{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,5,12]],"date-time":"2026-05-12T22:57:36Z","timestamp":1778626656141,"version":"3.51.4"},"reference-count":38,"publisher":"MDPI AG","issue":"4","license":[{"start":{"date-parts":[[2021,2,7]],"date-time":"2021-02-07T00:00:00Z","timestamp":1612656000000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/creativecommons.org\/licenses\/by\/4.0\/"}],"funder":[{"DOI":"10.13039\/501100003093","name":"Ministry of Higher Education, Malaysia","doi-asserted-by":"publisher","award":["JPT.S (BPKI)2000\/016\/018\/019(29)"],"award-info":[{"award-number":["JPT.S (BPKI)2000\/016\/018\/019(29)"]}],"id":[{"id":"10.13039\/501100003093","id-type":"DOI","asserted-by":"publisher"}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["Materials"],"abstract":"<jats:p>This paper elucidates the effect of isothermal ageing at temperature of 85 \u00b0C, 125 \u00b0C and 150 \u00b0C for 100, 500 and 1000 h on Sn-3.0Ag-0.5Cu (SAC305) lead-free solder with the addition of 1 wt% kaolin geopolymer ceramic (KGC) reinforcement particles. SAC305-KGC composite solders were fabricated through powder metallurgy using a hybrid microwave sintering method and reflowed on copper substrate printed circuit board with an organic solderability preservative surface finish. The results revealed that, the addition of KGC was beneficial in improving the total thickness of interfacial intermetallic compound (IMC) layer. At higher isothermal ageing of 150 \u00b0C and 1000 h, the IMC layer in SAC305-KGC composite solder was towards a planar-type morphology. Moreover, the growth of total interfacial IMC layer and Cu3Sn layer during isothermal ageing was found to be controlled by bulk diffusion and grain-boundary process, respectively. The activation energy possessed by SAC305-KGC composite solder for total interfacial IMC layer and Cu3Sn IMC was 74 kJ\/mol and 104 kJ\/mol, respectively. Based on a lap shear test, the shear strength of SAC305-KGC composite solder exhibited higher shear strength than non-reinforced SAC305 solder. Meanwhile, the solder joints failure mode after shear testing was a combination of brittle and ductile modes at higher ageing temperature and time for SAC305-KGC composite solder.<\/jats:p>","DOI":"10.3390\/ma14040776","type":"journal-article","created":{"date-parts":[[2021,2,12]],"date-time":"2021-02-12T23:38:44Z","timestamp":1613173124000},"page":"776","update-policy":"https:\/\/doi.org\/10.3390\/mdpi_crossmark_policy","source":"Crossref","is-referenced-by-count":16,"title":["Performance of Sn-3.0Ag-0.5Cu Composite Solder with Kaolin Geopolymer Ceramic Reinforcement on Microstructure and Mechanical Properties under Isothermal Ageing"],"prefix":"10.3390","volume":"14","author":[{"given":"Nur Syahirah Mohamad","family":"Zaimi","sequence":"first","affiliation":[{"name":"Center of Excellence Geopolymer &amp; Green Technology (CeGeoGTech), University Malaysia Perlis (UniMAP), Taman Muhibbah, Perlis 02600, Malaysia"},{"name":"Faculty of Chemical Engineering Technology, University Malaysia Perlis (UniMAP), Taman Muhibbah, Perlis 02600, Malaysia"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Mohd Arif Anuar Mohd","family":"Salleh","sequence":"additional","affiliation":[{"name":"Center of Excellence Geopolymer &amp; Green Technology (CeGeoGTech), University Malaysia Perlis (UniMAP), Taman Muhibbah, Perlis 02600, Malaysia"},{"name":"Faculty of Chemical Engineering Technology, University Malaysia Perlis (UniMAP), Taman Muhibbah, Perlis 02600, Malaysia"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-9292-749X","authenticated-orcid":false,"given":"Andrei Victor","family":"Sandu","sequence":"additional","affiliation":[{"name":"Center of Excellence Geopolymer &amp; Green Technology (CeGeoGTech), University Malaysia Perlis (UniMAP), Taman Muhibbah, Perlis 02600, Malaysia"},{"name":"Faculty of Materials Science and