{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,6,25]],"date-time":"2026-06-25T20:46:47Z","timestamp":1782420407355,"version":"3.54.5"},"reference-count":33,"publisher":"MDPI AG","issue":"18","license":[{"start":{"date-parts":[[2020,9,8]],"date-time":"2020-09-08T00:00:00Z","timestamp":1599523200000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/creativecommons.org\/licenses\/by\/4.0\/"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["Materials"],"abstract":"<jats:p>Graphene nanosheets (GNSs) have an extensive application in materials modification. In this study, the effects of graphene nanosheets on the wettability of Sn-20Bi lead-free solder on copper (Cu) substrate and the growth behavior of intermetallic compound (IMC) layers at Sn-20Bi-xGNS\/Cu solder joints were investigated. The experimental results indicate that the wettability of Sn-20Bi solder firstly diminished and then increased by the addition of GNSs. Meanwhile, a prism-shaped and scallop-shaped Cu6Sn5 IMC layer was clearly observed at the interface of the solder\/substrate system. Moreover, it was found that a small amount of GNS addition can significantly inhibit the growth of the IMC layer at the interface as well as refine the microstructure. Additionally, by nano-indentation apparatus, it can be concluded that the hardness and elastic module of IMCs show the same variation trend, which firstly decreased and then increased. Besides, to intuitively demonstrate the reliability of IMCs, the relationship between the hardness and elastic module was established, and the ratio of hardness\/elastic module (H\/E) was adopted to characterize the reliability of IMCs. The results show that when the addition of GNSs was 0.02 wt%, the value of H\/E is the minimum and the solder joint has the highest reliability.<\/jats:p>","DOI":"10.3390\/ma13183968","type":"journal-article","created":{"date-parts":[[2020,9,8]],"date-time":"2020-09-08T09:03:48Z","timestamp":1599555828000},"page":"3968","update-policy":"https:\/\/doi.org\/10.3390\/mdpi_crossmark_policy","source":"Crossref","is-referenced-by-count":17,"title":["Effect of Graphene Nanosheet Addition on the Wettability and Mechanical Properties of Sn-20Bi-xGNS\/Cu Solder Joints"],"prefix":"10.3390","volume":"13","author":[{"ORCID":"https:\/\/orcid.org\/0000-0003-0153-4672","authenticated-orcid":false,"given":"Wenchao","family":"Yang","sequence":"first","affiliation":[{"name":"School of Materials Science and Engineering, South China University of Technology, Guangzhou 510641, China"},{"name":"Guangxi Key Laboratory of Processing for Non-ferrous Metals and Featured Materials, School of Resources, Environment and Materials, Guangxi University, Nanning 530004, China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Zuojun","family":"Yang","sequence":"additional","affiliation":[{"name":"Shenzhen Customs Industrial Products Inspection Technology Center, Shenzhen 518067, China"},{"name":"Shenzhen Academy of Inspection and Quarantine, Shenzhen 518010, China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Yaokun","family":"Fu","sequence":"additional","affiliation":[{"name":"Guangxi Key Laboratory of Processing for Non-ferrous Metals and Featured Materials, School of Resources, Environment and Materials, Guangxi University, Nanning 530004, China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Aihua","family":"Yu","sequence":"additional","affiliation":[{"name":"Guangxi Key Laboratory of Processing for Non-ferrous Metals and Featured Materials, School of Resources, Environment and Materials, Guangxi University, Nanning 530004, China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Junli","family":"Feng","sequence":"additional","affiliation":[{"name":"Shenzhen Customs Industrial Products Inspection Technology Center, Shenzhen 518067, China"},{"name":"Shenzhen Academy of Inspection and Quarantine, Shenzhen 518010, China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Yongzhong","family":"Zhan","sequence":"additional","affiliation":[{"name":"School of Materials Science and Engineering, South China University of Technology, Guangzhou 510641, China"},{"name":"Guangxi Key Laboratory of Processing for Non-ferrous Metals and Featured Materials, School of Resources, Environment and Materials, Guangxi University, Nanning 530004, China"}],"role":[{"vocabulary":"crossref","role":"author"}]}],"member":"1968","published-online":{"date-parts":[[2020,9,8]]},"reference":[{"key":"ref_1","doi-asserted-by":"crossref","first-page":"1238","DOI":"10.1007\/s11664-999-0163-2","article-title":"Kinetics of interfacial reaction between eutectic Sn-Pb solder and Cu\/Ni\/Pd metallizations","volume":"28","author":"Ghosh","year":"1999","journal-title":"J. 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