{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,10,31]],"date-time":"2026-10-31T22:29:53Z","timestamp":1793485793674,"version":"4.5.0"},"reference-count":32,"publisher":"MDPI AG","issue":"18","license":[{"start":{"date-parts":[[2020,9,13]],"date-time":"2020-09-13T00:00:00Z","timestamp":1599955200000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/creativecommons.org\/licenses\/by\/4.0\/"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["Materials"],"abstract":"<jats:p>This paper investigates the influence of temperature on tensile mechanical properties of sintered silver (s-Ag) films with 8\u201310 \u03bcm in thickness for fundamental reliability design of semiconductor systems. The s-Ag film sintered under a pressure of 60 MPa possesses the porosity (p) around 5% determined from cross-sectional scanning electron microscope (SEM) images. The stress\u2013strain (S-S) curves of s-Ag and pure silver (p-Ag) films are obtained using originally designed uniaxial tensile tester at temperatures from 25 \u00b0C to 150 \u00b0C. The S-S curves of p-Ag indicate ductile behavior irrespective of temperature, whereas those of s-Ag indicate brittle-ductile transition at 120 \u00b0C. Compared with p-Ag, s-Ag possesses low Young\u2019s modulus (E) and high ultimate tensile strength (UTS) below 80 \u00b0C. The mechanism of brittle-ductile transition is discussed based on fracture surface observation results.<\/jats:p>","DOI":"10.3390\/ma13184061","type":"journal-article","created":{"date-parts":[[2020,9,13]],"date-time":"2020-09-13T21:11:32Z","timestamp":1600031492000},"page":"4061","update-policy":"https:\/\/doi.org\/10.3390\/mdpi_crossmark_policy","source":"Crossref","is-referenced-by-count":36,"title":["Temperature Dependence on Tensile Mechanical Properties of Sintered Silver Film"],"prefix":"10.3390","volume":"13","author":[{"given":"Keisuke","family":"Wakamoto","sequence":"first","affiliation":[{"name":"ROHM Co., Ltd., Kyoto 615-8585, Japan"},{"name":"Faculty of Engineering, Uzumasa, Kyoto University of Advanced Science, Kyoto 615-8577, Japan"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Yo","family":"Mochizuki","sequence":"additional","affiliation":[{"name":"Department of Mechanical Engineering, Yakusa, Aichi Institute of Technology, Toyota 470-0392, Japan"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Takukazu","family":"Otsuka","sequence":"additional","affiliation":[{"name":"ROHM Co., Ltd., Kyoto 615-8585, Japan"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Ken","family":"Nakahara","sequence":"additional","affiliation":[{"name":"ROHM Co., Ltd., Kyoto 615-8585, Japan"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Takahiro","family":"Namazu","sequence":"additional","affiliation":[{"name":"Faculty of Engineering, Uzumasa, Kyoto University of Advanced Science, Kyoto 615-8577, Japan"}],"role":[{"vocabulary":"crossref","role":"author"}]}],"member":"1968","published-online":{"date-parts":[[2020,9,13]]},"reference":[{"key":"ref_1","doi-asserted-by":"crossref","first-page":"947","DOI":"10.1007\/s11664-013-2967-3","article-title":"Are Sintered Silver Joints Ready for Use as Interconnect Material in Microelectronic Packaging?","volume":"43","author":"Siow","year":"2013","journal-title":"J. Electron. Mat."},{"key":"ref_2","doi-asserted-by":"crossref","first-page":"6","DOI":"10.1016\/j.jallcom.2011.10.092","article-title":"Mechanical properties of nano-silver joints as die attach materials","volume":"514","author":"Siow","year":"2012","journal-title":"J. Alloys Compd."},{"key":"ref_3","doi-asserted-by":"crossref","first-page":"12597","DOI":"10.1021\/acsami.5b02134","article-title":"Joining of Silver Nanomaterials at Low Tempertures: Processes, Properties, and Applications","volume":"7","author":"Peng","year":"2015","journal-title":"Appl. Mater. Interfaces"},{"key":"ref_4","doi-asserted-by":"crossref","first-page":"241","DOI":"10.1109\/TEPM.2007.906508","article-title":"Processing and Characterization of Nanosilver Pastes for Die-Attaching SiC Devices","volume":"30","author":"Bai","year":"2007","journal-title":"IEEE Trans. Electron. Packag. Technol."},{"key":"ref_5","doi-asserted-by":"crossref","first-page":"116","DOI":"10.1016\/j.actamat.2015.06.040","article-title":"Deformation behavior of sintered nanocrystalline silver layers","volume":"97","author":"Zabihzadeh","year":"2015","journal-title":"Acta Mater."