{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,9,5]],"date-time":"2026-09-05T01:11:54Z","timestamp":1788570714869,"version":"build-2803163510"},"reference-count":46,"publisher":"MDPI AG","issue":"1","license":[{"start":{"date-parts":[[2022,12,22]],"date-time":"2022-12-22T00:00:00Z","timestamp":1671667200000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/creativecommons.org\/licenses\/by\/4.0\/"}],"funder":[{"name":"Ministry of Education (MoE), Malaysia","award":["FRGS\/1\/2019\/TK05\/UNIMAP\/03\/3"],"award-info":[{"award-number":["FRGS\/1\/2019\/TK05\/UNIMAP\/03\/3"]}]},{"name":"Ministry of Education (MoE), Malaysia","award":["MedTech_8\/2022"],"award-info":[{"award-number":["MedTech_8\/2022"]}]},{"name":"TUIASI","award":["FRGS\/1\/2019\/TK05\/UNIMAP\/03\/3"],"award-info":[{"award-number":["FRGS\/1\/2019\/TK05\/UNIMAP\/03\/3"]}]},{"name":"TUIASI","award":["MedTech_8\/2022"],"award-info":[{"award-number":["MedTech_8\/2022"]}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["Materials"],"abstract":"<jats:p>This paper elucidates the influence of dimple-microtextured copper substrate on the performance of Sn-0.7Cu solder alloy. A dimple with a diameter of 50 \u00b5m was produced by varying the dimple depth using different laser scanning repetitions, while the dimple spacing was fixed for each sample at 100 \u00b5m. The dimple-microtextured copper substrate was joined with Sn-0.7Cu solder alloy using the reflow soldering process. The solder joints\u2019 wettability, microstructure, and growth of its intermetallic compound (IMC) layer were analysed to determine the influence of the dimple-microtextured copper substrate on the performance of the Sn-0.7Cu solder alloy. It was observed that increasing laser scan repetitions increased the dimples\u2019 depth, resulting in higher surface roughness. In terms of soldering performance, it was seen that the solder joints\u2019 average contact angle decreased with increasing dimple depth, while the average IMC thickness increased as the dimple depth increased. The copper element was more evenly distributed for the dimple-micro-textured copper substrate than its non-textured counterpart.<\/jats:p>","DOI":"10.3390\/ma16010096","type":"journal-article","created":{"date-parts":[[2022,12,23]],"date-time":"2022-12-23T03:55:21Z","timestamp":1671767721000},"page":"96","update-policy":"https:\/\/doi.org\/10.3390\/mdpi_crossmark_policy","source":"Crossref","is-referenced-by-count":5,"title":["Effectiveness of Dimple Microtextured Copper Substrate on Performance of Sn-0.7Cu Solder Alloy"],"prefix":"10.3390","volume":"16","author":[{"given":"Siti Faqihah","family":"Roduan","sequence":"first","affiliation":[{"name":"Faculty of Chemical Engineering and Technology, Kompleks Pusat Pengajian Jejawi 2, Universiti Malaysia Perlis (UniMAP), Arau 02600, Malaysia"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-8234-1364","authenticated-orcid":false,"given":"Juyana A.","family":"Wahab","sequence":"additional","affiliation":[{"name":"Faculty of Chemical Engineering and Technology, Kompleks Pusat Pengajian Jejawi 2, Universiti Malaysia Perlis (UniMAP), Arau 02600, Malaysia"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Mohd Arif Anuar Mohd","family":"Salleh","sequence":"additional","affiliation":[{"name":"Faculty of Chemical Engineering and Technology, Kompleks Pusat Pengajian Jejawi 2, Universiti Malaysia Perlis (UniMAP), Arau 02600, Malaysia"},{"name":"Geopolymer and Green Technology, Centre of Excellence (CEGeoGTech), Universiti Malaysia Perlis (UniMAP), Arau 02600, Malaysia"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Nurul Aida Husna Mohd","family":"Mahayuddin","sequence":"additional","affiliation":[{"name":"Faculty of Chemical Engineering and Technology, Kompleks Pusat Pengajian Jejawi 2, Universiti Malaysia Perlis (UniMAP), Arau 02600, Malaysia"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Mohd Mustafa Al Bakri","family":"Abdullah","sequence":"additional","affiliation":[{"name":"Faculty of Chemical Engineering and Technology, Kompleks Pusat Pengajian Jejawi 2, Universiti Malaysia Perlis (UniMAP), Arau 02600, Malaysia"},{"name":"Geopolymer and Green Technology, Centre of Excellence (CEGeoGTech), Universiti Malaysia Perlis (UniMAP), Arau 02600, Malaysia"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Aiman Bin Mohd","family":"Halil","sequence":"additional","affiliation":[{"name":"Faculty of Mechanical and Automotive Engineering Technology, Universiti Malaysia Pahang, Pekan 26600, Malaysia"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Amira Qistina Syamimi","family":"Zaifuddin","sequence":"additional","affiliation":[{"name":"Faculty of Mechanical and Automotive Engineering Technology, Universiti Malaysia Pahang, Pekan 26600, Malaysia"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Mahadzir Ishak","family":"Muhammad","sequence":"additional","affiliation":[{"name":"Faculty of Mechanical and Automotive Engineering Technology, Universiti Malaysia Pahang, Pekan 26600, Malaysia"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-9292-749X","authenticated-orcid":false,"given":"Andrei Victor","family":"Sandu","sequence":"additional","affiliation":[{"name":"Department of Technologies and Equipments for Materials Processing, Faculty of Materials Science and Engineering, Gheorghe Asachi Technical University of Ia\u015fi, Blvd. Mangeron, No. 51, 700050 Iasi, Romania"},{"name":"Romanian Inventors Forum, Str. Sf. P. Movila 3, 700089 Iasi, Romania"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-5278-8958","authenticated-orcid":false,"given":"M\u0103d\u0103lina Simona","family":"Baltatu","sequence":"additional","affiliation":[{"name":"Department of Technologies and Equipments for Materials Processing, Faculty of Materials Science and Engineering, Gheorghe Asachi Technical University of Ia\u015fi, Blvd. Mangeron, No. 51, 700050 Iasi, Romania"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-3593-9400","authenticated-orcid":false,"given":"Petrica","family":"Vizureanu","sequence":"additional","affiliation":[{"name":"Department of Technologies and Equipments for Materials Processing, Faculty of Materials Science and Engineering, Gheorghe Asachi Technical University of Ia\u015fi, Blvd. Mangeron, No. 51, 700050 Iasi, Romania"},{"name":"National Institute for Research and Development in Environmental Protection INCDPM, Splaiul Independentei 294, 060031 Bucharest, Romania"},{"name":"Technical Sciences Academy of Romania, Dacia Blvd. 26, 030167 Bucharest, Romania"}],"role":[{"vocabulary":"crossref","role":"author"}]}],"member":"1968","published-online":{"date-parts":[[2022,12,22]]},"reference":[{"key":"ref_1","doi-asserted-by":"crossref","first-page":"104","DOI":"10.1016\/j.proeng.2015.12.358","article-title":"What can we learn from biological systems when applying the law of system completeness?","volume":"131","author":"Cohen","year":"2015","journal-title":"Procedia Eng."},{"key":"ref_2","doi-asserted-by":"crossref","first-page":"153","DOI":"10.1016\/j.jmapro.2020.02.009","article-title":"Laser surface texturing and related techniques for enhancing tribological performance of engineering materials: A review","volume":"53","author":"Mao","year":"2020","journal-title":"J. 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