{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,1,17]],"date-time":"2026-01-17T23:27:31Z","timestamp":1768692451673,"version":"3.49.0"},"reference-count":36,"publisher":"MDPI AG","issue":"10","license":[{"start":{"date-parts":[[2021,5,14]],"date-time":"2021-05-14T00:00:00Z","timestamp":1620950400000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/creativecommons.org\/licenses\/by\/4.0\/"}],"funder":[{"name":"the National Key R&amp;D Program of China","award":["2018YFF0215502"],"award-info":[{"award-number":["2018YFF0215502"]}]},{"name":"Guangxi Natural Science Foundation","award":["2020GXNSFBA297062, 2020GXNSFAA159093, 2018GXNSFDA050008"],"award-info":[{"award-number":["2020GXNSFBA297062, 2020GXNSFAA159093, 2018GXNSFDA050008"]}]},{"name":"National Natural Science Foundation of China","award":["51761002"],"award-info":[{"award-number":["51761002"]}]},{"name":"the Training Plan of High-Level Talents of Guangxi University","award":["XMPZ160714"],"award-info":[{"award-number":["XMPZ160714"]}]},{"name":"the Scientific research projects of the General Administration of Customs","award":["2020HK256"],"award-info":[{"award-number":["2020HK256"]}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["Materials"],"abstract":"<jats:p>Electrochemical corrosion behavior of ternary tin-zinc-yttrium (Sn-9Zn-xY) solder alloys were investigated in aerated 3.5 wt.% NaCl solution using potentiodynamic polarization techniques, and the microstructure evolution was obtained by scanning electron microscope (SEM). Eight different compositions of Sn-9Zn-xY (x = 0, 0.02, 0.04, 0.06, 0.08, 0.10, 0.20, and 0.30 wt.%) were compared by melting. The experimental results show that when the content of Y reached 0.06 wt.%, the grain size of Zn-rich phase became the smallest and the effect of grain refinement was the best, but there was no significant effect on the melting point. With the increases of Y content, the spreading ratio first increased and then decreased. When the content of Y was 0.06 wt.%, the Sn-9Zn-0.06Y solder alloy had the best wettability on the Cu substrate, which was increased by approximately 20% compared with Sn-9Zn. Besides, the electrochemical corrosion experimental shows that the Y can improve the corrosion resistance of Sn-9Zn system in 3.5 wt.% NaCl solution, and the corrosion resistance of the alloy is better when the amount of Y added is larger within 0.02\u20130.30 wt.%. Overall considering all performances, the optimal performance can be obtained when the addition amount of Y is 0.06.<\/jats:p>","DOI":"10.3390\/ma14102549","type":"journal-article","created":{"date-parts":[[2021,5,14]],"date-time":"2021-05-14T10:54:22Z","timestamp":1620989662000},"page":"2549","update-policy":"https:\/\/doi.org\/10.3390\/mdpi_crossmark_policy","source":"Crossref","is-referenced-by-count":4,"title":["Effects of Yttrium Addition on the Microstructure Evolution and Electrochemical Corrosion of SN-9Zn Lead-Free Solders Alloy"],"prefix":"10.3390","volume":"14","author":[{"ORCID":"https:\/\/orcid.org\/0000-0003-0153-4672","authenticated-orcid":false,"given":"Wenchao","family":"Yang","sequence":"first","affiliation":[{"name":"College of Materials Science and Engineering, Guangxi University, Nanning 530004, China"},{"name":"Guangxi Key Laboratory of Processing for Non-Ferrous Metals and Featured Materials, MOE Key Laboratory of New Processing Technology for Non-Ferrous Metals and Materials, Nanning 530004, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Jun","family":"Mao","sequence":"additional","affiliation":[{"name":"College of Materials Science and Engineering, Guangxi University, Nanning 530004, China"},{"name":"Guangxi Key Laboratory of Processing for Non-Ferrous Metals and Featured Materials, MOE Key Laboratory of New Processing Technology for Non-Ferrous Metals and Materials, Nanning 530004, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Yueyuan","family":"Ma","sequence":"additional","affiliation":[{"name":"College of Materials Science and Engineering, Guangxi University, Nanning 530004, China"},{"name":"Guangxi Key Laboratory of Processing for Non-Ferrous Metals and Featured Materials, MOE Key Laboratory of New Processing Technology for Non-Ferrous Metals and Materials, Nanning 530004, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Shuyuan","family":"Yu","sequence":"additional","affiliation":[{"name":"Shenzhen Customs Industrial Products Inspection Technology Center, Shenzhen 518067, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Hongping","family":"He","sequence":"additional","affiliation":[{"name":"College of Chemistry and Environmental Engineering, Shenzhen University, Shenzhen 518060, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Da","family":"Qi","sequence":"additional","affiliation":[{"name":"College of Materials Science and Engineering, Guangxi University, Nanning 530004, China"},{"name":"Guangxi Key Laboratory of Processing for Non-Ferrous Metals and Featured Materials, MOE Key Laboratory of New Processing Technology for Non-Ferrous Metals and Materials, Nanning 530004, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Yongzhong","family":"Zhan","sequence":"additional","affiliation":[{"name":"College of Materials Science and Engineering, Guangxi University, Nanning 530004, China"},{"name":"Guangxi Key Laboratory of Processing for Non-Ferrous Metals and Featured Materials, MOE Key Laboratory of New Processing Technology for Non-Ferrous Metals and Materials, Nanning 530004, China"}],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"1968","published-online":{"date-parts":[[2021,5,14]]},"reference":[{"key":"ref_1","doi-asserted-by":"crossref","first-page":"55","DOI":"10.1016\/S1359-0286(00)00036-X","article-title":"Advances in lead-free electronics soldering","volume":"5","author":"Suganuma","year":"2001","journal-title":"Curr. 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Des."}],"container-title":["Materials"],"original-title":[],"language":"en","link":[{"URL":"https:\/\/www.mdpi.com\/1996-1944\/14\/10\/2549\/pdf","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2025,10,11]],"date-time":"2025-10-11T06:00:45Z","timestamp":1760162445000},"score":1,"resource":{"primary":{"URL":"https:\/\/www.mdpi.com\/1996-1944\/14\/10\/2549"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2021,5,14]]},"references-count":36,"journal-issue":{"issue":"10","published-online":{"date-parts":[[2021,5]]}},"alternative-id":["ma14102549"],"URL":"https:\/\/doi.org\/10.3390\/ma14102549","relation":{},"ISSN":["1996-1944"],"issn-type":[{"value":"1996-1944","type":"electronic"}],"subject":[],"published":{"date-parts":[[2021,5,14]]}}}