{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,4,27]],"date-time":"2026-04-27T15:52:54Z","timestamp":1777305174910,"version":"3.51.4"},"reference-count":31,"publisher":"MDPI AG","issue":"21","license":[{"start":{"date-parts":[[2022,10,27]],"date-time":"2022-10-27T00:00:00Z","timestamp":1666828800000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/creativecommons.org\/licenses\/by\/4.0\/"}],"funder":[{"DOI":"10.13039\/501100012166","name":"National Key R&amp;D Program of China","doi-asserted-by":"publisher","award":["2016YFB1100800"],"award-info":[{"award-number":["2016YFB1100800"]}],"id":[{"id":"10.13039\/501100012166","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100012166","name":"National Key R&amp;D Program of China","doi-asserted-by":"publisher","award":["2016YFB0303000"],"award-info":[{"award-number":["2016YFB0303000"]}],"id":[{"id":"10.13039\/501100012166","id-type":"DOI","asserted-by":"publisher"}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["Materials"],"abstract":"<jats:p>Copper nanoparticle (Cu NP) is a promising replacement for noble metal nanoparticles due to its high electrical conductivity and low cost. However, Cu NPs are relatively active compared to noble metals, and current ways of protecting Cu NPs from oxidation by encapsulation have severe drawbacks, such as a long reaction time and complicated processes. Here, a facial and effective method to prepare the mesosphere of carbon-shelled copper nanoparticles (Cu@MC) was demonstrated, and the resulting Cu@MC was both highly electrically conductive and thermally stable. Cu@organic (100 nm) was first synthesized by the reduction of Cu ions with poly (vinyl pyrrolidone) (PVP) and sodium poly ((naphthalene-formaldehyde) sulfonate) (Na-PNFS) as soft templates. Then, the carbon shells were obtained by in situ carbonization of the polymer soft templates. The Cu@organic and Cu@MC showed an anti-oxidation ability up to 175 and 250 \u00b0C in the air atmosphere, respectively. Furthermore, the Cu@MC exhibited excellent volume resistivity of 7.2 \u00d7 10\u22123 \u03a9\u00b7cm under 20 MPa, and showed promising application potential in electric sensors and devices.<\/jats:p>","DOI":"10.3390\/ma15217536","type":"journal-article","created":{"date-parts":[[2022,10,27]],"date-time":"2022-10-27T22:36:17Z","timestamp":1666910177000},"page":"7536","update-policy":"https:\/\/doi.org\/10.3390\/mdpi_crossmark_policy","source":"Crossref","is-referenced-by-count":4,"title":["Mesosphere of Carbon-Shelled Copper Nanoparticles with High Conductivity and Thermal Stability via Direct Carbonization of Polymer Soft Templates"],"prefix":"10.3390","volume":"15","author":[{"given":"Min","family":"Huang","sequence":"first","affiliation":[{"name":"School of Material Science and Engineering, Central South University, Changsha 410083, China"},{"name":"Institute of Chemistry, Chinese Academy of Sciences, Beijing 100190, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Xinyu","family":"Cao","sequence":"additional","affiliation":[{"name":"Institute of Chemistry, Chinese Academy of Sciences, Beijing 100190, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Jingnan","family":"Zhang","sequence":"additional","affiliation":[{"name":"Institute of Chemistry, Chinese Academy of Sciences, Beijing 100190, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Huiqun","family":"Liu","sequence":"additional","affiliation":[{"name":"School of Material Science and Engineering, Central South University, Changsha 410083, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Jiaxin","family":"Lu","sequence":"additional","affiliation":[{"name":"Institute of Chemistry, Chinese Academy of Sciences, Beijing 100190, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Danqing","family":"Yi","sequence":"additional","affiliation":[{"name":"School of Material Science and Engineering, Central South University, Changsha 410083, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Yongmei","family":"Ma","sequence":"additional","affiliation":[{"name":"Institute of Chemistry, Chinese Academy of Sciences, Beijing 100190, China"}],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"1968","published-online":{"date-parts":[[2022,10,27]]},"reference":[{"key":"ref_1","doi-asserted-by":"crossref","first-page":"4626","DOI":"10.3390\/ma3094626","article-title":"Copper Nanoparticles for Printed Electronics: Routes Towards Achieving Oxidation Stability","volume":"3","author":"Magdassi","year":"2010","journal-title":"Materials"},{"key":"ref_2","doi-asserted-by":"crossref","first-page":"455601","DOI":"10.1088\/0957-4484\/26\/45\/455601","article-title":"Cu-Ag core\u2013shell nanoparticles with enhanced oxidation stability for printed electronics","volume":"26","author":"Lee","year":"2015","journal-title":"Nanotechnology"},{"key":"ref_3","doi-asserted-by":"crossref","first-page":"26324","DOI":"10.1021\/jp506069c","article-title":"Ag\u2013Cu bimetallic nanoparticles with enhanced resistance to oxidation, a combined experi-mental and theoretical study","volume":"18","author":"Kim","year":"2014","journal-title":"J. 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