{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,9,21]],"date-time":"2026-09-21T18:18:50Z","timestamp":1790014730318,"version":"4.0.1"},"reference-count":31,"publisher":"MDPI AG","issue":"4","license":[{"start":{"date-parts":[[2019,2,20]],"date-time":"2019-02-20T00:00:00Z","timestamp":1550620800000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/creativecommons.org\/licenses\/by\/4.0\/"}],"funder":[{"DOI":"10.13039\/501100004663","name":"Ministry of Science and Technology, Taiwan","doi-asserted-by":"publisher","award":["MOST-106-2628-E-006-002-MY3"],"award-info":[{"award-number":["MOST-106-2628-E-006-002-MY3"]}],"id":[{"id":"10.13039\/501100004663","id-type":"DOI","asserted-by":"publisher"}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["Materials"],"abstract":"<jats:p>Low-temperature lead (Pb)-free solders are demanding in the electronic packaging industry, because it would open the door for various economic choices of polymeric materials as substrates and also revives the lower cost processes. Here, we proposed a tin\u2013bismuth\u2013indium\u2013gallium (Sn-52.5Bi-2.68In-1Ga, SBIG (in wt.%)) quaternary low-temperature solder, designed based on systematic CALPHAD (CALculation of PHAse Diagram)-type thermodynamic calculations and corresponding key experiments. The solidification behavior of SBIG was carefully elaborated based on the computations using the lever rule and the Scheil model, and the experiments in terms of thermal analyses and microstructures of sample produced with step-quenching and various cooling rates. The mechanical properties of as-cast and 80 \u00b0C-annealed SBIG as well as their microstructures and fracture surfaces were evaluated in the tensile tests. The proposed SBIG solder is with a low liquidus temperature of 141.9 \u00b0C and is typically composed of the primary (Sn) phase, the (Sn) + (Bi) eutectic structure and a small amount of (Ga) phase. Air cooling has been identified as a satisfactory cooling rate, which would not lead to the formation of the brittle BiIn intermetallic compound. The as-cast SBIG solder exhibited high yield strength (YS) of 43.7 MPa, high ultimate tensile strength (UTS) of 53.3 MPa and an extremely large elongation of 97.3% as comparing to the conventional eutectic Sn-58Bi solder (YS: 43.1 MPa, UTS: 49.5 MPa, and elongation: 37.5%). However, the proposed SBIG solder does not possess qualified thermal stability, that significant degradation in both strength and elongation were observed after being subjected to extensive thermal ageing at 80 \u00b0C for 504 h.<\/jats:p>","DOI":"10.3390\/ma12040631","type":"journal-article","created":{"date-parts":[[2019,2,20]],"date-time":"2019-02-20T11:45:39Z","timestamp":1550663139000},"page":"631","update-policy":"https:\/\/doi.org\/10.3390\/mdpi_crossmark_policy","source":"Crossref","is-referenced-by-count":24,"title":["A Computational Thermodynamics-Assisted Development of Sn-Bi-In-Ga Quaternary Alloys as Low-Temperature Pb-Free Solders"],"prefix":"10.3390","volume":"12","author":[{"given":"Chih-han","family":"Yang","sequence":"first","affiliation":[{"name":"Department of Materials Science and Engineering, National Cheng Kung University, Tainan 70101, Taiwan"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Shiqi","family":"Zhou","sequence":"additional","affiliation":[{"name":"Joining and Welding Research Institute, Osaka University, 11-1 Mihogaoka, Ibaraki, Osaka 567-0047, Japan"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-0832-3213","authenticated-orcid":false,"given":"Shih-kang","family":"Lin","sequence":"additional","affiliation":[{"name":"Department of Materials Science and Engineering, National Cheng Kung University, Tainan 70101, Taiwan"},{"name":"Hierachical Green-Energy Materials (Hi-GEM) Research Center, National Cheng Kung University, Tainan 70101, Taiwan"},{"name":"Center for Micro\/Nano Science and Technology, National Cheng Kung University, Tainan 70101, Taiwan"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Hiroshi","family":"Nishikawa","sequence":"additional","affiliation":[{"name":"Joining and Welding Research Institute, Osaka University, 11-1 Mihogaoka, Ibaraki, Osaka 567-0047, Japan"}],"role":[{"vocabulary":"crossref","role":"author"}]}],"member":"1968","published-online":{"date-parts":[[2019,2,20]]},"reference":[{"key":"ref_1","doi-asserted-by":"crossref","first-page":"1712","DOI":"10.1557\/jmr.2006.0200","article-title":"Interfacial reactions in the Sn\u201320 at.% In\/Cu and Sn\u201320 at.% In\/Ni couples at 160 C","volume":"21","author":"Lin","year":"2006","journal-title":"J. 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