},{"key":"ref_6","doi-asserted-by":"crossref","first-page":"467","DOI":"10.1016\/j.actamat.2017.04.021","article-title":"Deformation behavior of nanoporous polycrystalline silver. Part I: Microstructure and mechanical properties","volume":"131","author":"Zabihzadeh","year":"2017","journal-title":"Acta Mater."},{"key":"ref_7","doi-asserted-by":"crossref","first-page":"379","DOI":"10.1016\/j.msea.2016.05.108","article-title":"Milhet. Aging sintered silver: Relationship between tensile behavior, mechanical properties and the nanoporous structure evolution","volume":"669","author":"Gadaud","year":"2016","journal-title":"Mater. Sci. Eng. A"},{"key":"ref_8","doi-asserted-by":"crossref","first-page":"588","DOI":"10.1109\/TDMR.2016.2614510","article-title":"Effect of Manufacturing Process on Micro-Deformation Behavior of Sintered-Silver Die-Attach Material","volume":"16","author":"Suzuki","year":"2016","journal-title":"IEEE Trans. Device Mater. Reliab."},{"key":"ref_9","doi-asserted-by":"crossref","unstructured":"Takesue, M., Watanabe, T., Tanaka, K., and Nakajima, N. (2018, January 5\u20137). Mechanical Properties and Reliability of Pressureless Sintered Silver Materials for Power Devices. Proceedings of the PCIM Europe 2018 International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management, Nuremberg, Germany.","DOI":"10.4071\/2380-4505-2018.1.000602"},{"key":"ref_10","first-page":"589","article-title":"Low-Temperature Sintered Nanoscale Silver as a novel Semiconductor Device-Metallized Substrate Interconnect Material","volume":"29","author":"Bai","year":"2006","journal-title":"IEEE Trans. Device Mater. Reliab."},{"key":"ref_11","doi-asserted-by":"crossref","first-page":"SDDL08-1","DOI":"10.7567\/1347-4065\/ab0491","article-title":"Tensile Mechanical properties of sintered porous silver films and their dependence on porosity","volume":"58","author":"Wakamoto","year":"2019","journal-title":"Jpn. J. Appl. Phys."},{"key":"ref_12","doi-asserted-by":"crossref","unstructured":"Herboth, T., Guenther, M., Fix, A., and Wilde, J. (2013, January 28\u201331). Failure Mechanisms of Sintered Silver Interconnections for Power Electronic Applications. Proceedings of the ECTC 2013 Electronic Components and Technology Conference, Las Vegas, NV, USA.","DOI":"10.1109\/ECTC.2013.6575789"},{"key":"ref_13","doi-asserted-by":"crossref","unstructured":"Herboth, T., Fruh, C., Gunther, M., and Wilde, J. (2012, January 16\u201317). Assessment of Thermo-Mechanical Stresses in Low Temperature Joining Technology. Proceedings of the EuroSimE 2012 International Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-systems, Lisbon, Portugal.","DOI":"10.1109\/ESimE.2012.6191762"},{"key":"ref_14","doi-asserted-by":"crossref","unstructured":"Webber, C., Dijk, M.V., Walter, H., Hutter, M., Witter, O., and Lang, K.D. (June, January 31). Combination of experimental and simulation methods for analysis of sintered Ag joints for high temperature applications. Proceedings of the ECTC 2016 Electronic Components and Technology Conference, Las Vegas, NV, USA.","DOI":"10.1109\/ECTC.2016.394"},{"key":"ref_15","doi-asserted-by":"crossref","unstructured":"Chen, C., Nagao, S., Zhang, H., Suganuma, T., Suganuma, K., Iwashige, T., Sugiura, K., and Tsuruta, K. (June, January 31). Low-stress design for SiC power modules with sintered porous Ag. Proceedings of the ECTC 2016 Electronic Components and Technology Conference, Las Vegas, NV, USA.","DOI":"10.1109\/ECTC.2016.59"},{"key":"ref_16","doi-asserted-by":"crossref","first-page":"1576","DOI":"10.1007\/s11664-016-5200-3","article-title":"Mechanical Deformation of Sintered Porous Ag Die Attach at High Temperature and Its Size Effect for Wide-Bandgap Power Device Design","volume":"46","author":"Chen","year":"2017","journal-title":"J. Electron. Mater."},{"key":"ref_17","unstructured":"Letz, S., Hutzler, A., Waltrich, U., Zischler, S., and Schletz, A. (2016, January 8\u201310). Mechanical properties of silver sintered bond lines: Aspects for a reliable material data base for numerical simulations. Proceedings of the CIPS 2016 International Conference on Integrated Power Electronics Systems, Nuremberg, Germany."},{"key":"ref_18","doi-asserted-by":"crossref","first-page":"1574","DOI":"10.1007\/s11664-008-0516-2","article-title":"Tensile Behaviors and Ratcheting Effects of Partially Sintered Chip-Attachment Films of a Nanoscale Silver Paste","volume":"37","author":"Chen","year":"2008","journal-title":"J. Electron. Mater."