{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,8,11]],"date-time":"2026-08-11T07:12:28Z","timestamp":1786432348790,"version":"build-2736575974"},"reference-count":27,"publisher":"MDPI AG","issue":"16","license":[{"start":{"date-parts":[[2020,8,18]],"date-time":"2020-08-18T00:00:00Z","timestamp":1597708800000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/creativecommons.org\/licenses\/by\/4.0\/"}],"funder":[{"DOI":"10.13039\/501100001809","name":"National Natural Science Foundation of China","doi-asserted-by":"publisher","award":["51675256"],"award-info":[{"award-number":["51675256"]}],"id":[{"id":"10.13039\/501100001809","id-type":"DOI","asserted-by":"publisher"}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["Materials"],"abstract":"<jats:p>The 1060 aluminum and T2 copper were joined by the pulsed double electrode gas metal arc welding (DE-GMAW) brazing method by using four types of filler wires, namely pure aluminum (Al) ER1100, aluminum-magnesium (Al\u2013Mg) ER5356, aluminum-silicon (Al\u2013Si) ER4043, and Al\u2013Si ER4047, respectively. The effects of different types of filler wires on intermetallic compounds, microhardness tensile strength, and conductivity of joints were investigated. The results showed that a lot of brittle intermetallic compounds laying in the copper side brazing interface zone were generated using pure Al, Al\u2013Mg, and Al\u2013Si filler wires, which caused the change of microhardness, tensile strength, and the conductivity of joints. Meanwhile, with the increase in Si elements contents for Al\u2013Sifiller wires, the thickness of the intermetallic compound layers decreased obviously, which was only up to 3 \u00b5m and the conductivity of the joints decreased. In addition, the microhardness, tensile strength, and the conductivity of the joints, when using Al\u2013Sifiller wires, was higher than that using pure Al and Al\u2013Mg filler wires. Hence, in comparison to the pure filler wires and Al\u2013Mg filler wires, the Al\u2013Si filler wires were more suitable for Al\u2013Cu joints by DE-GMAW as Si element content was lower.<\/jats:p>","DOI":"10.3390\/ma13163648","type":"journal-article","created":{"date-parts":[[2020,8,18]],"date-time":"2020-08-18T11:15:27Z","timestamp":1597749327000},"page":"3648","update-policy":"https:\/\/doi.org\/10.3390\/mdpi_crossmark_policy","source":"Crossref","is-referenced-by-count":17,"title":["Effect of Different Filler Wires on Mechanical Property and Conductivity of Aluminum-Copper Joints"],"prefix":"10.3390","volume":"13","author":[{"given":"Hengming","family":"Zhang","sequence":"first","affiliation":[{"name":"State Key Laboratory of Advanced Processing and Recycling of Non-ferrous Metals, Lanzhou University of Technology, Lanzhou 730050, China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Yu","family":"Shi","sequence":"additional","affiliation":[{"name":"State Key Laboratory of Advanced Processing and Recycling of Non-ferrous Metals, Lanzhou University of Technology, Lanzhou 730050, China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Yufen","family":"Gu","sequence":"additional","affiliation":[{"name":"State Key Laboratory of Advanced Processing and Recycling of Non-ferrous Metals, Lanzhou University of Technology, Lanzhou 730050, China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Chunkai","family":"Li","sequence":"additional","affiliation":[{"name":"State Key Laboratory of Advanced Processing and Recycling of Non-ferrous Metals, Lanzhou University of Technology, Lanzhou 730050, China"}],"role":[{"vocabulary":"crossref","role":"author"}]}],"member":"1968","published-online":{"date-parts":[[2020,8,18]]},"reference":[{"key":"ref_1","doi-asserted-by":"crossref","first-page":"233","DOI":"10.1080\/10426914.2015.1025971","article-title":"A review on dissimilar friction stir welding of copper to aluminum: Process, properties, and variants","volume":"31","author":"Mehta","year":"2016","journal-title":"Mater. Manuf. Process."