Engineering, Gheorghe Asachi Technical University of Iasi, 71 D. Mangeron Blv., 700050 Iasi, Romania"},{"name":"Romanian Inventors Forum, Str. Sf. P. Movila 3, 700089 Iasi, Romania"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Mohd Mustafa Al Bakri","family":"Abdullah","sequence":"additional","affiliation":[{"name":"Center of Excellence Geopolymer &amp; Green Technology (CeGeoGTech), University Malaysia Perlis (UniMAP), Taman Muhibbah, Perlis 02600, Malaysia"},{"name":"Faculty of Chemical Engineering Technology, University Malaysia Perlis (UniMAP), Taman Muhibbah, Perlis 02600, Malaysia"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Norainiza","family":"Saud","sequence":"additional","affiliation":[{"name":"Center of Excellence Geopolymer &amp; Green Technology (CeGeoGTech), University Malaysia Perlis (UniMAP), Taman Muhibbah, Perlis 02600, Malaysia"},{"name":"Faculty of Chemical Engineering Technology, University Malaysia Perlis (UniMAP), Taman Muhibbah, Perlis 02600, Malaysia"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Shayfull Zamree Abd","family":"Rahim","sequence":"additional","affiliation":[{"name":"Center of Excellence Geopolymer &amp; Green Technology (CeGeoGTech), University Malaysia Perlis (UniMAP), Taman Muhibbah, Perlis 02600, Malaysia"},{"name":"Faculty of Mechanical Engineering Technology, Pauh Putra Campus, University Malaysia Perlis (UniMAP), Perlis 02600, Malaysia"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-3593-9400","authenticated-orcid":false,"given":"Petrica","family":"Vizureanu","sequence":"additional","affiliation":[{"name":"Center of Excellence Geopolymer &amp; Green Technology (CeGeoGTech), University Malaysia Perlis (UniMAP), Taman Muhibbah, Perlis 02600, Malaysia"},{"name":"Faculty of Materials Science and Engineering, Gheorghe Asachi Technical University of Iasi, 71 D. Mangeron Blv., 700050 Iasi, Romania"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Rita Mohd","family":"Said","sequence":"additional","affiliation":[{"name":"Center of Excellence Geopolymer &amp; Green Technology (CeGeoGTech), University Malaysia Perlis (UniMAP), Taman Muhibbah, Perlis 02600, Malaysia"},{"name":"Faculty of Chemical Engineering Technology, University Malaysia Perlis (UniMAP), Taman Muhibbah, Perlis 02600, Malaysia"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-7423-0058","authenticated-orcid":false,"given":"Mohd Izrul Izwan","family":"Ramli","sequence":"additional","affiliation":[{"name":"Center of Excellence Geopolymer &amp; Green Technology (CeGeoGTech), University Malaysia Perlis (UniMAP), Taman Muhibbah, Perlis 02600, Malaysia"},{"name":"Faculty of Chemical Engineering Technology, University Malaysia Perlis (UniMAP), Taman Muhibbah, Perlis 02600, Malaysia"}],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"1968","published-online":{"date-parts":[[2021,2,7]]},"reference":[{"key":"ref_1","doi-asserted-by":"crossref","first-page":"113","DOI":"10.1016\/j.matchar.2018.02.006","article-title":"Characterising the polymorphic phase transformation at a localised point on a Cu6Sn5 grain","volume":"138","author":"Somidin","year":"2018","journal-title":"Mater. Charact."},{"key":"ref_2","doi-asserted-by":"crossref","first-page":"639","DOI":"10.1016\/j.jallcom.2016.07.084","article-title":"Microstructural evolution and joint strength of Sn-58Bi\/Cu joints through minor Zn alloying substrate during isothermal aging","volume":"688","author":"Wang","year":"2016","journal-title":"J. Alloys Compd."},{"key":"ref_3","doi-asserted-by":"crossref","first-page":"153077","DOI":"10.1016\/j.jallcom.2019.153077","article-title":"Mechanical properties of Sn-58 wt%Bi solder containing Ag-decorated MWCNT with thermal aging tests","volume":"820","author":"Lee","year":"2020","journal-title":"J. Alloys Compd."