{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,9,28]],"date-time":"2026-09-28T23:34:49Z","timestamp":1790638489150,"version":"4.1.0"},"reference-count":37,"publisher":"MDPI AG","issue":"15","license":[{"start":{"date-parts":[[2021,7,31]],"date-time":"2021-07-31T00:00:00Z","timestamp":1627689600000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/creativecommons.org\/licenses\/by\/4.0\/"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["Materials"],"abstract":"<jats:p>Al\u2013Cu composites have attracted significant interest recently owing to their lightweight nature and remarkable thermal properties. Understanding the interdiffusion mechanism at the numerous Al\/Cu interfaces is crucial to obtain Al\u2013Cu composites with high thermal conductivities. The present study systematically investigates the interdiffusion mechanism at Al\/Cu interfaces in relation to the process temperature. Al-50vol.%Cu composite powder, where Cu particles were encapsulated in a matrix of irregular Al particles, was prepared and then sintered at various temperatures from 340 to 500 \u00b0C. Intermetallic compounds (ICs) such as CuAl2 and Cu9Al4 were formed at the Al\/Cu interfaces during sintering. Microstructural analysis showed that the thickness of the interdiffusion layer, which comprised the CuAl2 and Cu9Al4 ICs, drastically increased above 400 \u00b0C. The Vickers hardness of the Al-50vol.%Cu composite sintered at 380 \u00b0C was 79 HV, which was 1.5 times that of the value estimated by the rule of mixtures. A high thermal conductivity of 150 W\u2219m\u22121\u2219K\u22121 was simultaneously obtained. This result suggests that the Al-50vol.%Cu composite material with large number of Al\/Cu interfaces, as well as good mechanical strength and heat conductance, can be prepared by solid-state sintering at a low temperature.<\/jats:p>","DOI":"10.3390\/ma14154307","type":"journal-article","created":{"date-parts":[[2021,8,1]],"date-time":"2021-08-01T21:44:32Z","timestamp":1627854272000},"page":"4307","update-policy":"https:\/\/doi.org\/10.3390\/mdpi_crossmark_policy","source":"Crossref","is-referenced-by-count":15,"title":["Interdiffusion and Intermetallic Compounds at Al\/Cu Interfaces in Al-50vol.%Cu Composite Prepared by Solid-State Sintering"],"prefix":"10.3390","volume":"14","author":[{"ORCID":"https:\/\/orcid.org\/0000-0002-9129-1856","authenticated-orcid":false,"given":"Dasom","family":"Kim","sequence":"first","affiliation":[{"name":"Department of Materials System Engineering, Pukyong National University, Busan 48547, Korea"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-9001-0776","authenticated-orcid":false,"given":"Kyungju","family":"Kim","sequence":"additional","affiliation":[{"name":"The Industrial Science Technology Research Center, Pukyong National University, Busan 48547, Korea"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Hansang","family":"Kwon","sequence":"additional","affiliation":[{"name":"Department of Materials System Engineering, Pukyong National University, Busan 48547, Korea"},{"name":"Department of R&D, Next Generation Materials Co., Ltd., Busan 48547, Korea"}],"role":[{"vocabulary":"crossref","role":"author"}]}],"member":"1968","published-online":{"date-parts":[[2021,7,31]]},"reference":[{"key":"ref_1","doi-asserted-by":"crossref","first-page":"787","DOI":"10.1016\/j.matchemphys.2012.12.062","article-title":"Investigation of the interfacial phases formed between carbon nanotubes and aluminum in a bulk material","volume":"138","author":"Kwon","year":"2013","journal-title":"Mater. 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