},{"key":"ref_2","doi-asserted-by":"crossref","first-page":"212","DOI":"10.1016\/j.jallcom.2004.07.057","article-title":"Effects of intermetallic compound on the electrical and mechanical properties of friction welded Cu\/Al bimetallic joints during annealing","volume":"390","author":"Lee","year":"2005","journal-title":"J. Alloy. Compd."},{"key":"ref_3","doi-asserted-by":"crossref","first-page":"233","DOI":"10.1016\/S0925-8388(01)00872-6","article-title":"Growth rate of intermetallic compounds in Al\/Cu bimetal produced by cold roll welding process","volume":"319","author":"Abbasi","year":"2001","journal-title":"J. Alloy. Compd."},{"key":"ref_4","doi-asserted-by":"crossref","first-page":"1737","DOI":"10.1016\/j.intermet.2011.07.007","article-title":"Re-investigation of phase equilibria in the system Al\u2013Cu and structural analysis of the high-temperature phase \u03b71-Al1\u2212\u03b4Cu","volume":"19","author":"Ponweiser","year":"2011","journal-title":"Intermetallics"},{"key":"ref_5","doi-asserted-by":"crossref","first-page":"312","DOI":"10.1016\/j.jmapro.2019.07.009","article-title":"Influence of laser power on microstructure and mechanical property of laser-welded Al\/Cu dissimilar lap joints","volume":"45","author":"Yan","year":"2019","journal-title":"J. Manuf. Process."},{"key":"ref_6","doi-asserted-by":"crossref","first-page":"59","DOI":"10.1007\/s00170-020-05019-0","article-title":"Effect of ultrasonic vibration on thermal and material flow behavior, microstructure and mechanical properties of friction stir welded Al\/Cu joints","volume":"107","author":"Tian","year":"2020","journal-title":"Int. J. Adv. Manuf. Technol."},{"key":"ref_7","doi-asserted-by":"crossref","first-page":"903","DOI":"10.1007\/s40194-019-00719-y","article-title":"Electrical and mechanical properties of friction stir welded Al-Cu butt joints","volume":"63","author":"Eslami","year":"2019","journal-title":"Weld. World"},{"key":"ref_8","doi-asserted-by":"crossref","unstructured":"Emadinia, O., Ramalho, A.M., De Oliveira, I.V., Taber, G.A., and Reis, A. (2020). Influence of Surface Preparation on the Interface of Al-Cu Joints Produced by Magnetic Pulse Welding. Metals, 10.","DOI":"10.3390\/met10080997"},{"key":"ref_9","doi-asserted-by":"crossref","first-page":"466","DOI":"10.1016\/j.matdes.2013.04.056","article-title":"Microstructural evolution and mechanical properties of dissimilar Al\u2013Cu joints produced by friction stir welding","volume":"51","author":"Tan","year":"2013","journal-title":"Mater. Des."},{"key":"ref_10","doi-asserted-by":"crossref","first-page":"2876","DOI":"10.1557\/jmr.2016.295","article-title":"Microstructure and properties of aluminum AA6061-T6 to copper (Cu)-T2 joints by cold metal transfer joining technology","volume":"31","author":"Cai","year":"2016","journal-title":"J. Mater. Res."},{"key":"ref_11","doi-asserted-by":"crossref","first-page":"1480","DOI":"10.1002\/adem.201400573","article-title":"Microstructures and Properties of Aluminum\u2013Copper Lap-Welded Joints by Cold Metal Transfer Technology","volume":"17","author":"Feng","year":"2015","journal-title":"Adv. Eng. Mater."},{"key":"ref_12","doi-asserted-by":"crossref","first-page":"105","DOI":"10.1016\/j.msea.2017.08.056","article-title":"Microstructures and mechanical behavior of aluminum-copper lap joints","volume":"705","author":"Zhou","year":"2017","journal-title":"Mater. Sci. Eng. A"},{"key":"ref_13","first-page":"216","article-title":"Pulsed double-electrode GMAW-brazing for joining of aluminum to steel","volume":"93","author":"Shi","year":"2014","journal-title":"Weld. J."},{"key":"ref_14","doi-asserted-by":"crossref","first-page":"7151","DOI":"10.1016\/j.msea.2010.07.092","article-title":"Arc joining of aluminum alloy to stainless steel with flux-cored Zn-based filler metal","volume":"26","author":"Dong","year":"2010","journal-title":"Mater. Sci. Eng. A"},{"key":"ref_15","doi-asserted-by":"crossref","first-page":"332","DOI":"10.1016\/j.phpro.2011.03.141","article-title":"Enhancing the ductility of laser-welded copper-aluminum connections by using adapted filler materials","volume":"12","author":"Weigl","year":"2011","journal-title":"Phys. Proced."