},{"key":"ref_4","doi-asserted-by":"crossref","first-page":"183","DOI":"10.1016\/j.jallcom.2019.02.316","article-title":"Isothermal aging and shear creep behavior of a novel lead-free solder joint with small additions of Bi, Sb and Ni","volume":"789","author":"Tao","year":"2019","journal-title":"J. Alloys Compd."},{"key":"ref_5","doi-asserted-by":"crossref","first-page":"799","DOI":"10.1016\/j.jallcom.2016.12.037","article-title":"Reliability enhancement of Sn-1.0Ag-0.5Cu nano-composite solders by adding multiple sizes of TiO2 nanoparticles","volume":"696","author":"Wen","year":"2017","journal-title":"J. Alloys Compd."},{"key":"ref_6","doi-asserted-by":"crossref","first-page":"646","DOI":"10.1016\/j.matdes.2013.12.076","article-title":"Properties enhancement of SnAgCu solders containing rare earth Yb","volume":"57","author":"Zhang","year":"2014","journal-title":"Mater. Des."},{"key":"ref_7","doi-asserted-by":"crossref","first-page":"796","DOI":"10.1016\/j.matdes.2014.10.006","article-title":"Novel Bi-containing Sn\u20131.5Ag\u20130.7Cu lead-free solder alloy with further enhanced thermal property and strength for mobile products","volume":"65","author":"Gouda","year":"2015","journal-title":"Mater. Des."},{"key":"ref_8","doi-asserted-by":"crossref","first-page":"680","DOI":"10.1016\/j.jallcom.2016.05.245","article-title":"Performance of Sn\u20133.0Ag\u20130.5Cu composite solder with TiC reinforcement: Physical properties, solderability and microstructural evolution under isothermal ageing","volume":"685","author":"Chen","year":"2016","journal-title":"J. Alloys Compd."},{"key":"ref_9","doi-asserted-by":"crossref","first-page":"137","DOI":"10.1007\/s11664-005-0224-0","article-title":"Microstructural development of Sn-Ag-Cu solder joints","volume":"34","author":"Fix","year":"2005","journal-title":"J. Electron. Mater."},{"key":"ref_10","doi-asserted-by":"crossref","first-page":"474","DOI":"10.1016\/j.jallcom.2009.06.171","article-title":"Evolutions of the interface and shear strength between SnAgCu\u2013xNi solder and Cu substrate during isothermal aging at 150 \u00b0C","volume":"486","author":"Liu","year":"2009","journal-title":"J. Alloys Compd."},{"key":"ref_11","doi-asserted-by":"crossref","first-page":"299","DOI":"10.1016\/j.jallcom.2016.05.148","article-title":"Effect of Nano-TiO2 particles on growth of interfacial Cu6Sn5 and Cu3Sn layers in Sn\u20133.0Ag\u20130.5Cu\u2013xTiO2 solder joints","volume":"684","author":"Tang","year":"2016","journal-title":"J. Alloys Compd."},{"key":"ref_12","doi-asserted-by":"crossref","first-page":"18563","DOI":"10.1016\/j.ceramint.2019.06.079","article-title":"Effect of TiO2 nanoparticles on the horizontal hardness properties of Sn-3.0Ag-0.5Cu-1.0TiO2 composite solder","volume":"45","author":"Yahaya","year":"2019","journal-title":"Ceram. Int."},{"key":"ref_13","doi-asserted-by":"crossref","first-page":"18828","DOI":"10.1007\/s10854-019-02239-3","article-title":"Effects of TiO2 nanoparticles addition on physical and soldering properties of Sn\u2013xTiO2 composite solder","volume":"30","author":"Liu","year":"2019","journal-title":"J. Mater. Sci. Mater."},{"key":"ref_14","doi-asserted-by":"crossref","first-page":"7372","DOI":"10.1007\/s10854-018-8727-7","article-title":"Effects of \u03b1-Al2O3 nanoparticles-doped on microstructure and properties of Sn\u20130.3Ag\u20130.7Cu low-Ag solder","volume":"29","author":"Wu","year":"2018","journal-title":"J. Mater. Sci. Mater."},{"key":"ref_15","first-page":"37","article-title":"Effect on microstructural and physical properties of Sn-3.0Ag-0.5Cu lead-free solder with the addition of SiC particles","volume":"4","author":"Mahim","year":"2019","journal-title":"Eur. J. Mater. Sci."},{"key":"ref_16","doi-asserted-by":"crossref","first-page":"152893","DOI":"10.1016\/j.jallcom.2019.152893","article-title":"A diffusion model and growth kinetics of interfacial intermetallic compounds in Sn-0.3Ag-0.7Cu and Sn-0.3Ag-0.7Cu-0.5CeO2 solder joints","volume":"818","author":"Li","year":"2019","journal-title":"J. Alloys Compd."