{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,9,2]],"date-time":"2026-09-02T05:37:47Z","timestamp":1788327467814,"version":"build-2803163510"},"reference-count":41,"publisher":"MDPI AG","issue":"21","license":[{"start":{"date-parts":[[2021,10,25]],"date-time":"2021-10-25T00:00:00Z","timestamp":1635120000000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/creativecommons.org\/licenses\/by\/4.0\/"}],"funder":[{"DOI":"10.13039\/501100005357","name":"Slovak Research and Development Agency","doi-asserted-by":"publisher","award":["APVV-17-0025"],"award-info":[{"award-number":["APVV-17-0025"]}],"id":[{"id":"10.13039\/501100005357","id-type":"DOI","asserted-by":"publisher"}]},{"name":"Agency of the Ministry of Education of the Slovak Republic and of Slovak Academy of Sciences","award":["VEGA 1\/0303\/20"],"award-info":[{"award-number":["VEGA 1\/0303\/20"]}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["Materials"],"abstract":"<jats:p>The aim of this research was to characterize soldering alloys of the type Sn\u2013Sb\u2013Ti and to study the ultrasonic soldering of SiC ceramics with a metal\u2013ceramic composite of the type Cu\u2013SiC. The Sn5Sb3Ti solder exerts a thermal transformation of a peritectic character with an approximate melting point of 234 \u00b0C and a narrow melting interval. The solder microstructure consists of a tin matrix, where the acicular constituents of the Ti6(Sb,Sn)5 phase and the sharp-edged constituents of the TiSbSn phase are precipitated. The tensile strength of the soldering alloy depends on the Ti content and reaches values from 34 to 51 MPa. The average strength of the solder increases with increasing Ti content. The bond with SiC ceramics is formed owing to the interaction of titanium, activated by ultrasound, with SiC ceramics, forming the (Ti,Si)6(Sb,Sn)5 reaction product. The bond with the metal\u2013ceramic composite Cu\u2013SiC is formed owing to the solubility of Cu in a tin solder forming two phases: the wettable \u03b7-Cu6Sn5 phase, formed in contact with the solder, and the non-wettable \u03b5-Cu3Sn phase, formed in contact with the copper composite. The average shear strength of the combined joint of SiC\/Cu\u2013SiC fabricated using the Sn5Sb3Ti solder was 42.5 MPa. The Sn\u2013Sb\u2013Ti solder is a direct competitor of the S-Bond active solder. The production of solders is cheaper, and the presence of antimony increases their strength. In addition, the application temperature range is wider.<\/jats:p>","DOI":"10.3390\/ma14216369","type":"journal-article","created":{"date-parts":[[2021,10,25]],"date-time":"2021-10-25T21:42:05Z","timestamp":1635198125000},"page":"6369","update-policy":"https:\/\/doi.org\/10.3390\/mdpi_crossmark_policy","source":"Crossref","is-referenced-by-count":18,"title":["Characterization of Sn\u2013Sb\u2013Ti Solder Alloy and the Study of Its Use for the Ultrasonic Soldering Process of SiC Ceramics with a Cu\u2013SiC Metal\u2013Ceramic Composite"],"prefix":"10.3390","volume":"14","author":[{"given":"Roman","family":"Kolenak","sequence":"first","affiliation":[{"name":"Faculty of Materials Science and Technology in Trnava, Slovak University of Technology in Bratislava, J\u00e1na Bottu \u010d. 2781\/25, 917 24 Trnava, Slovakia"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0003-4692-0198","authenticated-orcid":false,"given":"Igor","family":"Kostolny","sequence":"additional","affiliation":[{"name":"Faculty of Materials Science and Technology in Trnava, Slovak University of Technology in Bratislava, J\u00e1na Bottu \u010d. 2781\/25, 917 24 Trnava, Slovakia"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Jaromir","family":"Drapala","sequence":"additional","affiliation":[{"name":"FMT\u2014Faculty of Materials Science and Technology, Technical University of Ostrava, 17. Listopadu 15, 708 33 Ostrava, Czech Republic"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Paulina","family":"Babincova","sequence":"additional","affiliation":[{"name":"Faculty of Materials Science and Technology in Trnava, Slovak University of Technology in Bratislava, J\u00e1na Bottu \u010d. 2781\/25, 917 24 Trnava, Slovakia"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0001-8342-3727","authenticated-orcid":false,"given":"Matej","family":"Pasak","sequence":"additional","affiliation":[{"name":"Faculty of Materials Science and Technology in Trnava, Slovak University of Technology in Bratislava, J\u00e1na Bottu \u010d. 2781\/25, 917 24 Trnava, Slovakia"}],"role":[{"vocabulary":"crossref","role":"author"}]}],"member":"1968","published-online":{"date-parts":[[2021,10,25]]},"reference":[{"key":"ref_1","unstructured":"Benda, V., Grant, D.A., and Gowar, J. (1999). 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