},{"key":"ref_16","doi-asserted-by":"crossref","first-page":"458","DOI":"10.1016\/j.jmatprotec.2011.10.009","article-title":"Dissimilar metal joining of aluminum alloy to galvanized steel with Al\u2013Si, Al\u2013Cu, Al\u2013Si\u2013Cu and Zn\u2013Al filler wires","volume":"212","author":"Dong","year":"2012","journal-title":"J. Mater. Process. Technol."},{"key":"ref_17","doi-asserted-by":"crossref","first-page":"16","DOI":"10.1016\/j.jmapro.2016.10.003","article-title":"Joining of aluminum alloys to galvanized mild steel by the pulsed DE-GMAW with the alternation of droplet transfer","volume":"25","author":"Huang","year":"2017","journal-title":"J. Manuf. Process."},{"key":"ref_18","first-page":"12","article-title":"Effects of Si and Cu additions on properties of dissimilar aluminum-galvanized steel weld","volume":"11","author":"Dong","year":"2010","journal-title":"Trans. China Weld. Inst."},{"key":"ref_19","first-page":"2216","article-title":"Effect of Si on the Composite Interface Microstructure and Properties of Cu\/Al Cold-rolling Cladding","volume":"44","author":"Dongxu","year":"2015","journal-title":"Rare Met. Mater. Eng."},{"key":"ref_20","doi-asserted-by":"crossref","first-page":"556","DOI":"10.1016\/S1003-6326(13)62499-1","article-title":"Effect of Si on growth kinetics of intermetallic compounds during reaction between solid iron and molten aluminum","volume":"23","author":"Yin","year":"2013","journal-title":"Trans. Nonferrous Met. Soc. China"},{"key":"ref_21","doi-asserted-by":"crossref","first-page":"149","DOI":"10.1016\/j.jallcom.2004.01.017","article-title":"Hardness and microstructural characteristics of rapidly solidified Al\u20138\u201316 wt.% Si alloys","volume":"376","author":"Uzun","year":"2004","journal-title":"J. Alloy. Compd."},{"key":"ref_22","first-page":"281","article-title":"Effect of different filler wires on weld formation for fiber laser welding 6A02 Aluminum alloy","volume":"1","author":"Xu","year":"2017","journal-title":"Mater. Sci. Eng."},{"key":"ref_23","doi-asserted-by":"crossref","first-page":"135","DOI":"10.1007\/s00170-011-3272-z","article-title":"Experimental investigation on conventional grinding of Ti-6Al-4V using SiC abrasive","volume":"57","author":"Guo","year":"2011","journal-title":"Int. J. Adv. Manuf. Technol."},{"key":"ref_24","unstructured":"Ibach, H., and L\u00fcth, H. (2013). Solid-State Physics: An Introduction to Principles of Materials Science, Springer Science & Business Media."},{"key":"ref_25","doi-asserted-by":"crossref","first-page":"2059","DOI":"10.1103\/PhysRevLett.58.2059","article-title":"Inhibited spontaneous emission in solid-state physics and electronics","volume":"58","author":"Yablonovitch","year":"1987","journal-title":"Phys. Rev. Lett."},{"key":"ref_26","doi-asserted-by":"crossref","first-page":"255","DOI":"10.1080\/10426914.2014.994754","article-title":"Effects of tilt angle on the properties of dissimilar friction stir welding copper to aluminum","volume":"31","author":"Mehta","year":"2016","journal-title":"Mater. Manuf. Process."},{"key":"ref_27","doi-asserted-by":"crossref","first-page":"78","DOI":"10.1109\/95.296372","article-title":"Intermetallic compounds at aluminum-to-copper electrical interfaces: Effect of temperature and electric current","volume":"17","author":"Braunovic","year":"1994","journal-title":"IEEE Trans. Compon. Packag. Manuf. Technol. Part A"}],"container-title":["Materials"],"original-title":[],"language":"en","link":[{"URL":"https:\/\/www.mdpi.com\/1996-1944\/13\/16\/3648\/pdf","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2025,10,11]],"date-time":"2025-10-11T10:02:20Z","timestamp":1760176940000},"score":1,"resource":{"primary":{"URL":"https:\/\/www.mdpi.com\/1996-1944\/13\/16\/3648"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2020,8,18]]},"references-count":27,"journal-issue":{"issue":"16","published-online":{"date-parts":[[2020,8]]}},"alternative-id":["ma13163648"],"URL":"https:\/\/doi.org\/10.3390\/ma13163648","relation":{},"ISSN":["1996-1944"],"issn-type":[{"value":"1996-1944","type":"electronic"}],"subject":[],"published":{"date-parts":[[2020,8,18]]}}}