},{"key":"ref_17","doi-asserted-by":"crossref","first-page":"101469","DOI":"10.1016\/j.mtcomm.2020.101469","article-title":"Effect of kaolin geopolymer ceramic addition on the properties of Sn-3.0Ag-0.5Cu solder joint","volume":"25","author":"Abdullah","year":"2020","journal-title":"Mater. Today Commun."},{"key":"ref_18","doi-asserted-by":"crossref","first-page":"47","DOI":"10.1016\/j.jallcom.2013.03.093","article-title":"Growth kinetics of the Cu3Sn phase and void formation of sub-micrometre solder layers in Sn\u2013Cu binary and Cu\u2013Sn\u2013Cu sandwich structures","volume":"567","author":"Li","year":"2013","journal-title":"J. Alloys Compd."},{"key":"ref_19","doi-asserted-by":"crossref","first-page":"53","DOI":"10.1016\/S1005-0302(12)60023-1","article-title":"Evolution of Intermetallic Compounds between Sn-0.3Ag-0.7Cu Low-silver Lead-free Solder and Cu Substrate during Thermal Aging","volume":"28","author":"Mookam","year":"2012","journal-title":"J. Mater. Sci. Technol."},{"key":"ref_20","doi-asserted-by":"crossref","first-page":"1262","DOI":"10.37358\/RC.19.4.7106","article-title":"Synthesis and Characteristics of Local Fly Ash Based Geopolymers Mixed with Natural Aggregates","volume":"70","author":"Vizureanu","year":"2019","journal-title":"Rev. Chim."},{"key":"ref_21","doi-asserted-by":"crossref","unstructured":"Nergis, D.D.B., Vizureanu, P., Ardelean, I., Sandu, A.V., Corbu, O.C., and Matei, E. (2020). Revealing the Influence of Microparticles on Geopolymers\u2019 Synthesis and Porosity. Materials, 13.","DOI":"10.3390\/ma13143211"},{"key":"ref_22","doi-asserted-by":"crossref","first-page":"958","DOI":"10.1016\/j.jallcom.2018.01.054","article-title":"Comparative study on the isothermal aging of bare Cu and ENImAg surface finish for Sn-Ag-Cu solder joints","volume":"740","year":"2018","journal-title":"J. Alloys Compd."},{"key":"ref_23","doi-asserted-by":"crossref","first-page":"82","DOI":"10.1016\/j.msea.2015.08.053","article-title":"Effect of ageing time on the tensile behavior of Sn\u20133.5wt% Ag\u20130.5wt% Cu (SAC355) solder alloy with and without adding ZnO nanoparticles","volume":"646","author":"Sobhy","year":"2015","journal-title":"Mater. Sci. Eng. A"},{"key":"ref_24","doi-asserted-by":"crossref","first-page":"066526","DOI":"10.1088\/2053-1591\/ab0cd4","article-title":"Nanosized samarium oxide (Sm2O3) particles suppressed the IMC phases and enhanced the shear strength of environmental-friendly Sn-Ag-Cu material","volume":"6","author":"Gain","year":"2019","journal-title":"Mater. Res. Express"},{"key":"ref_25","doi-asserted-by":"crossref","first-page":"1775","DOI":"10.1038\/s41598-018-20100-1","article-title":"Growth kinetics of Cu6Sn5 intermetallic compound in Cu-liquid Sn interfacial reaction enhanced by electric current","volume":"8","author":"Feng","year":"2018","journal-title":"Sci. Rep."},{"key":"ref_26","doi-asserted-by":"crossref","first-page":"38","DOI":"10.1016\/j.jallcom.2011.08.044","article-title":"Interface reaction between SnAgCu\/SnAgCuCe solders and Cu substrate subjected to thermal cycling and isothermal aging","volume":"510","author":"Zhang","year":"2012","journal-title":"J. Alloys Compd."},{"key":"ref_27","doi-asserted-by":"crossref","first-page":"2416","DOI":"10.1016\/j.mee.2010.04.017","article-title":"Morphology and mechanical properties of intermetallic compounds in SnAgCu solder joints","volume":"87","author":"Weng","year":"2010","journal-title":"Microelectron. Eng."},{"key":"ref_28","doi-asserted-by":"crossref","first-page":"398","DOI":"10.1016\/j.tsf.2014.05.003","article-title":"The orientation relationships of the Cu3Sn\/Cu interfaces and a discussion of the formation sequence of Cu3Sn and Cu6Sn5","volume":"562","author":"Wang","year":"2014","journal-title":"Thin Solid Film."