{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,11,26]],"date-time":"2025-11-26T15:57:43Z","timestamp":1764172663933,"version":"build-2065373602"},"reference-count":41,"publisher":"MDPI AG","issue":"4","license":[{"start":{"date-parts":[[2025,2,18]],"date-time":"2025-02-18T00:00:00Z","timestamp":1739836800000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/creativecommons.org\/licenses\/by\/4.0\/"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["Materials"],"abstract":"<jats:p>This study investigates the fabrication of nanostructured chromium thin films via selective dissolution of PVD-deposited Cu\u2013Cr thin films. The effects of the deposition parameters on the structural, chemical, and morphological properties of the films are systematically analyzed. Starting from a thin film composed of 50 wt.% chromium and 50 wt.% copper, deposited onto a substrate pre-heated to 300 \u00b0C, we demonstrate that the following dealloying process carried out in a diluted nitric acid solution yields nanostructured chromium films with high porosity, large surface area, enhanced wettability and neglectable copper content. These findings underline the critical influence of the deposition temperature and alloy composition on achieving optimal film properties.<\/jats:p>","DOI":"10.3390\/ma18040894","type":"journal-article","created":{"date-parts":[[2025,2,18]],"date-time":"2025-02-18T12:16:37Z","timestamp":1739880997000},"page":"894","update-policy":"https:\/\/doi.org\/10.3390\/mdpi_crossmark_policy","source":"Crossref","is-referenced-by-count":1,"title":["Nanostructured Chromium PVD Thin Films Fabricated Through Copper\u2013Chromium Selective Dissolution"],"prefix":"10.3390","volume":"18","author":[{"ORCID":"https:\/\/orcid.org\/0000-0002-7216-1271","authenticated-orcid":false,"given":"Stefano Mauro","family":"Martinuzzi","sequence":"first","affiliation":[{"name":"Department of Industrial Engineering, University of Florence (DIEF), Via di Santa Marta n. 3, 50139 Firenze, FI, Italy"},{"name":"National Interuniversity Consortium of Materials Science and Technology (INSTM), Via Giuseppe Giusti n. 9, 50121 Firenze, FI, Italy"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-5673-0462","authenticated-orcid":false,"given":"Stefano","family":"Caporali","sequence":"additional","affiliation":[{"name":"Department of Industrial Engineering, University of Florence (DIEF), Via di Santa Marta n. 3, 50139 Firenze, FI, Italy"},{"name":"National Interuniversity Consortium of Materials Science and Technology (INSTM), Via Giuseppe Giusti n. 9, 50121 Firenze, FI, Italy"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Rosa","family":"Taurino","sequence":"additional","affiliation":[{"name":"Department of Industrial Engineering, University of Florence (DIEF), Via di Santa Marta n. 3, 50139 Firenze, FI, Italy"},{"name":"National Interuniversity Consortium of Materials Science and Technology (INSTM), Via Giuseppe Giusti n. 9, 50121 Firenze, FI, Italy"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Lapo","family":"Gabellini","sequence":"additional","affiliation":[{"name":"National Interuniversity Consortium of Materials Science and Technology (INSTM), Via Giuseppe Giusti n. 9, 50121 Firenze, FI, Italy"},{"name":"Department of Chemistry \u201cUgo Schiff\u201d, University of Florence (DICUS), Via della Lastruccia n. 13, 50019 Sesto Fiorentino, FI, Italy"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0000-0001-8200-4301","authenticated-orcid":false,"given":"Enrico","family":"Berretti","sequence":"additional","affiliation":[{"name":"Institute of Chemistry of OrganoMetallic Compounds (ICCOM), National Research Council (CNR), Via Madonna del Piano n. 10, 50019 Sesto Fiorentino, FI, Italy"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Eric","family":"Schmeer","sequence":"additional","affiliation":[{"name":"Department of Industrial Engineering, University of Florence (DIEF), Via di Santa Marta n. 3, 50139 Firenze, FI, Italy"},{"name":"National Interuniversity Consortium of Materials Science and Technology (INSTM), Via Giuseppe Giusti n. 9, 50121 Firenze, FI, Italy"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0000-0001-5060-859X","authenticated-orcid":false,"given":"Nicola","family":"Calisi","sequence":"additional","affiliation":[{"name":"Department of Industrial Engineering, University of Florence (DIEF), Via di Santa Marta n. 3, 50139 Firenze, FI, Italy"},{"name":"National Interuniversity Consortium of Materials Science and Technology (INSTM), Via Giuseppe Giusti n. 9, 50121 Firenze, FI, Italy"}],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"1968","published-online":{"date-parts":[[2025,2,18]]},"reference":[{"key":"ref_1","doi-asserted-by":"crossref","first-page":"016501","DOI":"10.1088\/0034-4885\/75\/1\/016501","article-title":"CVD of Polymeric Thin Films: Applications in Sensors, Biotechnology, Microelectronics\/Organic Electronics, Microfluidics, MEMS, Composites and Membranes","volume":"75","author":"Coclite","year":"2012","journal-title":"Rep. 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