},{"key":"ref_19","doi-asserted-by":"crossref","first-page":"160","DOI":"10.7791\/jspmee.2.160","article-title":"Mechanical Behaviors of Nano-sized Ag particles","volume":"2","author":"Kariya","year":"2013","journal-title":"J. Smart Process"},{"key":"ref_20","doi-asserted-by":"crossref","unstructured":"Kraft, S., Zischler, S., Tham, N., and Schletz, A. (2013, January 14\u201316). Properties of a novel silver sintering die attach material for high temperature-high lifetime applications. Proceedings of the SENSOR 2013 International Conference on Sensors and Measurement Technology, Nurnberg, Germany.","DOI":"10.5162\/sensor2013\/B3.3"},{"key":"ref_21","doi-asserted-by":"crossref","unstructured":"Suzuki, T., Yasuda, Y., Terasaki, T., Morita, T., Kawana, Y., Ishikawa, D., Nishimura, M., Nakako, H., and Kurafuchi, K. (2016, January 20\u201322). Thermal cycling lifetime estimation of sintered metal die attachment. Proceedings of the ICEP 2016 International Conference in Electronics Packaging, Hokkaido, Japan.","DOI":"10.1109\/ICEP.2016.7486856"},{"key":"ref_22","doi-asserted-by":"crossref","unstructured":"Schmitt, W., and Chew, L.M. (June, January 30). Silver sinter paste for SiC bonding with improved mechanical properties. Proceedings of the ECTC 2017 Electronic Components and Technology Conference, Florida, America.","DOI":"10.1109\/ECTC.2017.155"},{"key":"ref_23","doi-asserted-by":"crossref","first-page":"41","DOI":"10.1016\/j.actamat.2017.02.065","article-title":"Macroscale and microscale fracture toughness of microporous sintered Ag for applications in power devices","volume":"129","author":"Chen","year":"2017","journal-title":"Acta Mater."},{"key":"ref_24","doi-asserted-by":"crossref","unstructured":"Kaibara, Y., Fujii, H., Namazu, T., Tomizawa, Y., Masunishi, K., and Inoue, S. (2009, January 21\u201325). Mechanical degradation mechanism of Aluminum-alloy structural films evaluated by environment-controlled tensile testing. Proceedings of the TRANCEDUCERS, International Solid-State Sensors, Actuators and Microsystems Conference, Denver, CO, USA.","DOI":"10.1109\/SENSOR.2009.5285732"},{"key":"ref_25","doi-asserted-by":"crossref","first-page":"1414","DOI":"10.1109\/JMEMS.2013.2257985","article-title":"Thermal Anealing Effect on Elastic-Plastic Behavior of Al-Si-Cu Structual Films Under Uniaxial and Biaxial Tension","volume":"22","author":"Namazu","year":"2013","journal-title":"J. Microelectromech. Syst."},{"key":"ref_26","doi-asserted-by":"crossref","first-page":"06GL03-1","DOI":"10.7567\/JJAP.55.06GL03","article-title":"Influence of 700 \u00b0C vacuum annealing on fracture behavior of micro-nanoscale Si structures","volume":"55","author":"Goshima","year":"2016","journal-title":"Jpn. J. Appl. Phys."},{"key":"ref_27","doi-asserted-by":"crossref","first-page":"031804-1","DOI":"10.1116\/1.4711040","article-title":"Quasistatic and dynamic mechanical properties of Al-Si-Cu structural films in uniaxial tension","volume":"30","author":"Fujii","year":"2012","journal-title":"J. Vac. Sci. Technol. B"},{"key":"ref_28","doi-asserted-by":"crossref","first-page":"1","DOI":"10.1038\/s41598-018-28788-x","article-title":"Silver oxide decomposition mediated direct bonding of silicon-based materials","volume":"8","author":"Matsuda","year":"2018","journal-title":"Sci. Rep."},{"key":"ref_29","doi-asserted-by":"crossref","first-page":"226","DOI":"10.2320\/matertrans.MRP2008277","article-title":"Direct Bonding to Aluminium with Silver-Oxide Microparticles","volume":"50","author":"Morita","year":"2009","journal-title":"Mater. Trans."},{"key":"ref_30","doi-asserted-by":"crossref","first-page":"146","DOI":"10.1016\/j.msea.2005.02.091","article-title":"Hall-petch revisited","volume":"400\u2013401","author":"Saada","year":"2005","journal-title":"Mater. Sci. Eng. A"},{"key":"ref_31","doi-asserted-by":"crossref","first-page":"495","DOI":"10.1080\/09506608.2016.1191808","article-title":"Six decades of the Hall-Petch effect\u2014A survey of grain-size strengthening studies on pure metals","volume":"61","author":"Cordero","year":"2016","journal-title":"Int. Mater. Rev."},{"key":"ref_32","doi-asserted-by":"crossref","first-page":"968058","DOI":"10.1155\/2009\/968058","article-title":"Particle Size and Pore Structure Characterization of Silver Nanoparticles Prepared by Confined Arc Plasma","volume":"2009","author":"Zhou","year":"2009","journal-title":"J. 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