},{"key":"ref_29","doi-asserted-by":"crossref","first-page":"235","DOI":"10.1016\/j.jmatprotec.2016.11.031","article-title":"Effects of Ni and TiO2 additions in as-reflowed and annealed Sn0.7Cu solders on Cu substrates","volume":"242","author":"McDonald","year":"2017","journal-title":"J. Mater. Process. Technol."},{"key":"ref_30","doi-asserted-by":"crossref","first-page":"484","DOI":"10.1007\/s00339-018-1907-8","article-title":"Interfacial reaction and microstructure between the Sn3Ag0.5Cu solder and Cu-Co dual-phase substrate","volume":"124","author":"Li","year":"2018","journal-title":"Appl. Phys. A"},{"key":"ref_31","doi-asserted-by":"crossref","first-page":"1581","DOI":"10.1007\/s11664-006-0152-7","article-title":"Intermetallic growth kinetics for Sn-Ag, Sn-Cu, and Sn-Ag-Cu lead-free solders on Cu, Ni, and Fe-42Ni substrates","volume":"35","author":"Dariavach","year":"2006","journal-title":"J. Electron. Mater."},{"key":"ref_32","doi-asserted-by":"crossref","first-page":"125","DOI":"10.1016\/j.msea.2017.10.007","article-title":"Growth behavior of intermetallic compounds and early formation of cracks in Sn-3Ag-0.5Cu solder joints under extreme temperature thermal shock","volume":"709","author":"Tian","year":"2018","journal-title":"Mater. Sci. Eng."},{"key":"ref_33","doi-asserted-by":"crossref","first-page":"3315","DOI":"10.1007\/s11665-020-04838-2","article-title":"Effect of Doped Nano-Ni on Microstructure Evolution and Mechanical Behavior of Sn-3.0Ag-0.5Cu (SAC305)\/Cu-2.0Be Solder Joint during Isothermal Aging","volume":"29","author":"Yin","year":"2020","journal-title":"J. Mater. Eng. Perform."},{"key":"ref_34","doi-asserted-by":"crossref","first-page":"8","DOI":"10.1016\/j.intermet.2012.09.016","article-title":"Influence of Ni nanoparticle on the morphology and growth of interfacial intermetallic compounds between Sn\u20133.8Ag\u20130.7Cu lead-free solder and copper substrate","volume":"33","author":"Tay","year":"2013","journal-title":"Intermetallics"},{"key":"ref_35","doi-asserted-by":"crossref","first-page":"142","DOI":"10.1016\/j.jallcom.2009.06.159","article-title":"Wettability and interfacial reactions of Sn\u2013Ag\u2013Cu\/Cu and Sn\u2013Ag\u2013Ni\/Cu solder joints","volume":"486","author":"Yoon","year":"2009","journal-title":"J. Alloys Compd."},{"key":"ref_36","doi-asserted-by":"crossref","first-page":"147","DOI":"10.1016\/j.mee.2011.09.006","article-title":"Evaluation of drop reliability of Sn\u201337Pb solder\/Cu joints using a high speed lap-shear test","volume":"91","author":"Jeon","year":"2012","journal-title":"Microelectron. Eng."},{"key":"ref_37","doi-asserted-by":"crossref","first-page":"368","DOI":"10.1016\/j.jallcom.2015.07.036","article-title":"Investigating the effect of isothermal aging on the morphology and shear strength of Sn-5Sb solder reinforced with carbon nanotubes","volume":"649","author":"Norkhairunnisa","year":"2015","journal-title":"J. Alloys Compd."},{"key":"ref_38","doi-asserted-by":"crossref","first-page":"382","DOI":"10.1016\/j.jallcom.2008.05.082","article-title":"Kinetics of intermetallic compound layers and shear strength in Bi-bearing SnAgCu\/Cu soldering couples","volume":"473","author":"Zhao","year":"2009","journal-title":"J. Alloys Compd."}],"container-title":["Materials"],"original-title":[],"language":"en","link":[{"URL":"https:\/\/www.mdpi.com\/1996-1944\/14\/4\/776\/pdf","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2025,10,11]],"date-time":"2025-10-11T05:20:45Z","timestamp":1760160045000},"score":1,"resource":{"primary":{"URL":"https:\/\/www.mdpi.com\/1996-1944\/14\/4\/776"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2021,2,7]]},"references-count":38,"journal-issue":{"issue":"4","published-online":{"date-parts":[[2021,2]]}},"alternative-id":["ma14040776"],"URL":"https:\/\/doi.org\/10.3390\/ma14040776","relation":{},"ISSN":["1996-1944"],"issn-type":[{"value":"1996-1944","type":"electronic"}],"subject":[],"published":{"date-parts":[[2021,2,7]]}}}