 710071, China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Yufeng","family":"Li","sequence":"additional","affiliation":[{"name":"Shaanxi Key Laboratory of Degradable Biomedical Materials, School of Chemical Engineering, Northwest University, Xi\u2019an 710069, China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0009-0008-7505-5248","authenticated-orcid":false,"given":"Shaozhe","family":"Tan","sequence":"additional","affiliation":[{"name":"State Key Laboratory of Wide-Bandgap Semiconductor Devices and Integrated Technology, Faculty of Integrated Circuit, Xidian University, Xi\u2019an 710071, China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0009-0009-8865-5346","authenticated-orcid":false,"given":"Xuesi","family":"Zhang","sequence":"additional","affiliation":[{"name":"State Key Laboratory of Wide-Bandgap Semiconductor Devices and Integrated Technology, Faculty of Integrated Circuit, Xidian University, Xi\u2019an 710071, China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0009-0009-5898-9783","authenticated-orcid":false,"given":"Jiachun","family":"Sun","sequence":"additional","affiliation":[{"name":"State Key Laboratory of Wide-Bandgap Semiconductor Devices and Integrated Technology, Faculty of Integrated Circuit, Xidian University, Xi\u2019an 710071, China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Yahui","family":"Song","sequence":"additional","affiliation":[{"name":"State Key Laboratory of Wide-Bandgap Semiconductor Devices and Integrated Technology, Faculty of Integrated Circuit, Xidian University, Xi\u2019an 710071, China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Jingxuan","family":"Wu","sequence":"additional","affiliation":[{"name":"State Key Laboratory of Wide-Bandgap Semiconductor Devices and Integrated Technology, Faculty of Integrated Circuit, Xidian University, Xi\u2019an 710071, China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0003-4319-5445","authenticated-orcid":false,"given":"Fei","family":"Han","sequence":"additional","affiliation":[{"name":"School of Life Science and Technology, Xi\u2019an Jiaotong University, Xi\u2019an 710049, China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0001-8740-5200","authenticated-orcid":false,"given":"Yingchun","family":"Li","sequence":"additional","affiliation":[{"name":"State Key Laboratory of Wide-Bandgap Semiconductor Devices and Integrated Technology, Faculty of Integrated Circuit, Xidian University, Xi\u2019an 710071, China"},{"name":"Advanced Interdisciplinary Research Center for Flexible Electronics, Faculty of Infor-X, Xidian University, Xi\u2019an 710071, China"}],"role":[{"vocabulary":"crossref","role":"author"}]}],"member":"1968","published-online":{"date-parts":[[2026,9,7]]},"reference":[{"key":"ref_1","doi-asserted-by":"crossref","unstructured":"Li, Y., Tan, S., Zhang, X., Li, Z., Cai, J., and Liu, Y. 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